Systems and methods provide for the improvement of surface properties via deposition of a film. A typical film may comprise at least three, including at least four components, and typically includes at least one of, including both of, Nitrogen and Oxygen. A film may include at least one of Silicon, Phosphorous, and Boron, and one or more modifiers. For some films, a modifier may include an element having a cationic field strength greater than 10 -2. A film may have a high hardness and/or modulus. A film, may be substantially transparent to visible light. Some films have high refractive indices. Some films have low refractive indices. Some films have very low ultraviolet extinction coefficients.

There is described an intaglio printing plate coating apparatus comprising a vacuum chamber having an inner space adapted to receive at least one intaglio printing plate to be coated, a vacuum system coupled to the vacuum chamber adapted to create vacuum in the inner space of the vacuum chamber, and a physical vapour deposition (PVD) system adapted to perform deposition of wear-resistant coating material under vacuum onto an engraved surface of the intaglio printing plate, which physical vapour deposition system includes at least one coating material target comprising a source of the wear-resistant coating material to be deposited onto the engraved surface of the intaglio printing plate. The vacuum chamber is arranged so that the intaglio printing plate to be coated sits substantially vertically in the inner space of the vacuum chamber with its engraved surface facing the at least one coating material target. The intaglio printing plate coating apparatus further comprises a movable carrier located within the inner space of the vacuum chamber and adapted to support and cyclically move the intaglio printing plate in front of and past the at least one coating material target.

According to one embodiment, a method for producing a coated glass article may include applying an anti-reflective coating onto a glass substrate. The glass substrate may include a first major surface, and a second major surface opposite the first major surface. The anti-reflective coating may be applied to the first major surface of the glass substrate. A substrate thickness may be measured between the first major surface and the second major surface. The glass substrate may have an aspect ratio of at least about 100:1. The coated glass article may have a reflectance of less than 2% for all wavelengths from 450 nanometers to 700 nanometers. The anti-reflective coating may include one or more layers. The cumulative layer stress of the anti-reflective coating may have an absolute value less than or equal to about 167,000 MPa nm.

According to one embodiment, an apparatus of manufacturing a radiation detection panel, includes an evaporation source configured to evaporate a scintillator material and emit the scintillator material vertically upward, a holding mechanism located vertically above the evaporation source, and holding a photoelectric conversion substrate, and a heat conductor arranged opposite to the holding mechanism with a gap.

A high throughput deposition apparatus includes a first process chamber; one or more first deposition sources in the first process chamber; a first main carrier comprising a plurality of first sub-carriers each configured to carry one or more substrate each positioned around an axial direction and configured to receive a first deposition material from the one or more first deposition sources, wherein the first sub-carriers define a curved surface around the axial direction; and a transport mechanism configured to move the first main carrier along the axial direction through the first process chamber.

A high throughput deposition apparatus includes a first process chamber; one or more first deposition sources in the first process chamber; a first main carrier comprising a plurality of first sub-carriers each configured to carry one or more substrate each positioned around an axial direction and configured to receive a first deposition material from the one or more first deposition sources, wherein the first sub-carriers define a curved surface around the axial direction; and a transport mechanism configured to move the first main carrier along the axial direction through the first process chamber.

This disclosure is directed to an optic having a composited MgOMgF.sub.2 infrared anti-reflective coating that is suitable for use in LWIR, MWIR and SWIR ranges, and is particularly suitable for use in the LWIR range. The coated optic disclosed herein passes the severe abrasion test with a barring force between 2 pounds and 2.5 pounds. The MgOMgF.sub.2 infrared anti-reflective coating has a thickness in the range of 500 nm to 1500 nm and a reflectance value R.sub.x at 12 of less than 2% in the wavelength range of 7.25 nm to 11.75 nm.

The disclosure is an evaporation apparatus and a method of evaporation using the same. The evaporation apparatus includes an evaporation chamber, an evaporation source, a carrying device, and a fluid disturbance device. The evaporation chamber has an evaporation space, the evaporation source is disposed at a lower part in the evaporation space, and the evaporation source is suitable for accommodating an evaporation source material. The carrying device is disposed to be rotatable about a reference axis as the center at an upper part in the evaporation space and is opposite to the evaporation source; the carrying device is suitable for carrying a substrate and positions the substrate between the evaporation source and the carrying device. The fluid disturbance device is suitable for injecting a disturbed fluid towards the carrying device in the evaporation space.

In a plasma enhanced physical vapor deposition of a material onto workpiece, a metal target faces the workpiece across a target-to-workpiece gap less than a diameter of the workpiece. A carrier gas is introduced into the chamber and gas pressure in the chamber is maintained above a threshold pressure at which mean free path is less than 5% of the gap. RF plasma source power from a VHF generator is applied to the target to generate a capacitively coupled plasma at the target, the VHF generator having a frequency exceeding 30 MHz. The plasma is extended across the gap to the workpiece by providing through the workpiece a first VHF ground return path at the frequency of the VHF generator.

In a plasma enhanced physical vapor deposition of a material onto workpiece, a metal target faces the workpiece across a target-to-workpiece gap less than a diameter of the workpiece. A carrier gas is introduced into the chamber and gas pressure in the chamber is maintained above a threshold pressure at which mean free path is less than 5% of the gap. RF plasma source power from a VHF generator is applied to the target to generate a capacitively coupled plasma at the target, the VHF generator having a frequency exceeding 30 MHz. The plasma is extended across the gap to the workpiece by providing through the workpiece a first VHF ground return path at the frequency of the VHF generator.