A coating deposition assembly includes a substrate having an outer surface with a contoured geometry, a mesh mask having a plurality of apertures and being disposed over a subset of the outer surface of the substrate and spaced apart from the outer surface, and a tool secured to the substrate. The tool is configured to move the substrate and the mesh mask relative to a coating material source such that the mesh mask maintains a fixed spatial relationship with the substrate.

A heating chamber and a semiconductor processing apparatus are provided. The heating chamber includes: a heating barrel (17) disposed in the heating chamber and located above a substrate transferring window; an annular heating device (15) disposed around an inner side of the heating barrel and configured to radiate heat from a periphery to an interior of the heating barrel; a substrate cassette (14) configured to bear multiple layers of substrates and allow the multiple layers of substrates to be arranged at intervals in an axial direction of the heating barrel; and a substrate cassette lifting device (13) configured to drive the substrate cassette to move up into an internal spare defined by the annular heating device, or move down to a position corresponding to the substrate transferring window.

A heating chamber and a semiconductor processing apparatus are provided. The heating chamber includes: a heating barrel (17) disposed in the heating chamber and located above a substrate transferring window; an annular heating device (15) disposed around an inner side of the heating barrel and configured to radiate heat from a periphery to an interior of the heating barrel; a substrate cassette (14) configured to bear multiple layers of substrates and allow the multiple layers of substrates to be arranged at intervals in an axial direction of the heating barrel; and a substrate cassette lifting device (13) configured to drive the substrate cassette to move up into an internal spare defined by the annular heating device, or move down to a position corresponding to the substrate transferring window.

A film forming system includes a camera having a field of view in a region through which an edge of a film-formed workpiece rotated by a rotational stage and an edge of the film of the film-formed workpiece pass. Based on three or more images obtained by the camera during the rotation of the film-formed workpiece, widths between the edge of the film-formed workpiece and the edge of the film of the film-formed workpiece at circumferentially different locations are obtained. Based on the widths obtained by the first unit, a first positional deviation of a central position of the film of the film-formed workpiece with respect to a central position of the film-formed workpiece is obtained. By using the first positional deviation of the film-formed workpiece, a transfer position of a transfer modules transferring the workpiece to a film forming apparatus used for producing the film-formed workpiece is corrected.

The present invention provides a vapor deposition device including a novel alignment mechanism applicable to a large substrate, a vapor deposition method, and a method for manufacturing an organic electroluminescence element. The vapor deposition device of the present invention is a vapor deposition device for performing vapor deposition while transporting a substrate in a first direction, and includes: a mask; a substrate tray including a substrate-holding portion and a guide portion protruding from the substrate-holding portion to the mask side and disposed along the first direction; at least one distance meter disposed on a first end which is one end of the mask or the guide portion; and at least one driver coupled with a second end which is the other end of the mask. The at least one distance meter is configured to measure a distance between the at least one distance meter and the guide portion or the first end when the guide portion faces the first end. The at least one driver is capable of driving the mask in a second direction perpendicular to the first direction based on the measured value of the at least one distance meter.

The present invention provides a vapor deposition device including a novel alignment mechanism applicable to a large substrate, a vapor deposition method, and a method for manufacturing an organic electroluminescence element. The vapor deposition device of the present invention is a vapor deposition device for performing vapor deposition while transporting a substrate in a first direction, and includes: a mask; a substrate tray including a substrate-holding portion and a guide portion protruding from the substrate-holding portion to the mask side and disposed along the first direction; at least one distance meter disposed on a first end which is one end of the mask or the guide portion; and at least one driver coupled with a second end which is the other end of the mask. The at least one distance meter is configured to measure a distance between the at least one distance meter and the guide portion or the first end when the guide portion faces the first end. The at least one driver is capable of driving the mask in a second direction perpendicular to the first direction based on the measured value of the at least one distance meter.

A piston ring may include a drawn metal base of constant thickness having an outer peripheral surface. The piston ring may also include a hard coating disposed on the outer peripheral surface. The coating may have a thickness that is greater in a region of two butt ends of the base than a thickness of the coating in another region of the outer peripheral surface. The coating may be defined by a plurality of layers with a nanoscale structure.

An ion source device (10) includes a first magnetron cathode (14a) and a second magnetron cathode (14b, 208a, 208b), each having a respective central longitudinal axis (M.sub.a, M.sub.b) and an ion source unit (16) that emits ions to pass through a space between the cathodes, a surface (18) of the ion source unit facing generally the cathodes, the central longitudinal axes being spaced apart from each other by a distance A, a shortest line (D) joining a surface of the cathodes is of a distance B, a centre of the ion source unit lying on a line (E) perpendicular to and bisecting the shortest line, the shortest distance between the surface of the ion source unit and the shortest line is C, with B>10 mm and C<4 A.

Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.

Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.