A process apparatus includes an electrostatic chuck disposed at a substrate holder. The electrostatic chuck includes a dielectric and an electrode. The electrode is disposed in an interior of the dielectric. The apparatus further includes a circuit electrically connected to the electrode of the electrostatic chuck and a first earth wire electrically connected to the circuit. The first earth wire is shielded by a metal with an electrically insulating cover interposed.

What is specified is a method for producing a coating comprising the following steps: providing a material source having a top surface and a main coating direction, providing a substrate holder having a top surface, providing at least one base layer, having a coating surface remote from the substrate holder, on the top surface of the substrate, attaching the substrate holder to a rotating arm, which has a length along a main direction of extent of the rotating arm, setting the length of the rotating arm in such a manner that a normal angle () throughout the method is at least 30 and at most 75, applying at least one coating to that side of the base layer which has the coating surface by means of the material source, whereinduring the coating process with the coating, the substrate holder is rotated about a substrate axis of rotation running along the main direction of extent of the rotating arm.

A vacuum processing apparatus having a small installation area is provided. A lifting plate is arranges inside a vacuum chamber, and a substrate holding device is arranged on the lifting plate to be able to be lifted up and down. An upper side processing device and a lower side processing device are provided in a processing region located beside a lifting region where the lifting plate moves up and down. An upper side moving device and a lower side moving device make the substrate holding device pass through the processing region, and a transfer device transfers the substrate holding device between the upper side moving device or the lower side moving device and the lifting plate. Because vacuum processing can be performed on the upper side and the lower side, the installation area of the vacuum processing apparatus is small.

A vacuum processing apparatus having a small installation area is provided. A lifting plate is arranges inside a vacuum chamber, and a substrate holding device is arranged on the lifting plate to be able to be lifted up and down. An upper side processing device and a lower side processing device are provided in a processing region located beside a lifting region where the lifting plate moves up and down. An upper side moving device and a lower side moving device make the substrate holding device pass through the processing region, and a transfer device transfers the substrate holding device between the upper side moving device or the lower side moving device and the lifting plate. Because vacuum processing can be performed on the upper side and the lower side, the installation area of the vacuum processing apparatus is small.

A reactor system and related methods are provided which may include a heating element in a wafer tray. The heating element may be used to heat the wafer tray and a substrate or wafer seated on the wafer tray within a reaction chamber assembly, and may be used to cause sublimation of a native oxide of the wafer.

A reactor system and related methods are provided which may include a heating element in a wafer tray. The heating element may be used to heat the wafer tray and a substrate or wafer seated on the wafer tray within a reaction chamber assembly, and may be used to cause sublimation of a native oxide of the wafer.

An apparatus for depositing a metal film on a surface of a three-dimensional object, includes a mounting drum rotatably disposed inside a chamber and having a circumferential surface onto which a plurality of three-dimensional objects is settled and mounted making each surface thereof to be subjected to deposition be exposed to an outside; and at least one source target depositing a metal film onto the surface of the three-dimensional object mounted to the mounting drum by sputtering.

Disclosed is a substrate processing system that includes a substrate processing apparatus configured to perform a predetermined processing on a substrate accommodated in a processing container. The substrate processing system includes: a processing execution unit configured to execute a film deposition processing on the substrate; a characteristic acquiring unit configured to acquire the characteristic of the film deposited on the substrate by the film deposition processing; and an abnormality determination unit configured to determine whether the characteristic of the film includes an abnormal value based on the characteristic of the film acquired by the characteristic acquiring unit.

Disclosed is a substrate processing system that includes a substrate processing apparatus configured to perform a predetermined processing on a substrate accommodated in a processing container. The substrate processing system includes: a processing execution unit configured to execute a film deposition processing on the substrate; a characteristic acquiring unit configured to acquire the characteristic of the film deposited on the substrate by the film deposition processing; and an abnormality determination unit configured to determine whether the characteristic of the film includes an abnormal value based on the characteristic of the film acquired by the characteristic acquiring unit.

The present disclosure provides a carrying device and a semiconductor processing apparatus. The carrying device includes a heating plate and a cooling plate, the heating plate and the cooling plate are spaced apart, and a thermal insulation region is formed between the heating plate and the cooling plate. The carrying device of the present disclosure not only can preempt the need to stop the process due to excessively high temperature, but also can maintain a uniform and stable temperature throughout the process, thereby providing a qualified and stable processing temperature for a workpiece to be processed, and eventually obtaining better processing results.