A substrate cleaning apparatus that cleans a processing target substrate by blasting the gas clusters to the processing target substrate. The apparatus includes: a chamber configured to accommodate the processing target substrate; a rotary stage configured to rotatably support the processing target substrate in the chamber; an blasting unit configured to blast the gas clusters to the processing target substrate supported by the rotary stage; a driving unit configured to scan a gas cluster-blasted position on the processing target substrate; an exhaust port configured to evacuate the chamber; and a control mechanism configured to control a scattering direction of particles by controlling a rotation direction of the processing target substrate by the rotary stage and a scanning direction of the gas cluster-blasted position, thereby suppressing re-adhesion of the particles to the processing target substrate.

A coating device that can control a coating thickness distribution along the circumferential direction of a work is provided. The coating device includes a work turning device that holds a plurality of works to rotate and revolve the works, a target having an emission face from which particles come out as a material of a coating formed on an outer circumferential face of each of the works, a power source that supplies an arc current to the target to cause the particles to come out of the target, and a controller that controls the power source to set the arc current in a particular period to be higher than a reference output, the particular period being at least a portion of a period in which a particular portion of the rotating work faces the emission face.

A coating device that can control a coating thickness distribution along the circumferential direction of a work is provided. The coating device includes a work turning device that holds a plurality of works to rotate and revolve the works, a target having an emission face from which particles come out as a material of a coating formed on an outer circumferential face of each of the works, a power source that supplies an arc current to the target to cause the particles to come out of the target, and a controller that controls the power source to set the arc current in a particular period to be higher than a reference output, the particular period being at least a portion of a period in which a particular portion of the rotating work faces the emission face.

Fixture (1) for exposing two opposite ends of an object to be coated (6) to a vapor deposition while masking an intermediate portion (8) of the object against being coated, comprising an object holding device (OHD), whereas the object holding device (OHD) consists of at least one battery (3) of hole plate strips (2) which are designed and arranged that way that each single hole (retaining hole; H) is formed by a pair of hole plate strips (2) that way that the first segment (4) of the hole (H) is embodied by the preceding hole plate strip (2) and that the second segment (5) of the hole (H) is embodied by the subsequent hole plate strip (2).

Fixture (1) for exposing two opposite ends of an object to be coated (6) to a vapor deposition while masking an intermediate portion (8) of the object against being coated, comprising an object holding device (OHD), whereas the object holding device (OHD) consists of at least one battery (3) of hole plate strips (2) which are designed and arranged that way that each single hole (retaining hole; H) is formed by a pair of hole plate strips (2) that way that the first segment (4) of the hole (H) is embodied by the preceding hole plate strip (2) and that the second segment (5) of the hole (H) is embodied by the subsequent hole plate strip (2).

The present invention relates to a coating apparatus for coating a substrate of a substrate material with at least one material layer of a layer material. The present invention also relates to a process chamber for a coating apparatus for coating a substrate of a substrate material with at least one material layer of a layer material. The present invention further relates to a method of coating a substrate of a substrate material with at least one material layer of a layer material in a coating apparatus. A further aspect of the invention relates to a substrate coated with at least one material layer, comprising the substrate of a substrate material that is coated with at least one material layer of a layer material.

The present invention relates to a coating apparatus for coating a substrate of a substrate material with at least one material layer of a layer material. The present invention also relates to a process chamber for a coating apparatus for coating a substrate of a substrate material with at least one material layer of a layer material. The present invention further relates to a method of coating a substrate of a substrate material with at least one material layer of a layer material in a coating apparatus. A further aspect of the invention relates to a substrate coated with at least one material layer, comprising the substrate of a substrate material that is coated with at least one material layer of a layer material.

A sputter deposition method includes sputtering a first target material onto a web substrate moving through a first process module while heating the substrate, providing the substrate from the first process module to a connection unit containing a roller assembly including a plurality of cylindrical rollers, bending the substrate at an angle of 10° to 40° around the roller assembly in the connection unit, providing the substrate from the connection unit to a second process module, and sputtering a second target material onto the substrate moving through the second process module while heating the substrate.

A film forming apparatus includes: a processing chamber; a sputtered particle emitter; a substrate mounting unit; and a sputtered particle shielding plate that is provided between the sputtered particle emitter and the substrate mounting unit and has a passage hole that allows the sputtered particles emitted from the sputtered particle emitter to pass through and allows the sputtered particles to be obliquely incident on a substrate mounted on the substrate mounting unit.

An apparatus and a method for introducing an optical lens into a turning device are disclosed. The apparatus includes a carrier body and a carrier element for receiving the lens. The carrier element is arranged in the carrier body. The carrier element has a supporting surface for receiving the lens and is displaceably mounted in relation to the carrier body.