A vapor deposition apparatus disclosed by an embodiment comprises: a vacuum chamber (8); a mask holder (15) for holding a deposition mask 1; a substrate holder (29) for holding a substrate for vapor deposition (2); an electromagnet (3) disposed above a surface; a vapor deposition source 5 for vaporizing or sublimating a vapor deposition material; and a heat pipe (7) including at least a heat absorption part (71) and a heat dissipation part (72), the heat absorption part being in contact with the electromagnet (3), and the heat dissipation part being derived to an outside of the vacuum chamber (8). The heat pipe (7) and the electromagnet (3) are in intimate contact with each other at an area of a contact part between the heat pipe (7) and the electromagnet (3), the area being equal to or more than a cross-sectional area within an inner perimeter of a coil (32).

Provided are a vapor deposition apparatus, a vapor deposition method, and a method of manufacturing an organic EL display apparatus which can prevent heat generation of a magnet chuck by using the magnet chuck that strongly attracts a deposition mask to dispose a substrate for vapor deposition and the deposition mask in proximity to each other during vapor deposition, while being less influenced by any magnetic field during alignment between the substrate for vapor deposition and the deposition mask. In the vapor deposition apparatus, a magnet chuck (3) includes a permanent magnet (3A) and an electromagnet (3B).

Provided are a vapor deposition apparatus, a vapor deposition method, and a method of manufacturing an organic EL display apparatus which can prevent heat generation of a magnet chuck by using the magnet chuck that strongly attracts a deposition mask to dispose a substrate for vapor deposition and the deposition mask in proximity to each other during vapor deposition, while being less influenced by any magnetic field during alignment between the substrate for vapor deposition and the deposition mask. In the vapor deposition apparatus, a magnet chuck (3) includes a permanent magnet (3A) and an electromagnet (3B).

A carrier for holding a substrate is described. The carrier includes a carrier body having a first surface, and an adhesive arrangement provided on the first surface. The carrier body includes one or more conduits configured for providing a gas into the adhesive arrangement. Further, a method for controlling a temperature of a substrate is described. The method includes providing a carrier as described herein; supplying a gas through the one or more conduits into the adhesive arrangement; and providing the gas to a backside of the substrate attached to the adhesive arrangement.

A carrier for holding a substrate is described. The carrier includes a carrier body having a first surface, and an adhesive arrangement provided on the first surface. The carrier body includes one or more conduits configured for providing a gas into the adhesive arrangement. Further, a method for controlling a temperature of a substrate is described. The method includes providing a carrier as described herein; supplying a gas through the one or more conduits into the adhesive arrangement; and providing the gas to a backside of the substrate attached to the adhesive arrangement.

A thin substrate processing device include a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.

A thin substrate processing device include a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.

In a vacuum chamber, there are first and second film formation regions, and a conveyance path having a projected shape on a vertical plane. The conveyance path has a continuous ring shape and passes through the first and second film formation regions. A substrate-holder conveyance mechanism has plural driving portions in contact with driven portions on the substrate holder and is configured to convey the substrate holder along the conveyance path such that the substrate holder remains horizontal. The driving portions convey a preceding substrate holder and a following substrate holder adjacent to each other through the respective film formation regions such that an end portion of an upstream side of a substrate holder at a downstream side in the moving direction and an end portion of a downstream side of a substrate holder at an upstream side in the moving direction are close to each other.

In a vacuum chamber, there are first and second film formation regions, and a conveyance path having a projected shape on a vertical plane. The conveyance path has a continuous ring shape and passes through the first and second film formation regions. A substrate-holder conveyance mechanism has plural driving portions in contact with driven portions on the substrate holder and is configured to convey the substrate holder along the conveyance path such that the substrate holder remains horizontal. The driving portions convey a preceding substrate holder and a following substrate holder adjacent to each other through the respective film formation regions such that an end portion of an upstream side of a substrate holder at a downstream side in the moving direction and an end portion of a downstream side of a substrate holder at an upstream side in the moving direction are close to each other.

A vacuum processing apparatus having a small installation area is provided. A lifting plate is arranges inside a vacuum chamber, and a substrate holding device is arranged on the lifting plate to be able to be lifted up and down. An upper side processing device and a lower side processing device are provided in a processing region located beside a lifting region where the lifting plate moves up and down. An upper side moving device and a lower side moving device make the substrate holding device pass through the processing region, and a transfer device transfers the substrate holding device between the upper side moving device or the lower side moving device and the lifting plate. Because vacuum processing can be performed on the upper side and the lower side, the installation area of the vacuum processing apparatus is small.