To reduce pumping time of a vacuum treatment chamber served by a transport arrangement in a transport chamber. The vacuum treatment chamber is split in a workpiece treatment compartment and in a pumping compartment in mutual free flow communication and arranged opposite each other with respect to a movement path of the transport arrangement serving the vacuum treatment chamber. The pumping compartment allows providing a pumping port of a flow cross-section area freely selectable independently from the geometry of the treatment compartment.

To reduce pumping time of a vacuum treatment chamber served by a transport arrangement in a transport chamber. The vacuum treatment chamber is split in a workpiece treatment compartment and in a pumping compartment in mutual free flow communication and arranged opposite each other with respect to a movement path of the transport arrangement serving the vacuum treatment chamber. The pumping compartment allows providing a pumping port of a flow cross-section area freely selectable independently from the geometry of the treatment compartment.

Embodiments disclosed herein generally provide improved control of gas flow in processing chambers. In at least one embodiment, a liner for a processing chamber includes an annular body having a sidewall and a vent formed in the annular body for exhausting gas from inside to outside the annular body. The vent comprises one or more vent holes disposed through the sidewall. The liner further includes an opening in the annular body for substrate loading and unloading.

Embodiments disclosed herein generally provide improved control of gas flow in processing chambers. In at least one embodiment, a liner for a processing chamber includes an annular body having a sidewall and a vent formed in the annular body for exhausting gas from inside to outside the annular body. The vent comprises one or more vent holes disposed through the sidewall. The liner further includes an opening in the annular body for substrate loading and unloading.

The present disclosure provides a carrier plate for an evaporating device and an evaporating device thereof. The carrier plate includes a substrate including a groove on a surface of a side, for carrying a member to be evaporated, of the substrate, and a cooler disposed within the groove, wherein the cooler protrudes outward from the surface of the substrate.

The present disclosure provides a carrier plate for an evaporating device and an evaporating device thereof. The carrier plate includes a substrate including a groove on a surface of a side, for carrying a member to be evaporated, of the substrate, and a cooler disposed within the groove, wherein the cooler protrudes outward from the surface of the substrate.

A plasma processing device in which plasma processing uniformity is improved up to an outer peripheral portion of a wafer and the number of non-defective devices that can be manufactured from one wafer is increased. The plasma processing device includes a vacuum container; a mounting table, a susceptor ring that covers an outer peripheral portion of an electrode base material, and an insulation ring covered by the susceptor ring and surrounding the electrode base material, and thin film electrode formed on an upper surface and a part of a surface facing the outer periphery of the electrode base material; a first high frequency power applied to the electrode base material a second high frequency power applied to the thin film electrode; a plasma generating unit that generates plasma on an upper portion of the mounting table inside the vacuum container; and a control unit.

A shutter disk suitable for shield a substrate support in a physical vapor deposition chamber is provided. In one embodiment, the shutter disk includes a disk-shaped body having an outer diameter disposed between a top surface and a bottom surface. The disk-shape body includes a double step connecting the bottom surface to the outer diameter.

A shutter disk suitable for shield a substrate support in a physical vapor deposition chamber is provided. In one embodiment, the shutter disk includes a disk-shaped body having an outer diameter disposed between a top surface and a bottom surface. The disk-shape body includes a double step connecting the bottom surface to the outer diameter.

Systems, devices and methods related to shielded modules. In some embodiments, a module processing system can include a first sub-system configured to prepare or provide a carrier assembly that includes a ring having an inner boundary and configured to be utilized in a deposition apparatus, and a stencil having a plurality of openings, with each opening dimensioned to receive a portion of a packaged module. The carrier assembly can further include an adhesive member that attaches the stencil to the ring such that the stencil is positioned at least partially within the inner boundary of the ring, to allow the carrier assembly to be utilized in the deposition apparatus. The system can further include a second sub-system configured to position a plurality of packaged modules over the respective openings of the stencil to thereby allow the plurality of packaged modules to be processed in the deposition apparatus.