Patent classifications
C23C14/50
LOADING JIG AND EVAPORATOR
A loading jig and an evaporator are provided. The loading jig includes a body and at least one elastic membrane. The body has a plate-like structure and is sandwiched between the bearing platform and the plurality of clamping blocks. Said at least one elastic membrane is respectively disposed between at least one clamping block and a bottom of the body. The elastic membrane is externally connected to a signal converter. The pressure applied by the clamping block may be measured through the elastic membrane when the clamping block is pressed against the bottom of the body, and then the measured pressure signal is transmitted to the signal converter to be converted into a pressure value.
LOADING JIG AND EVAPORATOR
A loading jig and an evaporator are provided. The loading jig includes a body and at least one elastic membrane. The body has a plate-like structure and is sandwiched between the bearing platform and the plurality of clamping blocks. Said at least one elastic membrane is respectively disposed between at least one clamping block and a bottom of the body. The elastic membrane is externally connected to a signal converter. The pressure applied by the clamping block may be measured through the elastic membrane when the clamping block is pressed against the bottom of the body, and then the measured pressure signal is transmitted to the signal converter to be converted into a pressure value.
FILM COATING APPARATUS
The present disclosure provides a film coating apparatus. In the film coating apparatus, by disposing the position sensor outside the coating chamber to detect the position of the coating carrier through the through hole and the light transmitting window of the sensor detection path, the position sensor may not directly contact the coating carrier, so that the coating carrier may not be damaged by the position sensor, and the position sensor may not be influenced by the extreme environment in the coating chamber. Furthermore, by disposing the protection device in the coating chamber to protect the through hole and the light transmitting window from covering by the coating material, the normal working of the position sensor can be ensured. The film coating apparatus of the present disclosure has simple structure and low cost, and is easy to use.
EVAPORATION DEPOSITION EQUIPMENT AND EVAPORATION DEPOSITION METHOD
The invention provides an evaporation deposition equipment and method, applicable to vapor-depositing an organic light-emitting layer on an array substrate with a formed anode layer, the evaporation deposition equipment comprising: a first platform, disposed with an electrode plate; a second platform, disposed above the first platform, for carrying the array substrate; a vaporizing unit, disposed at the electrode plate, for generating charged vapor-depositing material particles and spraying the charged vapor-depositing material particles towards the array substrate; a mask carrier, for fixing a mask with opening pattern between the array substrate and the vaporizing unit; an electric field forming unit, electrically connected to the array substrate and the electrode plate, for forming an electric field between the anode layer and the electrode plate, the electric field guiding the charged vapor-depositing material particles towards the array substrate to deposit to form an organic light-emitting layer corresponding to the opening pattern.
EVAPORATION DEPOSITION EQUIPMENT AND EVAPORATION DEPOSITION METHOD
The invention provides an evaporation deposition equipment and method, applicable to vapor-depositing an organic light-emitting layer on an array substrate with a formed anode layer, the evaporation deposition equipment comprising: a first platform, disposed with an electrode plate; a second platform, disposed above the first platform, for carrying the array substrate; a vaporizing unit, disposed at the electrode plate, for generating charged vapor-depositing material particles and spraying the charged vapor-depositing material particles towards the array substrate; a mask carrier, for fixing a mask with opening pattern between the array substrate and the vaporizing unit; an electric field forming unit, electrically connected to the array substrate and the electrode plate, for forming an electric field between the anode layer and the electrode plate, the electric field guiding the charged vapor-depositing material particles towards the array substrate to deposit to form an organic light-emitting layer corresponding to the opening pattern.
Deposition tool for combinatorial thin film material libraries
A system for combinatorial deposition of a thin layer on a substrate is described. The system comprises at least one deposition material source holder and a substrate holder. The system also comprises a rotatable positioning system for subsequently positioning the at least one substrate in parallel and in non-parallel configuration with at least one deposition material source. The system comprises at least one mask holder arranged for positioning a mask between at least one of the target holder and the positioning system, for allowing variation of the material flux across the at least one substrate when the combinatorial deposition is performed. The mask holder is in a fixed arrangement with respect to the at least one deposition material source holder during the combinatorial depositing.
ROLL-TO-ROLL SURFACE TREATMENT DEVICE, AND FILM DEPOSITION METHOD AND FILM DEPOSITION DEVICE USING SAME
Disclosed herein is a roll-to-roll long base material surface processing device capable of performing surface processing on a long base material with little occurrence of wrinkling in the long base material at low costs. The surface processing device includes: two can rolls that cool a long resin film transferred in a roll-to-roll manner in a vacuum chamber with a cooling medium circulated therein by wrapping the long resin film around outer circumferences thereof; and surface processing units typified by magnetron sputtering cathodes provided so as to face the outer circumferences of the two can rolls, wherein a second can roll of the two can rolls other than a most upstream first can roll has a gas release mechanism that releases a gas from the outer circumference.
SUBSTRATE-PLACING STAGE AND MANUFACTURING METHOD THEREOF
Provided is a stage for precisely controlling a substrate temperature and a manufacturing method thereof. Alternatively, a film-forming apparatus or a film-processing apparatus having the stage is provided. The stage includes a base material and a heater layer over the base material. The heater layer has a first insulating film, a heater wire over the first insulating film, and a second insulating film over the heater wire. The heater wire includes more than one kind of metal selected from tungsten, nickel. chromium cobalt, and molybdenum.
SUBSTRATE-PLACING STAGE AND MANUFACTURING METHOD THEREOF
Provided is a stage for precisely controlling a substrate temperature and a manufacturing method thereof. Alternatively, a film-forming apparatus or a film-processing apparatus having the stage is provided. The stage includes a base material and a heater layer over the base material. The heater layer has a first insulating film, a heater wire over the first insulating film, and a second insulating film over the heater wire. The heater wire includes more than one kind of metal selected from tungsten, nickel. chromium cobalt, and molybdenum.
SUBSTRATE FIXING CARRIER, EVAPORATION DEVICE AND EVAPORATION METHOD
A substrate fixing carrier includes a supporting frame and a cooling plate. The supporting frame defines a hollow region and a supporting portion at an inner wall of the supporting frame. The cooling plate and the supporting frame are movable towards each other until the cooling plate is in the hollow region with edges of the cooling plate aligning with the supporting portion. When a rectangular to-be-evaporated substrate is placed in the hollow region with edges of the rectangular to-be-evaporated substrate between the supporting portion and the cooling plate, a distance between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion is greater than or equal to a thickness of the to-be-evaporated substrate, and a distance between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion is less than the thickness of the to-be-evaporated substrate.