Described are various embodiments of a system and method for controlling film thickness, and a film deposition system and method using same. In one such embodiments, a vapour deposition system for spatially controlling a deposited film thickness on a substrate comprises: an emission source; a substrate holder; and a translatable shutter comprising a flux barrier disposed between said emission source and the substrate and operable to translate said flux barrier through a deposition flux according to a designated linear translation profile designated to spatially control the deposited film thickness.

Described are various embodiments of a system and method for controlling film thickness, and a film deposition system and method using same. In one such embodiments, a vapour deposition system for spatially controlling a deposited film thickness on a substrate comprises: an emission source; a substrate holder; and a translatable shutter comprising a flux barrier disposed between said emission source and the substrate and operable to translate said flux barrier through a deposition flux according to a designated linear translation profile designated to spatially control the deposited film thickness.

A vapor deposition system includes a drum. The drum includes a generally cylindrical drum core. A process ring is fixedly disposed on the drum core at a position radially outward of the drum core. The process ring includes an inner face that extends radially, an outer face that extends radially opposite the inner face, and an outer-facing surface extending between the inner face and the outer face. The outer-facing surface has a plurality of axial channels formed therethrough. A plurality of fluid coolant passages extends through the process ring. An annular gas channel is in communication with the plurality of axial channels. A fluid conduit assembly is configured to supply a fluid coolant to the fluid coolant passages and a thermal coupling gas to the annular gas channel. The axial channels direct thermal coupling gas toward the substrate.

Structures and methods for manufacturing photovoltaic devices by forming perovskite layers and perovskite precursor layers using vapor transport deposition (VTD) are described.

Structures and methods for manufacturing photovoltaic devices by forming perovskite layers and perovskite precursor layers using vapor transport deposition (VTD) are described.

A device for conveying a sheet of substrate having two opposed main faces linked b y an edge face, wherein one of the main faces of the sheet of substrate is positioned along a reception plane of the device, the reception plane being close to a vertical plane, including a plurality of lower rollers positioned side by side along a conveying direction, each of them being able to rotate about a lower rotation axis extending perpendicularly to the conveying direction in a conveying plane and being arranged to receive a part of the edge face of the sheet of substrate, a plurality of upper rollers, each of them being arranged to receive one of said main faces of the sheet of substrate and being able to rotate about an upper rotation axis orthogonal to the conveying direction.

A device for conveying a sheet of substrate having two opposed main faces linked b y an edge face, wherein one of the main faces of the sheet of substrate is positioned along a reception plane of the device, the reception plane being close to a vertical plane, including a plurality of lower rollers positioned side by side along a conveying direction, each of them being able to rotate about a lower rotation axis extending perpendicularly to the conveying direction in a conveying plane and being arranged to receive a part of the edge face of the sheet of substrate, a plurality of upper rollers, each of them being arranged to receive one of said main faces of the sheet of substrate and being able to rotate about an upper rotation axis orthogonal to the conveying direction.

A vacuum apparatus to deposit a compound layer on at least one plate shaped substrate by sputtering. The apparatus including a vacuum chamber with side walls around a central axis. The chamber includes at least one inlet for a process gas, at least one inlet for an inert gas, a substrate handling opening, a pedestal including an electrostatic chuck formed as a substrate support in a central lower area of a sputter compartment, a magnetron sputter source including the target at the frontside and a magnet-system at the backside of the source, an anode looping around the target and at least an upper part of the pedestal and a pump compartment connected to a bottom of the sputter compartment by a flow labyrinth. A vacuum pump system is connected to the pump compartment.

A vacuum apparatus to deposit a compound layer on at least one plate shaped substrate by sputtering. The apparatus including a vacuum chamber with side walls around a central axis. The chamber includes at least one inlet for a process gas, at least one inlet for an inert gas, a substrate handling opening, a pedestal including an electrostatic chuck formed as a substrate support in a central lower area of a sputter compartment, a magnetron sputter source including the target at the frontside and a magnet-system at the backside of the source, an anode looping around the target and at least an upper part of the pedestal and a pump compartment connected to a bottom of the sputter compartment by a flow labyrinth. A vacuum pump system is connected to the pump compartment.

A substrate processing device is provided. The substrate processing device includes a processing container including a mounting table, a refrigeration device disposed to have a gap between the mounting table and the refrigeration device, a first elevating device configured to raise or lower the refrigeration device, a refrigerant flow path to supply a refrigerant to the gap, a compression device configured to compress the refrigerant supplied to the refrigerant flow path, and refrigerant transfer pipes connected to both a first connection-fixing unit which is a flow path port of the refrigerant flow path and a second connection-fixing unit fluid-communicating with the compression device. Further, each of the refrigeration transfer pipes extends such that at least a portion of the refrigerant transfer pipe is curved between the first and second connection-fixing units, and each of the refrigerant transfer pipes is placed on a support member at the second connection-fixing unit.