A film forming apparatus includes: a chamber main body defining a chamber; a slit plate partitioning the chamber into a first space and a second space below the first space, the slit plate having a slit penetrating therethrough; a holder holding a target in the first space; a stage for supporting a substrate, the stage being movable in a moving direction perpendicular to a longitudinal direction of the slit in a moving area including an area directly below the slit; and a mechanism for moving the stage along the moving direction. In order to suppress scattering of particles from the target to another area other than the moving area in the second space through the slit, the stage has one or more protruding portions which provide upwardly and/or downwardly bent portions in a path around the stage between the slit and the another area in the second space.

A sputtering apparatus according to one embodiment of the present invention includes a substrate holder, a cathode unit arranged at a position diagonally opposite to the substrate holder, a position sensor for detecting a rotational position of the substrate, and a holder rotation controller for adjusting a rotation speed of the substrate according to the detected rotational position. The holder rotation controller controls the rotation speed so that the rotation speed of the substrate when the cathode unit is located on a side in a first direction as an extending direction of a process target surface of the relief structure is lower than the rotation speed of the substrate when the cathode unit is located on a side in a second direction which is perpendicular to the first direction along the rotation of the substrate.

A device for holding at least one substrate in a process chamber of a CVD or PVD reactor includes a flat upper side on which at least one bearing area for the at least one substrate is located. An outline contour line corresponding to the outline contour of the substrate is flanked by positioning edges for positioning a respective section of an edge of the substrate. The device further includes carrying protrusions projecting from a bearing area base surface of the bearing area that is surrounded by the outline contour line. The carrying protrusions have contact surfaces that are raised in relation to the bearing area base surface, on which contact surfaces the substrate can be placed. In order to improve the temperature homogeneity of the surface of the substrate, each of the carrying protrusions originate from a recess of the bearing area base surface.

A device for holding at least one substrate in a process chamber of a CVD or PVD reactor includes a flat upper side on which at least one bearing area for the at least one substrate is located. An outline contour line corresponding to the outline contour of the substrate is flanked by positioning edges for positioning a respective section of an edge of the substrate. The device further includes carrying protrusions projecting from a bearing area base surface of the bearing area that is surrounded by the outline contour line. The carrying protrusions have contact surfaces that are raised in relation to the bearing area base surface, on which contact surfaces the substrate can be placed. In order to improve the temperature homogeneity of the surface of the substrate, each of the carrying protrusions originate from a recess of the bearing area base surface.

A dyeing device dyes a resin body by vaporizing and depositing a sublimation dye adhered to a dyeing base to a resin body and fixing the dye to the resin body. The dyeing device lowers the pressure inside a closed chamber that closes the periphery of the resin body by a pump. In the state where the adhesion surface of the dyeing base to which the dye is adhered faces the resin body without contact, by heating the dye adhered to the dyeing base inside the closed chamber of which the pressure is lowered, the dye is sublimated, vaporized, and deposited on the resin body. The pressure inside the closed chamber is raised higher than the pressure at the vaporizing and depositing time. By irradiating the resin body on which the dye is vaporized and deposited with electromagnetic wave, the resin body is heated and the dye is and fixed.

A dyeing device dyes a resin body by vaporizing and depositing a sublimation dye adhered to a dyeing base to a resin body and fixing the dye to the resin body. The dyeing device lowers the pressure inside a closed chamber that closes the periphery of the resin body by a pump. In the state where the adhesion surface of the dyeing base to which the dye is adhered faces the resin body without contact, by heating the dye adhered to the dyeing base inside the closed chamber of which the pressure is lowered, the dye is sublimated, vaporized, and deposited on the resin body. The pressure inside the closed chamber is raised higher than the pressure at the vaporizing and depositing time. By irradiating the resin body on which the dye is vaporized and deposited with electromagnetic wave, the resin body is heated and the dye is and fixed.

An apparatus for depositing a coating on a part comprises: a chamber; a source of the coating material, positioned to communicate the coating material to the part in the chamber; a plurality of thermal hoods; and means for moving a hood of the plurality of thermal hoods from an operative position and replacing the hood with another hood of the plurality of hoods.

An apparatus and method for the evaporation and deposition of materials onto a substrate. A source material may be attached to a rope filament inside a vacuum chamber. A mechanism may be controlled for heating the rope filament and evaporating the source material. Parts for coating may be loaded into a part carrier. A motor mechanism may be controlled for rotating the part carrier. The evaporated source material may be deposited on the parts in the part carrier. The rate of the deposition may be controlled in part by controlling the power source.

An apparatus and method for the evaporation and deposition of materials onto a substrate. A source material may be attached to a rope filament inside a vacuum chamber. A mechanism may be controlled for heating the rope filament and evaporating the source material. Parts for coating may be loaded into a part carrier. A motor mechanism may be controlled for rotating the part carrier. The evaporated source material may be deposited on the parts in the part carrier. The rate of the deposition may be controlled in part by controlling the power source.

A manufacturing method of a display device is provided. The manufacturing method includes: forming a first electrode over a substrate; forming an organic layer over the first electrode; and forming a second electrode over the organic layer by sputtering a target including a conductive oxide with a light-transmitting property. A mask is arranged between the organic layer and the target when the second electrode is formed. The mask has periodically arranged through holes with a maximum width equal to or larger than 0.1 ?m and equal to or smaller than 3 ?m.