A method for solvent-free perovskite deposition. The method comprises loading a lead target and one or more samples adhered to a substrate holder into a deposition chamber, pumping down to a high vacuum pressure, and backfilling the deposition chamber with the vapor of a salt precursor to form a perovskite material.

A method for solvent-free perovskite deposition. The method comprises loading a lead target and one or more samples adhered to a substrate holder into a deposition chamber, pumping down to a high vacuum pressure, and backfilling the deposition chamber with the vapor of a salt precursor to form a perovskite material.

A method and a support for holding a substrate, wherein the support is included in a transportation system configured to transport the substrate. The method includes attaching an adhesive to the support, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the substrate to the support; and attaching the adhesive to the substrate. Moreover, the thickness of the substrate is about 0.3 mm or less, and/or wherein the substrate has a size of 1.4 m.sup.2 or more. The support includes a support body and an adhesive, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the support body to the substrate, wherein the support is included in a transportation system configured to transport the substrate.

A method and a support for holding a substrate, wherein the support is included in a transportation system configured to transport the substrate. The method includes attaching an adhesive to the support, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the substrate to the support; and attaching the adhesive to the substrate. Moreover, the thickness of the substrate is about 0.3 mm or less, and/or wherein the substrate has a size of 1.4 m.sup.2 or more. The support includes a support body and an adhesive, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the support body to the substrate, wherein the support is included in a transportation system configured to transport the substrate.

A halftone phase shift mask blank comprising a transparent substrate and a halftone phase shift film thereon is prepared through the step of depositing the halftone phase shift film on the substrate by using a sputtering gas containing rare gas and nitrogen gas, and plural targets including at least two silicon targets, applying powers of different values to the silicon targets, effecting reactive sputtering, and rotating the substrate on its axis in a horizontal direction. The halftone phase shift film has satisfactory in-plane uniformity of optical properties.

A deposition system includes a system housing having a housing interior, a fixture transfer assembly having a generally sloped fixture transfer rail extending through the housing interior, a plurality of sequentially ordered deposition chambers connected by the fixture transfer rail, a controller interfacing with the processing chambers and at least one fixture carrier assembly carried by the fixture transfer rail and adapted to contain at least one substrate. The fixture carrier assembly travels along the fixture transfer rail under influence of gravity. A substrate fixture contains a substrate. The substrate fixture comprises a fixture frame. The fixture frame is defined by multiple circular members adjacently joined in a circular arrangement. Each circular member has a fixture frame opening sized to receive the substrate. Lens support arms may integrate into the circular members, extending in a curved disposition into the fixture frame opening to retain the substrate. A deposition method is also disclosed.

A deposition method of arranging a discharge portion of a striker near a target to induce arc discharge and forming a film on a substrate using a plasma generated by the arc discharge is disclosed. The method includes a changing step of changing a position for inducing the arc discharge by the striker in a region set in the target, a deposition step of forming the film on the substrate using the plasma generated by inducing the arc discharge at the position, and a reduction step of reducing the region in accordance with use of the target.

An electron beam vapor deposition process for depositing coatings comprises placing a source coating material in a crucible of a vapor deposition apparatus having a coating chamber; pressurizing said coating chamber from about 0.5 microbar to about 40 microbar; heating a work piece surface to a temperature of from 1800 degrees Fahrenheit to 2000 degrees Fahrenheit; energizing said source coating with an electron beam that delivers a power density to the material in the crucible forming a vapor cloud from said source coating material; and depositing said source coating material onto a surface of a work piece.

A deposition apparatus for coating a flexible substrate is described. The deposition apparatus includes a first spool chamber housing a storage spool for providing the flexible substrate, a deposition chamber arranged downstream from the first spool chamber, and a second spool chamber arranged downstream from the deposition chamber and housing a wind-up spool for winding the flexible substrate thereon after deposition. The deposition chamber includes a coating drum for guiding the flexible substrate past a plurality of deposition units including at least one deposition unit having a graphite target. Further, the deposition chamber includes a coating treatment device configured to densify a layer deposited on the flexible substrate.

Sputtering systems and methods for packaging applications. In some embodiments, a method for processing a plurality of packaged devices can include forming or providing a first assembly having a stencil and a two-sided adhesive member attached to a first side of the stencil, with the stencil having a plurality of openings, and the two-sided adhesive member having a plurality of openings corresponding to the openings of the stencil. The method can further include attaching the first assembly to a ring to provide a second assembly, with the ring being dimensioned to facilitate a deposition process. The method can further include loading a plurality of packaged devices onto the second assembly such that each packaged device is held by the two-sided adhesive member of the first assembly and a portion of each packaged device extends into the corresponding opening of the two-sided adhesive member.