An apparatus with a deposition source and a substrate holder having a source mounting portion, which is rotatable about a first axis, a shielding element, which is disposed between the deposition source and the substrate holder, and a drive arrangement. The deposition source has a material outlet opening from which material is emitted. A longitudinal axis of an elongate central region of the material outlet opening extends parallel and centrally between the edges of the material outlet opening. The deposition source is mounted to the source mounting portion such that the longitudinal axis of the central region is parallel to the first axis. The shielding element has an aperture. The drive arrangement controls rotation of the source mounting portion, adjustment of a width of the aperture, and relative movement between the substrate holder and both the source mounting portion and the shielding element.

Provided is a film-formation method for a surface layer having high mechanical strength and a low refractive index. A step of film formation from a vapor deposition material by a vacuum vapor deposition method and a step of film formation by sputtering of a target constituent substance are repeated for the surfaces of substrates (S), thereby forming films with a lower refractive index than that of a film-forming material.

A substrate stage includes: a shaft rotatably disposed with respect to a bottom surface of a processing container; a base provided on the shaft; and a horizontal mover attached to the base and configured to move a substrate in the processing container in a horizontal direction with respect to the bottom surface.

A substrate stage includes: a shaft rotatably disposed with respect to a bottom surface of a processing container; a base provided on the shaft; and a horizontal mover attached to the base and configured to move a substrate in the processing container in a horizontal direction with respect to the bottom surface.

Provided are a vapor deposition apparatus, a vapor deposition method, and a method of manufacturing an organic EL display apparatus which can prevent heat generation of a magnet chuck by using the magnet chuck that strongly attracts a deposition mask to dispose a substrate for vapor deposition and the deposition mask in proximity to each other during vapor deposition, while being less influenced by any magnetic field during alignment between the substrate for vapor deposition and the deposition mask. In the vapor deposition apparatus, a magnet chuck (3) includes a permanent magnet (3A) and an electromagnet (3B).

Provided are a vapor deposition apparatus, a vapor deposition method, and a method of manufacturing an organic EL display apparatus which can prevent heat generation of a magnet chuck by using the magnet chuck that strongly attracts a deposition mask to dispose a substrate for vapor deposition and the deposition mask in proximity to each other during vapor deposition, while being less influenced by any magnetic field during alignment between the substrate for vapor deposition and the deposition mask. In the vapor deposition apparatus, a magnet chuck (3) includes a permanent magnet (3A) and an electromagnet (3B).

A sputtering device and method including a chamber, a target disposed within the chamber, and a substrate support including at least a portion consisting essentially of a non-aluminous and non-magnetic metallic material disposed within the chamber. The substrate support may include a carrier and a fixture for holding a substrate. In some embodiments, at least the target-facing surface of the carrier consists essentially of a non-aluminous and non-magnetic metallic material. In some embodiments, the fixture consists essentially of a non-aluminous and non-magnetic metallic material. The sputtering device may be drum sputtering device. The sputtering method may be a magnetron sputtering method.

A sputtering device and method including a chamber, a target disposed within the chamber, and a substrate support including at least a portion consisting essentially of a non-aluminous and non-magnetic metallic material disposed within the chamber. The substrate support may include a carrier and a fixture for holding a substrate. In some embodiments, at least the target-facing surface of the carrier consists essentially of a non-aluminous and non-magnetic metallic material. In some embodiments, the fixture consists essentially of a non-aluminous and non-magnetic metallic material. The sputtering device may be drum sputtering device. The sputtering method may be a magnetron sputtering method.

Embodiments of process kit components for use in a substrate support, and substrate supports incorporating same, are provided herein. In some embodiments, the substrate support may include a body, a grounding shell formed of an electrically conductive material disposed about the body, a liner formed of an electrically conductive material disposed about the grounding shell, where the liner includes an upper lip that extends inwardly towards the body, a metal fastener disposed through the upper lip to couple the liner to the grounding shell, and a first insulator ring disposed atop the upper lip of the liner and covering the metal fastener.

A substrate supporting unit is provided. The substrate supporting unit possesses a shaft, a first heater, and a stage. The first heater is located in the shaft and is configured to heat an upper portion of the shaft. The stage is located over the shaft and includes a first plate, a second plate over the first plate, and a second heater between the first plate and the second plate.