The present invention provides a technique for performing film formation at low cost without causing a short-circuit between sputtered films formed on opposite surfaces of a film-formation target substrate. According to the present invention, in a substrate-holder conveyance mechanism 3, a substrate holder 11 is conveyed by a first conveyance portion so that the substrate holder 11 passes through a first film formation region; film formation is performed by sputtering on a first surface of a film-formation target substrate 50 held by the substrate holder 11; the substrate holder 11 is conveyed from the first conveyance portion to a second conveyance portion in such a manner as to make a turn with the up/down orientation of the substrate holder 11 maintained; the substrate holder 11 is conveyed by the second conveyance portion in a direction opposite to the direction of conveyance by the first conveyance portion so that the substrate holder 11 passes through a second film formation region; and film formation is performed by sputtering on a second surface of the film-formation target substrate 50. The substrate holder 11 has openings 14 and 15 through which first and second surfaces of the film-formation target substrate 50 are exposed, and includes a shield portion 16 for shielding an edge portion of the film-formation target substrate 50 from a film formation material supplied from a second sputtering source.

The present invention provides a technique for performing film formation at low cost without causing a short-circuit between sputtered films formed on opposite surfaces of a film-formation target substrate. According to the present invention, in a substrate-holder conveyance mechanism 3, a substrate holder 11 is conveyed by a first conveyance portion so that the substrate holder 11 passes through a first film formation region; film formation is performed by sputtering on a first surface of a film-formation target substrate 50 held by the substrate holder 11; the substrate holder 11 is conveyed from the first conveyance portion to a second conveyance portion in such a manner as to make a turn with the up/down orientation of the substrate holder 11 maintained; the substrate holder 11 is conveyed by the second conveyance portion in a direction opposite to the direction of conveyance by the first conveyance portion so that the substrate holder 11 passes through a second film formation region; and film formation is performed by sputtering on a second surface of the film-formation target substrate 50. The substrate holder 11 has openings 14 and 15 through which first and second surfaces of the film-formation target substrate 50 are exposed, and includes a shield portion 16 for shielding an edge portion of the film-formation target substrate 50 from a film formation material supplied from a second sputtering source.

A box coating apparatus for vacuum coating of substrates has a vacuum chamber containing an evaporation source and a substrate holder formed as a dome related to the evaporation source and rotatable about an axis. A masking arrangement is located in between for partially shadowing the substrates on the substrate holder relative to the evaporation source. The masking arrangement comprises a fixed masking portion stationary in the vacuum chamber, and a plurality of gradient sector portions carrying gradient shields assigned to the substrates on the substrate holder, for forming a gradient mask. The gradient sector portions can be rotated about the axis between a gradient mask open position where they are stored behind the fixed masking portion, and a gradient mask closed position where they are spread like a fan between the evaporation source and the substrate holder.

Described herein are apparatuses for holding a substrate in a near vertical position, wherein the design minimizes substrate sag while allowing the substrate to expand and contract under varying thermal conditions. The apparatus minimizes the stress on the substrate, preventing breakage of or damage to the substrate while it undergoes coating and other thermal processes.

Described herein are apparatuses for holding a substrate in a near vertical position, wherein the design minimizes substrate sag while allowing the substrate to expand and contract under varying thermal conditions. The apparatus minimizes the stress on the substrate, preventing breakage of or damage to the substrate while it undergoes coating and other thermal processes.

A sputtering device includes a vacuum chamber, a target, a substrate stage, and a deposition guard plate. The target is located in the vacuum chamber. The substrate stage is located in the vacuum char and includes a seat surface on which a substrate is placed. The substrate includes an outer circumferential portion extending beyond the seat surface. The deposition guard plate is located in the vacuum chamber and includes an annular inclined surface extending around the substrate stage. The annular inclined surface is faced toward the target and is a circumferential surface of a truncated cone including an inner edge opposing a rear surface of the outer circumferential portion. An angle between the annular inclined surface and a plane including the seat surface is greater than or equal to 10 and less than or equal to 50.

A process of providing an antibacterial coating to the surface of an article including the steps of applying a layer of an antibacterial precursor layer to the surface of an article to which an antibacterial coating is to be applied, wherein said antibacterial precursor layer is a precursor from which the coating is to be formed; and directing a neutral molecular hydrogen flux from a neutral molecular hydrogen flux emission source towards the surface of the article. Upon impact of neutral hydrogen molecules on molecules at or on the surface of an article, the bonds of the antibacterial precursor layer are selectively ruptured, and wherein the selectively ruptured bonds cross-link with themselves or with other chemical moieties at said surface or a combination thereof, resulting an antibacterial coating being formed on the surface of the article.

Pedestal assemblies with a thermal barrier plate, a torque plate and at least one kinematic mount to change a plane formed by the thermal barrier plate are described. Susceptor assemblies and processing chambers incorporating the pedestal assemblies are also described. Methods of leveling a susceptor to form parallel planes between the susceptor surface and a gas distribution assembly surface are also described.

A positioning arrangement for positioning a substrate carrier and a mask carrier in a vacuum chamber is described. The positioning arrangement comprising a first track extending in a first direction and configured transportation of the substrate carrier configured for holding a substrate having a substrate surface, a second track extending in the first direction and configured for transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface, and a holding arrangement configured for holding the mask carrier, wherein the holding arrangement is arranged between the first track and the second track.

A positioning arrangement for positioning a substrate carrier and a mask carrier in a vacuum chamber is described. The positioning arrangement comprising a first track extending in a first direction and configured transportation of the substrate carrier configured for holding a substrate having a substrate surface, a second track extending in the first direction and configured for transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface, and a holding arrangement configured for holding the mask carrier, wherein the holding arrangement is arranged between the first track and the second track.