A porous tool includes a mold body and an additively-manufactured film attached to a surface of the mold body. The film includes a porous layer and a nonporous support layer. The porous layer may include a surface having an array of surface pore openings, a network of interconnected passages in fluid communication with the surface pore openings, and one or more lateral edges that have an array of edge pore openings in fluid communication with the interconnected passages. Methods of forming a porous tool include depositing additive material on a build surface using a directed energy deposition system to form a film while simultaneously subtracting selected portions of the additive material from the film using laser ablation. Methods of forming a molded component include conforming a moldable material to a shape using a porous tool that includes a mold body and an additively-manufactured film, and evacuating outgas from the moldable material through a porous layer of the film.

Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate support includes a substrate support pedestal having an upper surface to support a substrate and an opposing bottom surface, wherein the substrate support pedestal is formed of a material that is transparent to radiation; a lamp assembly disposed below the substrate support pedestal and having a plurality of lamps configured to heat the substrate; a pedestal support extending through the lamp assembly to support the substrate support pedestal in a spaced apart relation to the plurality of lamps; a shaft coupled to a second end of the pedestal support opposite the first end; and a rotation assembly coupled to the shaft opposite the pedestal support to rotate the shaft, the pedestal support, and the substrate support pedestal with respect to the lamp assembly.

A method includes transmitting a radiation toward an electrostatic chuck, receiving a reflection of the radiation, analyzing the reflection of the radiation, determining whether a particle is present on the electrostatic chuck based on the analyzing the reflection of the radiation, and moving a cleaning tool to a location of the particle on the electrostatic chuck when the determination determines that the particle is present.

A rotatable wafer chuck includes chuck arms and wafer holders that are aerodynamically shaped to reduce turbulence during rotation. A wafer holder may include a friction support and an independently rotatable vertical alignment member and clamping member that is shaped to reduce drag. The shape reduces turbulence during edge bevel etching to improve the uniformity of the edge exclusion and during high-speed rotation to improve particle performance.

The present disclosure provides a lens coating fixture which comprises an upper plate and a lower plate disposed opposite to the upper plate and holding the lens to be coated together, the upper plate is provided with a plurality of first lens receiving holes, the lower plate is provided with a second lens receiving hole corresponding to each of the first lens receiving holes, and the upper plate is provided with a recessed portion surrounding the first lens receiving hole, the recessed portion communicating with the first lens receiving hole, the lower plate is provided with a convex portion at a position corresponding to the concave portion, and the convex portion is embedded in the recessed portion and abuts against the object side or the image side of the non-image-forming area of the lens to be coated.

A lens coating fixture includes an upper plate and a lower plate disposed to be opposite to the upper plate and holding the lens to be coated together. The upper plate is provided with a plurality of first lens receiving holes, the lower plate is provided with a second lens receiving hole corresponding to each of the first lens receiving holes, and the upper plate is provided with a recess portion surrounding the first lens receiving hole. The recess portion is in communication with the first lens receiving hole. The lower plate is provided with a protrusion portion at a position corresponding to the recess portion. The protrusion portion is embedded in the recess portion and abuts against an object side or an image side of a non-imaging region of the lens to be coated.

A lens coating fixture includes an upper plate and a lower plate disposed to be opposite to the upper plate and holding the lens to be coated together. The upper plate is provided with a plurality of first lens receiving holes, the lower plate is provided with a second lens receiving hole corresponding to each of the first lens receiving holes, and the upper plate is provided with a recess portion surrounding the first lens receiving hole. The recess portion is in communication with the first lens receiving hole. The lower plate is provided with a protrusion portion at a position corresponding to the recess portion. The protrusion portion is embedded in the recess portion and abuts against an object side or an image side of a non-imaging region of the lens to be coated.

A film-forming apparatus comprises: a processing chamber defining a processing space, a first sputter-particle emitter and a second sputter-particle emitter having targets, respectively, from which sputter-particles are emitted in different oblique directions in the processing space, a sputter-particle blocking plate having a passage hole through which the sputter particles emitted from the first sputter-particle emitter and the second sputter-particle emitter pass, a substrate support configured to support a substrate and provided at a side opposite the first sputter-particle emitter and the second sputter-particle emitter with respect to the sputter-particle blocking plate in the processing space, a substrate moving mechanism configured to linearly move the substrate supported on the substrate support, and a controller configured to control the emission of sputter-particles from the first sputter-particle emitter and the second sputter-particle emitter while controlling the substrate moving mechanism to move the substrate linearly.

Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150 C. by flowing a coolant through channels formed in a base of the substrate support assembly.

Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150 C. by flowing a coolant through channels formed in a base of the substrate support assembly.