One embodiment of the present invention can provide a system for fabrication of a photovoltaic structure. The system can include a physical vapor deposition tool configured to sequentially deposit a transparent conductive oxide layer and a metallic layer on an emitter layer formed in a first surface of a Si substrate, without requiring the Si substrate to be removed from the physical vapor deposition tool after depositing the transparent conductive oxide layer. The system can further include an electroplating tool configured to plate a metallic grid on the metallic layer and a thermal annealing tool configured to anneal the transparent conductive oxide layer.

One embodiment of the present invention can provide a system for fabrication of a photovoltaic structure. The system can include a physical vapor deposition tool configured to sequentially deposit a transparent conductive oxide layer and a metallic layer on an emitter layer formed in a first surface of a Si substrate, without requiring the Si substrate to be removed from the physical vapor deposition tool after depositing the transparent conductive oxide layer. The system can further include an electroplating tool configured to plate a metallic grid on the metallic layer and a thermal annealing tool configured to anneal the transparent conductive oxide layer.

A electrostatic chucking apparatus and method for coating mobile device 2D or 3D cover glass in a vacuum coating chamber having a rotating drum and which is driven in rotation. The apparatus includes a carrier including a liquid-cooled cold plate which is removably mountable to the rotating drum. In the case of 3D cover glass, the carrier includes a portion with a 3D profile to match a 3D profile of the 3D cover glass. The carrier further includes an electrostatic chuck (ESC) adapted to secure the cover glass in place against the carrier in the face of centrifugal forces caused by rotation of the rotating drum, with the ESC developing a sufficient clamping force for reliably securing the cover glass in place.

A chucking apparatus and method for vacuum processing mobile device cover substrates in a vacuum chamber in which the chucking apparatus is configured for temporarily securing the cover substrate within the vacuum chamber, and includes a carrier substrate with a CTE within 20% of CTE of the cover substrate to prevent the carrier substrate and the cover substrate from becoming detached from one another due to differing rates of thermal expansion during processing in the vacuum chamber. The carrier substrate has a surface contact area in contact with the cover substrate selected to provide for continuous bonding during the processing in the vacuum chamber and to provide for de-bonding after the process in the vacuum chamber is complete. Further, the carrier substrate is prepared for use with a cleaning process that facilitates Van der Waals bonding between the carrier substrate and the cover substrate.

A chucking apparatus and method for vacuum processing mobile device cover substrates in a vacuum chamber in which the chucking apparatus is configured for temporarily securing the cover substrate within the vacuum chamber, and includes a carrier substrate with a CTE within 20% of CTE of the cover substrate to prevent the carrier substrate and the cover substrate from becoming detached from one another due to differing rates of thermal expansion during processing in the vacuum chamber. The carrier substrate has a surface contact area in contact with the cover substrate selected to provide for continuous bonding during the processing in the vacuum chamber and to provide for de-bonding after the process in the vacuum chamber is complete. Further, the carrier substrate is prepared for use with a cleaning process that facilitates Van der Waals bonding between the carrier substrate and the cover substrate.

An apparatus for transportation of a substrate carrier in a vacuum chamber is provided. The apparatus includes a first track providing a first transportation path for the substrate carrier, and a transfer device configured for contactlessly moving the substrate carrier from a first position on the first track to one or more second positions away from the first track. The one or more second positions include at least one of a position on a second track and a process position for processing of a substrate. The transfer device includes at least one first magnet device configured to provide a magnetic force acting on the substrate carrier to contactlessly move the substrate carrier from the first position to the one or more second positions.

An apparatus for transportation of a substrate carrier in a vacuum chamber is provided. The apparatus includes a first track providing a first transportation path for the substrate carrier, and a transfer device configured for contactlessly moving the substrate carrier from a first position on the first track to one or more second positions away from the first track. The one or more second positions include at least one of a position on a second track and a process position for processing of a substrate. The transfer device includes at least one first magnet device configured to provide a magnetic force acting on the substrate carrier to contactlessly move the substrate carrier from the first position to the one or more second positions.

There is provided a sputtering apparatus in which a holding body holding a substrate by facing a target in a processing chamber is covered by a deposition preventive plate including a substrate retainer for covering a peripheral edge part of the substrate, and a thin film made of metal is deposited on a surface of the substrate exposed to an inside of the deposition preventive plate. A stopper protrusion protrudes at a portion in which the holding body and the deposition preventive plate face each other from one part to the other part, and face the holding body or the deposition preventive plate at a smaller interval than the interval between the deposition preventive plate and the substrate retainer. When the deposition preventive plate and the holding body are thermally deformed to approach each other during film deposition processing, the stopper protrusion contacts with the deposition preventive plate or the holding body, and the deposition preventive plate and the holding body contact with each other, such that, peeling-off a metal film at a contact portion and mixing in a film deposition region of the substrate are prevented.

There is provided a sputtering apparatus in which a holding body holding a substrate by facing a target in a processing chamber is covered by a deposition preventive plate including a substrate retainer for covering a peripheral edge part of the substrate, and a thin film made of metal is deposited on a surface of the substrate exposed to an inside of the deposition preventive plate. A stopper protrusion protrudes at a portion in which the holding body and the deposition preventive plate face each other from one part to the other part, and face the holding body or the deposition preventive plate at a smaller interval than the interval between the deposition preventive plate and the substrate retainer. When the deposition preventive plate and the holding body are thermally deformed to approach each other during film deposition processing, the stopper protrusion contacts with the deposition preventive plate or the holding body, and the deposition preventive plate and the holding body contact with each other, such that, peeling-off a metal film at a contact portion and mixing in a film deposition region of the substrate are prevented.

An apparatus for transportation of a substrate is provided. The apparatus includes a vacuum chamber having a chamber wall configured to separate a vacuum side from an atmospheric side and a magnetic levitation system configured for a contactless levitation of a substrate carrier in the vacuum chamber. The magnetic levitation system includes at least one magnetic device configured for providing a magnetic force acting on the substrate carrier during transportation of the substrate carrier in the vacuum chamber along a transportation path and at least one holding unit configured to hold the at least one magnetic device being accessible from the atmospheric side.