A heater comprises a folded heater wire, a first insulator provided on the folded heater wire, a metal sheath in contact with a part of the first insulator, a first insulating member arranged in parallel to a part of a first end of the folded heater wire taken out from a first end of the metal sheath, a second insulating member arranged in parallel to a part of the first insulating member and parallel to a part of a second end of the folded heater wire taken out from the first end of the metal sheath, a third insulating member arranged in parallel to a part of the first insulating member and the second insulating member, and bundle the first insulating member and the second insulating member, and a cylindrical member arranged in parallel to a part of the metal sheath and the third insulating member.

The vacuum processing apparatus of this invention has: a vacuum chamber capable of forming vacuum atmosphere; and a stage for supporting inside the vacuum chamber a to-be-processed substrate. The stage has: a base to be selectively cooled; a chuck plate disposed on the base so as to electrostatically absorb the to-be-processed substrate; and a hot plate interposed between the base and the chuck plate, whereby the to-be-processed substrate electrostatically absorbed to the surface of the chuck plate is controlled to a predetermined temperature above the room temperature. The vacuum processing apparatus further has: a thermal insulation plate, disposed between the base and the hot plate, for restraining thermal transmission from the hot plate to the base. A high-emissivity layer having a higher emissivity than an upper surface of the base is disposed between the base and the thermal insulation plate.

The vacuum processing apparatus of this invention has: a vacuum chamber capable of forming vacuum atmosphere; and a stage for supporting inside the vacuum chamber a to-be-processed substrate. The stage has: a base to be selectively cooled; a chuck plate disposed on the base so as to electrostatically absorb the to-be-processed substrate; and a hot plate interposed between the base and the chuck plate, whereby the to-be-processed substrate electrostatically absorbed to the surface of the chuck plate is controlled to a predetermined temperature above the room temperature. The vacuum processing apparatus further has: a thermal insulation plate, disposed between the base and the hot plate, for restraining thermal transmission from the hot plate to the base. A high-emissivity layer having a higher emissivity than an upper surface of the base is disposed between the base and the thermal insulation plate.

A method and apparatus for forming a backside coating on a substrate to counteract stresses from a previously deposited film is disclosed. In one embodiment, a method for flattening a bowed substrate includes providing a substrate having a film stack formed on a first major surface thereof, wherein the substrate comprises a bowed orientation, and forming a coating a second major surface of the substrate, wherein the coating is configured to counter stresses produced by the film stack and flattens the substrate from the bowed orientation.

A stage device includes a stage having a copper main body and an electrostatic chuck, a cooling unit disposed below the stage, and a power supply mechanism for supplying power to an attraction electrode of the electrostatic chuck from a DC power supply disposed below the stage. The power supply mechanism includes a pair of terminals disposed at an outer peripheral portion of the stage while being spaced apart from each other, a first power supply line having a pair of metal rods spaced apart from each other while extending toward the stage and being connected to the DC power supply, a second power supply line having a pair of metal rods spaced apart from each other and connected to the terminals, and a connecting unit where the metal rods of the first power supply line and the metal rods of the second power supply line are connected.

A stage device includes a stage having a copper main body and an electrostatic chuck, a cooling unit disposed below the stage, and a power supply mechanism for supplying power to an attraction electrode of the electrostatic chuck from a DC power supply disposed below the stage. The power supply mechanism includes a pair of terminals disposed at an outer peripheral portion of the stage while being spaced apart from each other, a first power supply line having a pair of metal rods spaced apart from each other while extending toward the stage and being connected to the DC power supply, a second power supply line having a pair of metal rods spaced apart from each other and connected to the terminals, and a connecting unit where the metal rods of the first power supply line and the metal rods of the second power supply line are connected.

An assembly includes a cover ring having a first surface and a second surface opposite the first surface, the first surface of the cover ring having a first roughness, and a deposition ring having a first surface facing the cover ring and a second surface opposite the first surface, the first surface of the deposition ring having a second roughness. The first roughness is different from the second roughness.

A physical vapor deposition chamber a first target comprising a bottom surface, a top surface, a cross-sectional thickness defining a first target cross-sectional thickness between the top surface and the bottom surface, a first end and a second end opposite the first end, the cross-sectional thickness at the first end being less than the cross-sectional thickness at the second end. Methods of processing a substrate are also provided.

A deposition apparatus according to one aspect of the present disclosure includes a vacuum vessel, a rotary table rotatably disposed in the vacuum vessel, a heating device provided below the rotary table, and a radiation adjusting member. The rotary table is configured such that multiple substrates can be placed on the rotary table along a circumferential direction of the rotary table. The heating device is configured to heat the multiple substrates by thermal radiation, and the radiation adjusting member is configured to adjust an amount of radiant heat from the heating device to the plurality of substrates.

A transport system includes: a stator having coils each including a winding and a core; and a mover having magnets to move in the transport direction by electromagnetic force generated between the plurality of coils and the magnet, the stator and the mover have one and the other of first and second transport members, respectively, that guide the moving mover in the transport direction, the first transport member includes upper-side and lower-side transport members, a transport position of the mover is adjusted so that an upper face of at least one magnet is located below or above an equilibrium position where magnetic attractive force generated between the core and the magnet and gravity on the mover are balanced with each other, and the mover is transported in a state where the second transport member is in contact with the lower-side or upper-side transport member in accordance with the transport position.