Systems for depositing coatings onto surfaces of molds and other articles are generally provided. In some embodiments, a system is adapted and arranged to cause gaseous species to flow parallel to a filament array. In some embodiments, a system comprises one or more mold supports that are translatable.

A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

A vapor deposition device capable of reciprocating rotation and lifting is disclosed. The vapor deposition device includes a vapor deposition cavity, a base station, a base shaft, a telescopic assembly, a passive lifting rotation member, a rotation mechanism, and a lifting mechanism. The rotation mechanism is fixedly connected with the telescopic assembly, and configured to drive the telescopic assembly to perform a reciprocating rotational motion, which in turn drives the base station, the base shaft, and the passive lifting rotation member to perform a reciprocating rotational motion in sequence. The lifting mechanism is rotatably and slidably connected with the passive lifting rotation member, and configured to drive the passive lifting rotation member to move up and down, which in turn drives the base shaft and the base station to move up and down. The telescopic assembly extends when the base station ascends and shortens when the base station descends.

An apparatus for manufacturing a semiconductor device may include a chamber, a chuck provided in the chamber, and a biased power supply physically connected with the chuck. The apparatus may include a target component provided over the chuck and the biased power supply, and a magnetron assembly provided over the target component. The magnetron assembly may include a plurality of outer magnetrons and a plurality of inner magnetrons, and a spacing between each adjacent magnetrons of the plurality of outer magnetrons may be different from a spacing between each adjacent magnetrons of the plurality of inner magnetrons.

Structures and methods for manufacturing photovoltaic devices by forming perovskite layers and perovskite precursor layers using vapor transport deposition (VTD) are described.

Structures and methods for manufacturing photovoltaic devices by forming perovskite layers and perovskite precursor layers using vapor transport deposition (VTD) are described.

A planetary rotation system for coating includes a solar orbiter plate configured to rotate about a solar axis. A lunar rotation system is mounted to the solar orbiter plate. The lunar rotation system includes a lunar orbiter plate configured to rotate about a planetary axis. A plurality of lunar substrate holders is mounted on the lunar orbiter plate. Respective lunar substrate holders include a lunar axis extending centrally therethrough. The respective lunar axes are configured to rotate about the planetary axis. The respective ones of the lunar substrate holders are configured to rotate about their respective lunar axis and to hold a substrate for coating.

Sputtering machines and substrate holders for such systems are described which include one or more magnets apart from the magnets typical of sputtering guns. The added magnets produce a magnetic field bias which is a new means for controlling depositional flux. ionization degree of a sputtered species. and microstructure properties of deposited coatings. An exemplary substrate holder may have a magnet or magnet array near or next to the surface supporting the substrate, and the magnet may assume multiple different magnetic field configurations depending on the desired properties of the resulting magnetic field bias within the reaction chamber.

Sputtering machines and substrate holders for such systems are described which include one or more magnets apart from the magnets typical of sputtering guns. The added magnets produce a magnetic field bias which is a new means for controlling depositional flux. ionization degree of a sputtered species. and microstructure properties of deposited coatings. An exemplary substrate holder may have a magnet or magnet array near or next to the surface supporting the substrate, and the magnet may assume multiple different magnetic field configurations depending on the desired properties of the resulting magnetic field bias within the reaction chamber.