Apparatuses suitable for etching substrates at various pressure regimes are described herein. Apparatuses include a process chamber including a movable pedestal capable of being positioned at a raised position or a lowered position, showerhead, and optional plasma generator. Apparatuses may be suitable for etching non-volatile metals using a treatment while the movable pedestal is in the lowered position and a high pressure exposure to organic vapor while the movable pedestal is in the raised position.

A magnetron sputtering device is disclosed and includes a magnetic levitation track and a supporter which is levitated on the magnetic levitation track. The supporter includes a magnetic track fixed on the supporter via a plurality of pads; each of the pads includes a first insulation plate and a second insulation plate, the first insulation plate and the magnetic track are connected via a first fastener, the second insulation plate and the supporter are connected via a second fastener, and the second fastener and the first fastener are not in contact with each other; the first insulation plate and the second insulation plate are connected via a third fastener, the third fastener is not in contact with both the magnetic track and the supporter, and the third fastener is not in contact with both the first fastener and the second fastener.

A magnetron sputtering device is disclosed and includes a magnetic levitation track and a supporter which is levitated on the magnetic levitation track. The supporter includes a magnetic track fixed on the supporter via a plurality of pads; each of the pads includes a first insulation plate and a second insulation plate, the first insulation plate and the magnetic track are connected via a first fastener, the second insulation plate and the supporter are connected via a second fastener, and the second fastener and the first fastener are not in contact with each other; the first insulation plate and the second insulation plate are connected via a third fastener, the third fastener is not in contact with both the magnetic track and the supporter, and the third fastener is not in contact with both the first fastener and the second fastener.

Substrate holders having support plates for mounting of substrates are disclosed. The substrate holders use a combination of spring clamping elements and pins to grip the substrates. The substrate edge contact height of the spring clamping elements and pins may be selected such that upper portions of the side edges of the substrates are substantially unobstructed, allowing coating to be applied to upper surfaces and upper portions of the side edges of the substrates contemporaneously.

The invention relates to a loading device for workpieces (16) in a coating system (10) and a method for loading the workpieces (16). An upright stand (22) has a number of openings (24) arranged above one another in an outward-facing surface (44). A number of insertion sleeves (30) are provided for accommodation in the openings (24), with the insertion sleeves (30) each having a shaft (32) and a retaining structure (24) as well as a borehole (26) to accommodate a workpiece (16). The openings (24) and the shafts (32) of the insertion sleeves (30) are designed such that the insertion sleeves (30) are insertable through the openings (24). The openings (24) and the retaining structures (34) are designed such that holding engagement occurs between the insertion sleeves (30) and the openings (24).

The invention relates to a loading device for workpieces (16) in a coating system (10) and a method for loading the workpieces (16). An upright stand (22) has a number of openings (24) arranged above one another in an outward-facing surface (44). A number of insertion sleeves (30) are provided for accommodation in the openings (24), with the insertion sleeves (30) each having a shaft (32) and a retaining structure (24) as well as a borehole (26) to accommodate a workpiece (16). The openings (24) and the shafts (32) of the insertion sleeves (30) are designed such that the insertion sleeves (30) are insertable through the openings (24). The openings (24) and the retaining structures (34) are designed such that holding engagement occurs between the insertion sleeves (30) and the openings (24).

Embodiments of the present invention relate to the field of display technology and disclose a back plate clamping device, an alignment device and an evaporation equipment. In one embodiment, a back plate clamping device includes a framework, an upper clamping plate mounted to the framework, and a lower clamping plate assembly. The lower clamping plate assembly includes a stand, a plurality of support plates and a plurality of elastic support structures that are provided in an one-to-one correspondence with the support plates. A surface of each support plate facing away from the corresponding elastic support structure is formed with a supporting face, and, each support plate is mounted to the stand and is movable in a direction perpendicular to a plane where the supporting face is located. And, the stand is mounted to the framework and is movable in the direction perpendicular to the plane.

Embodiments of the present invention relate to the field of display technology and disclose a back plate clamping device, an alignment device and an evaporation equipment. In one embodiment, a back plate clamping device includes a framework, an upper clamping plate mounted to the framework, and a lower clamping plate assembly. The lower clamping plate assembly includes a stand, a plurality of support plates and a plurality of elastic support structures that are provided in an one-to-one correspondence with the support plates. A surface of each support plate facing away from the corresponding elastic support structure is formed with a supporting face, and, each support plate is mounted to the stand and is movable in a direction perpendicular to a plane where the supporting face is located. And, the stand is mounted to the framework and is movable in the direction perpendicular to the plane.

A wafer processing apparatus includes a holder which holds a wafer by sandwiching an outer circumferential surplus region of the wafer between a face side and a reverse side thereof, a vacuum chamber which houses the holder therein such that the wafer held by the holder defines an upper compartment and a lower compartment in the vacuum chamber, an evacuating unit which evacuates the upper compartment and the lower compartment and developing a positive pressure in the lower compartment with respect to the upper compartment to cancel out flexing of the wafer held by the holder, and a processing unit which is disposed in the vacuum chamber to perform a predetermined process on the wafer held by the holder.

A wafer processing apparatus includes a holder which holds a wafer by sandwiching an outer circumferential surplus region of the wafer between a face side and a reverse side thereof, a vacuum chamber which houses the holder therein such that the wafer held by the holder defines an upper compartment and a lower compartment in the vacuum chamber, an evacuating unit which evacuates the upper compartment and the lower compartment and developing a positive pressure in the lower compartment with respect to the upper compartment to cancel out flexing of the wafer held by the holder, and a processing unit which is disposed in the vacuum chamber to perform a predetermined process on the wafer held by the holder.