The disclosure relates to a method of determining a velocity profile for the movement of a substrate to be coated relative to a coating source.

A vapor deposition system fixture comprises an arm, a rake, a crown gear bearing assembly, a workpiece holder, a thermocouple, and a contact ring assembly. The crown gear bearing assembly is attached to and rotatably engaged with the rake and includes stationary portion and rotating portions. The workpiece holder is configured to rotate with the rotating portion. The thermocouple is configured to rotate with the workpiece holder. The contact ring assembly comprises a housing, a cover, first and second rotating contact rings, and first and second stationary contact rings. The housing is attached to at least one of the arm and the rake. The first and second rotating contact rings are electrically connected to the thermocouple. The first and second stationary contact rings surround the rotating ring. The first and second stationary contact rings are configured to receive an electrical signal from the first and second rotating contact rings.

A film formation apparatus according to an embodiment comprising: a substrate holder for holding a substrate in a standing position relative to the horizontal plane, the substrate having a vapor deposition surface on which a vapor deposition layer is formed; and an evaporation source to supply a vapor deposition material onto the vapor deposition surface while moving relative to the substrate holder upward and/or downward, the evaporation source being disposed in a region which the vapor deposition surface of the substrate held by the substrate holder is to face. The substrate holder is configured to hold the substrate in an inclined orientation relative to the vertical plane such that the upper end of the substrate is located away from the evaporation source. The apparatus further comprises an adjustment means for reducing a variation in the thickness of the vapor deposition layer, which results from the inclination of the substrate.

A film formation apparatus according to an embodiment comprising: a substrate holder for holding a substrate in a standing position relative to the horizontal plane, the substrate having a vapor deposition surface on which a vapor deposition layer is formed; and an evaporation source to supply a vapor deposition material onto the vapor deposition surface while moving relative to the substrate holder upward and/or downward, the evaporation source being disposed in a region which the vapor deposition surface of the substrate held by the substrate holder is to face. The substrate holder is configured to hold the substrate in an inclined orientation relative to the vertical plane such that the upper end of the substrate is located away from the evaporation source. The apparatus further comprises an adjustment means for reducing a variation in the thickness of the vapor deposition layer, which results from the inclination of the substrate.

In one aspect, a system for depositing a film on a substrate is disclosed, which comprises at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive species. The system further includes an inner cooling cylinder and a substrate cylinder, where the inner cooling cylinder is fixedly positioned relative to the substrate cylinder, and the substrate cylinder at least partially surrounds the inner cooling cylinder. At least one mount is coupled to the substrate cylinder for mounting one or more substrates to the substrate cylinder.

In one aspect, a system for depositing a film on a substrate is disclosed, which comprises at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive species. The system further includes an inner cooling cylinder and a substrate cylinder, where the inner cooling cylinder is fixedly positioned relative to the substrate cylinder, and the substrate cylinder at least partially surrounds the inner cooling cylinder. At least one mount is coupled to the substrate cylinder for mounting one or more substrates to the substrate cylinder.

The present disclosure provides a vacuum heating device including: a vacuum chamber; a plurality of heating units each provided in the vacuum chamber to heat a tray; and a nitrogen gas generator unit configured to be in fluid communication with the vacuum chamber.

The present disclosure provides a vacuum heating device including: a vacuum chamber; a plurality of heating units each provided in the vacuum chamber to heat a tray; and a nitrogen gas generator unit configured to be in fluid communication with the vacuum chamber.

A method and an apparatus for fabricating a display panel are provided. The method comprises steps of: providing a substrate; transferring the substrate to a coating chamber; clamping end edge positions of the substrate with clamps; performing a coating operation; and releasing the clamps and transferring the substrate out of the coating chamber. The apparatus comprises a guide rail device for transporting a substrate, and a clamp device for clamping and fixing the substrate, and the guide rail device is movably connected to the clamp device, and the clamp device is provided with clamps for clamping the substrate, and the clamps are placed at positions corresponding to end edges of the substrate. Since the clamps clamp the end edge positions of the substrate, force bearing points can be effectively dispersed, and the substrate can be effectively fixed and its movement limited, effectively preventing the substrate from falling.

Methods and apparatus for a magnetized substrate carrier apparatus are described herein. In some embodiments, a substrate carrier apparatus includes: a carrier plate having a support surface to support a substrate, a mask assembly disposed above the support surface, wherein the mask assembly includes an annular frame and a shadow mask disposed within the annular frame, and wherein the shadow mask includes one or more openings arranged in a predetermined pattern and disposed through the shadow mask, and one or more magnets disposed on or embedded within at least one of the carrier plate and the shadow mask to create a magnetic field above the support surface.