A fixture assembly for supporting a workpiece having opposing side walls defining a notch. The fixture assembly includes a base and a first member extending from a surface of the base. The first member has an outward facing surface. A second member extends from the surface of the base. The first member is parallel to the first member and has an outward facing surface. At least one adjusting assembly is configured for moving at least one of the first member and the second member to adjust a distance between the outward facing surfaces of the first member and the second member wherein moving at least one of the first member and the second member increases the distance between the outward facing surfaces of the first and second members and causes the outward facing surfaces to engage the opposing side walls to clamp the workpiece to the first and second members.

A fixture assembly for supporting a workpiece having opposing side walls defining a notch. The fixture assembly includes a base and a first member extending from a surface of the base. The first member has an outward facing surface. A second member extends from the surface of the base. The first member is parallel to the first member and has an outward facing surface. At least one adjusting assembly is configured for moving at least one of the first member and the second member to adjust a distance between the outward facing surfaces of the first member and the second member wherein moving at least one of the first member and the second member increases the distance between the outward facing surfaces of the first and second members and causes the outward facing surfaces to engage the opposing side walls to clamp the workpiece to the first and second members.

ZnO sputtering is performed while a rolling body is housed in a basket made of a metal wire and is rotated. By setting a ratio of a mesh size of the basket to a diameter of the rolling body in a range of 40 to 95%, fine and uniform ZnO coating can be formed on a surface of the rolling body. By using the rolling body with ZnO coating prepared in this manner in a bearing which is rotated at high speed in a high-load state, a friction coefficient can significantly be lowered in comparison with a case of no coating.

A method for improving the performance and/or service life of pistons, wherein at least one PVD coating source includes a target. The coating source is arranged on a wall of the coating chamber and is periodically operated. The target surface to be evaporated is positioned parallel to the vertical axis and the surface sections to be coated are positioned in front of the target surface in the coating region using a holding device. The substrate receiving area is rotated periodically about the rotational axis of the substrate receiving area by a rotary system which is a coupling system, or is arranged on the coupling system, or is a part of the coupling system. The rotational axis and the vertical axis form an angle which is larger than 10 and smaller than 180 such that the coating material reaches each part of the individual surface sections at least once.

In one embodiment, a semiconductor manufacturing apparatus includes a carrier having first and second ends extending in a first direction, and third and fourth ends extending in a second direction and being not shorter than the first and second ends. The apparatus further includes a member holder having a magnet placement face on which first and second magnetic-pole portions are placed, the magnet placement face having fifth and sixth ends extending in the first direction and being shorter than the first and second ends, and seventh and eighth ends extending in the second direction, being longer than the fifth and sixth ends, and being longer than the third and fourth ends. The apparatus further includes a carrier transporter transporting the carrier along the first direction. The carrier transporter can transport the carrier such that the third and fourth ends pass under a center line of the magnet placement face.

In one embodiment, a semiconductor manufacturing apparatus includes a carrier having first and second ends extending in a first direction, and third and fourth ends extending in a second direction and being not shorter than the first and second ends. The apparatus further includes a member holder having a magnet placement face on which first and second magnetic-pole portions are placed, the magnet placement face having fifth and sixth ends extending in the first direction and being shorter than the first and second ends, and seventh and eighth ends extending in the second direction, being longer than the fifth and sixth ends, and being longer than the third and fourth ends. The apparatus further includes a carrier transporter transporting the carrier along the first direction. The carrier transporter can transport the carrier such that the third and fourth ends pass under a center line of the magnet placement face.

A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

In a method according to an exemplary embodiment, a substrate is prepared in a chamber. A patterned resist mask has been formed on a first region of the substrate. A surface of the substrate in a second region is exposed. A film is formed on the substrate in the chamber by sputtering. The film is formed on the substrate in a manner that particles emitted obliquely downward from a target are caused to be incident onto the substrate.

A film forming apparatus includes: a processing chamber; a sputtered particle emitter; a substrate mounting unit; and a sputtered particle shielding plate that is provided between the sputtered particle emitter and the substrate mounting unit and has a passage hole that allows the sputtered particles emitted from the sputtered particle emitter to pass through and allows the sputtered particles to be obliquely incident on a substrate mounted on the substrate mounting unit.

A method for manufacturing a housing of an electronic device includes providing a substrate, forming a metal plating on a surface of the substrate, and laser-etching the metal plating to form a conductive layer. The conductive layer serves as an antenna radiator or a conductive circuit.