Systems, devices and methods related to shielded modules. In some embodiments, a module processing system can include a first sub-system configured to prepare or provide a carrier assembly that includes a ring having an inner boundary and configured to be utilized in a deposition apparatus, and a stencil having a plurality of openings, with each opening dimensioned to receive a portion of a packaged module. The carrier assembly can further include an adhesive member that attaches the stencil to the ring such that the stencil is positioned at least partially within the inner boundary of the ring, to allow the carrier assembly to be utilized in the deposition apparatus. The system can further include a second sub-system configured to position a plurality of packaged modules over the respective openings of the stencil to thereby allow the plurality of packaged modules to be processed in the deposition apparatus.

A film-forming device according to one embodiment includes a chamber body, a support, a moving device, a shielding member, a first holder and a second holder, in the film-forming device, a substrate supported by the support is linearly moved. The shielding member is disposed above an area where the substrate is moved, and includes a slit extending in a direction perpendicular to a movement direction of the substrate. The first holder and the second holder hold a first target and a second target, respectively, above the shielding member. The first target and the second target are arranged symmetrically with respect to a vertical plane including a linear path on which the center of the substrate is moved.

A film-forming device according to one embodiment includes a chamber body, a support, a moving device, a shielding member, a first holder and a second holder, in the film-forming device, a substrate supported by the support is linearly moved. The shielding member is disposed above an area where the substrate is moved, and includes a slit extending in a direction perpendicular to a movement direction of the substrate. The first holder and the second holder hold a first target and a second target, respectively, above the shielding member. The first target and the second target are arranged symmetrically with respect to a vertical plane including a linear path on which the center of the substrate is moved.

A system deposits a film on a substrate while determining mechanical stress experienced by the film. A substrate is provided in a deposition chamber. A support disposed in the chamber supports a circular portion of the substrate with a first surface of the substrate facing a deposition source and a second surface being reflective. An optical displacement sensor is positioned in the deposition chamber in a spaced-apart relationship with respect to a portion of the substrate's second surface located at approximately the center of the circular portion of the substrate. When the deposition source deposits a film on the first surface, a displacement of the substrate is measured using the optical displacement sensor. A processor is programmed to use the substrate displacement to determine a radius of curvature of the substrate, and to use the radius of curvature to determine mechanical stress experienced by the film during deposition.

A system deposits a film on a substrate while determining mechanical stress experienced by the film. A substrate is provided in a deposition chamber. A support disposed in the chamber supports a circular portion of the substrate with a first surface of the substrate facing a deposition source and a second surface being reflective. An optical displacement sensor is positioned in the deposition chamber in a spaced-apart relationship with respect to a portion of the substrate's second surface located at approximately the center of the circular portion of the substrate. When the deposition source deposits a film on the first surface, a displacement of the substrate is measured using the optical displacement sensor. A processor is programmed to use the substrate displacement to determine a radius of curvature of the substrate, and to use the radius of curvature to determine mechanical stress experienced by the film during deposition.

Disclosed is a deposition apparatus for an organic light-emitting diode, which is capable of preventing a large piece of glass from sagging due to gravity. The deposition apparatus allows the glass to be adhered to the lower surface of a planar electrostatic chuck from the center portion toward the edge portion thereof in the state in which it is upwardly convexly bent, thereby preventing deformation of a mask caused by the amount of sag of the glass. In addition, the deposition apparatus enables rapid alignment of the glass and the mask because the glass and the mask are adhered to each other via measurement of respective alignment marks provided thereon after the glass is located as close as possible to the mask without coming into contact with the mask.

Disclosed is a deposition apparatus for an organic light-emitting diode, which is capable of preventing a large piece of glass from sagging due to gravity. The deposition apparatus allows the glass to be adhered to the lower surface of a planar electrostatic chuck from the center portion toward the edge portion thereof in the state in which it is upwardly convexly bent, thereby preventing deformation of a mask caused by the amount of sag of the glass. In addition, the deposition apparatus enables rapid alignment of the glass and the mask because the glass and the mask are adhered to each other via measurement of respective alignment marks provided thereon after the glass is located as close as possible to the mask without coming into contact with the mask.

A vapor deposition apparatus is configured to attract a vapor deposition mask by an electromagnet. The electromagnet includes a first electromagnet for generating a magnetic field in a first orientation, and a second electromagnet for generating a magnetic field in a second orientation, which is a reverse orientation to the first orientation. As a result, a generated magnetic field is weakened by operating the first and second electromagnets at the same time when a current is turned on, and an intended magnetic field can be obtained by thereafter turning off the second electromagnet. As a result, an influence of electromagnetic induction is reduced, reducing failure of elements and the like formed on a substrate for vapor deposition and degradation in properties of the elements. Meanwhile, by turning off the operation of the second electromagnet after the current is turned on, a normal attraction force can be obtained.

A vapor deposition apparatus is configured to attract a vapor deposition mask by an electromagnet. The electromagnet includes a first electromagnet for generating a magnetic field in a first orientation, and a second electromagnet for generating a magnetic field in a second orientation, which is a reverse orientation to the first orientation. As a result, a generated magnetic field is weakened by operating the first and second electromagnets at the same time when a current is turned on, and an intended magnetic field can be obtained by thereafter turning off the second electromagnet. As a result, an influence of electromagnetic induction is reduced, reducing failure of elements and the like formed on a substrate for vapor deposition and degradation in properties of the elements. Meanwhile, by turning off the operation of the second electromagnet after the current is turned on, a normal attraction force can be obtained.

A porous tool includes a mold body and an additively-manufactured film attached to a surface of the mold body. The film includes a porous layer and a nonporous support layer. The porous layer may include a surface having an array of surface pore openings, a network of interconnected passages in fluid communication with the surface pore openings, and one or more lateral edges that have an array of edge pore openings in fluid communication with the interconnected passages. Methods of forming a porous tool include depositing additive material on a build surface using a directed energy deposition system to form a film while simultaneously subtracting selected portions of the additive material from the film using laser ablation. Methods of forming a molded component include conforming a moldable material to a shape using a porous tool that includes a mold body and an additively-manufactured film, and evacuating outgas from the moldable material through a porous layer of the film.