Systems for depositing coatings onto surfaces of molds and other articles are generally provided. In some embodiments. a system is adapted and arranged to cause gaseous species to flow parallel to a filament array. In some embodiments, a system comprises one or more mold supports that are translatable.

Systems for depositing coatings onto surfaces of molds and other articles are generally provided. In some embodiments. a system is adapted and arranged to cause gaseous species to flow parallel to a filament array. In some embodiments, a system comprises one or more mold supports that are translatable.

Systems for depositing coatings onto surfaces of molds and other articles are generally provided. In some embodiments, a system is adapted and arranged to cause gaseous species to flow parallel to a filament array. In some embodiments, a system comprises one or more mold supports that are translatable.

Systems for depositing coatings onto surfaces of molds and other articles are generally provided. In some embodiments, a system is adapted and arranged to cause gaseous species to flow parallel to a filament array. In some embodiments, a system comprises one or more mold supports that are translatable.

An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface.

An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface.

The invention concerns a physical vapor deposition machine for depositing a coating onto at least one article, comprising: an article support member disposed within a chamber and configured to receive a plurality of articles disposed thereto to be coated, at least one thermal evaporator in said chamber and configured to generate a flow of vaporized material to coat said plurality of articles with said flow of vaporized material, wherein said at least one thermal evaporator comprises: .Math.two electrical electrodes each electrically connected to an electrical generator, .Math.a cup for receiving material to be vaporized, said cup being formed by an electrically conductive material and configured to be in electrical contact with each of said two electrical electrodes to form an electrical circuit, said generator being configured to provide a current through said electrical circuit able to heat-up said cup so as to vaporize said material received into said cup.

The invention concerns a physical vapor deposition machine for depositing a coating onto at least one article, comprising: an article support member disposed within a chamber and configured to receive a plurality of articles disposed thereto to be coated, at least one thermal evaporator in said chamber and configured to generate a flow of vaporized material to coat said plurality of articles with said flow of vaporized material, wherein said at least one thermal evaporator comprises: .Math.two electrical electrodes each electrically connected to an electrical generator, .Math.a cup for receiving material to be vaporized, said cup being formed by an electrically conductive material and configured to be in electrical contact with each of said two electrical electrodes to form an electrical circuit, said generator being configured to provide a current through said electrical circuit able to heat-up said cup so as to vaporize said material received into said cup.

A method includes detecting a location of a particle on a bottom surface of an electrostatic chuck; moving a platform to a position under the bottom surface of the electrostatic chuck and right under the particle; and rotating the platform about a center of the platform to remove the particle from the bottom surface of the electrostatic chuck.

Embodiments of the present disclosure generally relate to apparatus, systems, and methods for in-situ film growth rate monitoring. A thickness of a film on a substrate is monitored during a substrate processing operation that deposits the film on the substrate. The thickness is monitored while the substrate processing operation is conducted. The monitoring includes directing light in a direction toward a crystalline coupon. The direction is perpendicular to a heating direction. In one implementation, a reflectometer system to monitor film growth during substrate processing operations includes a first block that includes a first inner surface. The reflectometer system includes a light emitter disposed in the first block and oriented toward the first inner surface, and a light receiver disposed in the first block and oriented toward the first inner surface. The reflectometer system includes a second block opposing the first block.