A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.

According to one embodiment, a processing substrate is prepared. An organic layer is formed. An etching stopper layer is formed. The forming the etching stopper layer includes, in a first mode, inclining an evaporation source, and depositing a material emitted from the evaporation source while relative positions of the evaporation source and the processing substrate are changed, and in a second mode, inclining the evaporation source in a manner different from the first mode, and depositing the material emitted from the evaporation source while the relative positions of the evaporation source and the processing substrate are changed in an opposite manner of the first mode.

According to one embodiment, a processing substrate is prepared. An organic layer is formed. An etching stopper layer is formed. The forming the etching stopper layer includes, in a first mode, inclining an evaporation source, and depositing a material emitted from the evaporation source while relative positions of the evaporation source and the processing substrate are changed, and in a second mode, inclining the evaporation source in a manner different from the first mode, and depositing the material emitted from the evaporation source while the relative positions of the evaporation source and the processing substrate are changed in an opposite manner of the first mode.

The present inventive concept relates to a deposition system including: a deposition device having a chamber, a seating plate located inside the chamber to seat a wafer, a magnet coupled to the underside of the seating plate, and a mask assembly located inside the chamber; and a transfer device having a load lock chamber for accommodating the wafer, an arm member for transferring the wafer from the load lock chamber to the seating plate, and a fourth driving module for moving the arm member, wherein the deposition device includes a first driving module for moving the magnet and the seating plate, a second driving module coupled to the first driving module to move the magnet, a third driving module for moving the wafer, and a control module for controlling the first driving module, the second driving module, the third driving module, and the fourth driving module.

The present inventive concept relates to a deposition system including: a deposition device having a chamber, a seating plate located inside the chamber to seat a wafer, a magnet coupled to the underside of the seating plate, and a mask assembly located inside the chamber; and a transfer device having a load lock chamber for accommodating the wafer, an arm member for transferring the wafer from the load lock chamber to the seating plate, and a fourth driving module for moving the arm member, wherein the deposition device includes a first driving module for moving the magnet and the seating plate, a second driving module coupled to the first driving module to move the magnet, a third driving module for moving the wafer, and a control module for controlling the first driving module, the second driving module, the third driving module, and the fourth driving module.

A deposition apparatus, which forms a film on a substrate, includes a rotation unit configured to rotate a target about a rotating axis; a striker configured to generate an arc discharge; a driving unit configured to drive the striker so as to make a close state which the striker closes to a side surface around the rotating axis of the target to generate the arc discharge; and a control unit configured to control rotation of the target by the rotation unit so as to change a facing position on the side surface of the target facing the striker in the close state.

The invention relates to an apparatus for the vapor deposition of a coating on optical articles, comprising a distribution mask (32) for controlling the vapor deposition of a coating on optical articles that is positioned in the path of some of the molecules emitted by said emitting source in the direction of the rotatable support for optical articles. The distribution mask (32) is fitted with at least one arm (34) positioned so as to mask at least one partial zone (16) of an individual housing (28) on a portion of the revolution turn, this masked partial zone (16) comprising the center of the individual housing (28).

According to one embodiment, a manufacturing method of a display device includes preparing a processing substrate, forming an organic layer, and forming an etching stopper layer on the organic layer. The forming the etching stopper layer includes carrying the processing substrate into a chamber, inside the chamber, emitting a material for forming the etching stopper layer from an evaporation source which inclines with respect to a normal of the processing substrate, and conveying the processing substrate while rotating the processing substrate in a plane orthogonal to the normal, and depositing the material emitted from the evaporation source on the processing substrate.

Embodiments of the present disclosure are related to carrier assemblies that can clamp more than one optical device substrates and methods for forming the carrier assemblies. The carrier assembly includes a carrier, one or more substrates, and a mask. The carrier is magnetically coupled to the mask to retain the one or more substrates. The carrier assembly is used for supporting and transporting the one or more substrates during processing. The carrier assembly is also used for masking the one or more substrates during PVD processing. Methods for assembling the carrier assembly in a build chamber are described herein.

Apparatus and methods for forming and using internally divisible physical vapor deposition (PVD) process chambers using shutter disks are provided herein. In some embodiments, an internally divisible process chamber may include an upper chamber portion having a conical shield, a conical adaptor, a cover ring, and a target, a lower chamber portion having a substrate support having inner and outer deposition rings, and wherein the substrate support is vertically movable, and a shutter disk assembly configured to internally divide the process chamber and create a separate sealed deposition cavity and a separate sealed oxidation cavity, wherein the shutter disk assembly includes one or more seals disposed along its outer edges and configured to contact at least one of the conical shield, the conical adaptor, or the deposition rings to form the separate sealed deposition and oxidation cavities.