A film forming apparatus according to an embodiment includes: a process chamber forming a film on a substrate; an abatement device detoxifying a first exhaust gas exhausted from the process chamber; a first supply pipe for supplying a gas containing water to the process chamber; a first vacuum pump provided in a first flow path of the first exhaust gas between the process chamber and the abatement device; a second vacuum pump provided in the first flow path between the first vacuum pump and the abatement device; and a first detector provided in the first flow path between the second vacuum pump and the abatement device and capable of detecting a hydrogenated gas.

An evaporation device is disclosed, which includes a crucible body, which is a hollow plate including a cavity; a plurality of discharge pipes evenly distributed on a bottom surface of the crucible body, wherein an outlet at one end of each of the plurality of discharge pipes is communicated with the cavity, and the outlet at another end of each of the plurality of discharge pipes faces a ground; a plurality of crucible barrels, each of the crucible barrels is disposed between two or more of adjacent ones of the discharge pipes and includes a barrel opening connected to the cavity of the hollow plate; and a plurality of inlets arranged on a top surface of the crucible body and communicated with the cavity, wherein each of the plurality of inlets is arranged opposite to the barrel opening of each of the plurality of crucible barrels.

An evaporation device is disclosed, which includes a crucible body, which is a hollow plate including a cavity; a plurality of discharge pipes evenly distributed on a bottom surface of the crucible body, wherein an outlet at one end of each of the plurality of discharge pipes is communicated with the cavity, and the outlet at another end of each of the plurality of discharge pipes faces a ground; a plurality of crucible barrels, each of the crucible barrels is disposed between two or more of adjacent ones of the discharge pipes and includes a barrel opening connected to the cavity of the hollow plate; and a plurality of inlets arranged on a top surface of the crucible body and communicated with the cavity, wherein each of the plurality of inlets is arranged opposite to the barrel opening of each of the plurality of crucible barrels.

A roller for transporting a flexible substrate is described. The roller includes a first coolant supply for cooling a first part of the roller and a second coolant supply for cooling a second part and a third part of the roller. The first part is provided between the second part and the third part. Additionally, a vacuum processing apparatus including a roller and a method of cooling a roller are described.

A roller for transporting a flexible substrate is described. The roller includes a first coolant supply for cooling a first part of the roller and a second coolant supply for cooling a second part and a third part of the roller. The first part is provided between the second part and the third part. Additionally, a vacuum processing apparatus including a roller and a method of cooling a roller are described.

A device and method for producing a thin-film catalyst are provided. The device includes a vacuum chamber, a plurality of evaporators, a plurality of gas guide pipes, an ion generator, and a control unit. The plurality of evaporators are configured to evaporate at least one film material. The plurality of gas guide pipes are configured to introduce a reactive gas. The ion generator is configured to ionize the reactive gas and the evaporated film material. The control unit is configured to control the vacuum chamber to be vacuumed, control at least two evaporators of the plurality of evaporators to be simultaneously started, control the plurality of gas guide pipes to introduce the reactive gas, and control an ion source current of the ion generator to be adjusted, such that the evaporated film material reacts with the reactive gas to form a catalytic film layer on a surface of a substrate.

A deposition apparatus is provided, including a deposition chamber, at least one target, at least one substrate holder, and at least one adjustment plate. The at least one target, the at least one substrate holder, and the at least one adjustment plate are disposed in the deposition chamber, and the at least one adjustment plate is disposed between the at least one target and the at least one substrate holder. The at least one substrate holder includes a base portion, a first supporting portion, and a second supporting portion. The base portion has a flat surface. The first supporting portion is disposed on the flat surface and includes a curved surface. The second supporting portion is disposed on the flat surface and protrudes from it.

Apparatus and methods for flipping substrates in vacuum between PVD sputtering of each side for increasing throughput are provided herein. In some embodiments disclosed herein, a module of a processing system for flipping a substrate in vacuum is provided. The module includes a clamp assembly for securing the substrate, a motor assembly coupled to the substrate clamp assembly, for rotating the clamp assembly, a lift pin assembly, and a lift pin actuator for raising and lowering the lift pin assembly.

In one aspect, a system for depositing a film on a substrate is disclosed, which comprises at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive species. The system further includes an inner cooling cylinder and a substrate cylinder, where the inner cooling cylinder is fixedly positioned relative to the substrate cylinder, and the substrate cylinder at least partially surrounds the inner cooling cylinder. At least one mount is coupled to the substrate cylinder for mounting one or more substrates to the substrate cylinder.

In one aspect, a system for depositing a film on a substrate is disclosed, which comprises at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive species. The system further includes an inner cooling cylinder and a substrate cylinder, where the inner cooling cylinder is fixedly positioned relative to the substrate cylinder, and the substrate cylinder at least partially surrounds the inner cooling cylinder. At least one mount is coupled to the substrate cylinder for mounting one or more substrates to the substrate cylinder.