A film formation apparatus according to an embodiment comprising: a substrate holder for holding a substrate in a standing position relative to the horizontal plane, the substrate having a vapor deposition surface on which a vapor deposition layer is formed; and an evaporation source to supply a vapor deposition material onto the vapor deposition surface while moving relative to the substrate holder upward and/or downward, the evaporation source being disposed in a region which the vapor deposition surface of the substrate held by the substrate holder is to face. The substrate holder is configured to hold the substrate in an inclined orientation relative to the vertical plane such that the upper end of the substrate is located away from the evaporation source. The apparatus further comprises an adjustment means for reducing a variation in the thickness of the vapor deposition layer, which results from the inclination of the substrate.

A manufacturing method of a deposition mask includes: a resin-layer forming step of forming a resin layer on one surface of a substrate by applying a resin solution to the surface of the substrate; a step of forming a non-contact area that is not in contact with the surface of the substrate in the resin layer by removing at least a part of the substrate; a step of bringing the resin layer into contact with a liquid or heating the resin layer after the non-contact area has been formed in the resin layer; and a resin-layer processing step of forming second opening in the resin layer by processing the resin layer after the step of bringing the resin layer into contact with a liquid or heating the resin layer.

Provided is a vacuum processing apparatus which is capable of performing baking processing of a deposition preventive plate without impairing the function of being capable of cooling the deposition preventive plate disposed inside a vacuum chamber. The vacuum processing apparatus has a vacuum chamber for performing a predetermined vacuum processing on a to-be-processed substrate that is set in position inside the vacuum chamber. A deposition preventive plate is disposed inside the vacuum chamber. Further disposed are: a metallic-made block body vertically disposed on an inner surface of the lower wall of the vacuum chamber so as to lie opposite to a part of the deposition preventive plate with a clearance thereto; a cooling means for cooling the block body; and a heating means disposed between the part of the deposition preventive plate and the block body to heat the deposition preventive plate by heat radiation.

The present disclosure discloses a method for preparing a bactericidal film having a silicon nitride binding layer on silicone. The whole process does not need high temperature, the film layers are plated without damaging the silicone. A binding film layer is plated using a silicon target and nitrogen, and a carrier layer is plated using the silicon target and acetylene gas. A silver target is initiated to allow silver ions to be uniformly distributed to form a bactericidal film layer. The silver target is kept sputtering to enable the silver ions to be uniformly distributed on the bactericidal layer, thus forming a composite layer with prominent bactericidal and antimould effects. The present disclosure protects a furnace from being damaged by avoiding the introduction of oxygen during production and prevents the generation of silver oxide caused by the residual oxygen in the furnace during the silver target's sputtering.

A substrate processing device is provided. The substrate processing device includes a processing container including a mounting table, a refrigeration device disposed to have a gap between the mounting table and the refrigeration device, a first elevating device configured to raise or lower the refrigeration device, a refrigerant flow path to supply a refrigerant to the gap, a compression device configured to compress the refrigerant supplied to the refrigerant flow path, and refrigerant transfer pipes connected to both a first connection-fixing unit which is a flow path port of the refrigerant flow path and a second connection-fixing unit fluid-communicating with the compression device. Further, each of the refrigeration transfer pipes extends such that at least a portion of the refrigerant transfer pipe is curved between the first and second connection-fixing units, and each of the refrigerant transfer pipes is placed on a support member at the second connection-fixing unit.

A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.

A deposition apparatus forms a material layer on a substrate in a deposition chamber. Provided in the deposition chamber are at least one deposition material providing device that provides a deposition material to the substrate, a deposition mask that defines a deposition area on the substrate, and a stage that supports the substrate. The stage is movable in X and Y directions in a plane parallel to the substrate.

A sputtering apparatus includes a base on which a substrate is mounted, an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without in contact with the substrate, and an edge cover that covers an outer edge of an upper surface of the substrate mounted on the base. The annular member has a first surface facing the backside of the substrate mounted on the base with a gap, a second surface facing the side surface of the substrate mounted on the base with a gap, and a tapered surface formed at a corner portion between the first surface and the second surface.

An apparatus comprises a chamber configured to receive a medium. The chamber comprises a first cooled structure having a first surface and a second cooled structure having a first surface. The first surface of the first cooled structure faces the first surface of the second cooled structure and is positioned a predetermined distance therefrom to form a gap, and the gap is configured to receive the medium. The chamber further includes a first gas inlet positioned proximate the center of the first cooled structure, a first slidable structure configured to seal a first side of the chamber when in a closed position, and a second slidable structure, positioned opposite the first slidable structure, and configured to seal a second side of the chamber when in a closed position.

A substrate support plate includes a base plate; at least one spacer arranged on the base plate such that the at least one spacer is restrained from moving relative to the base plate without resort to an adhesive; and a top plate having an upper surface capable of holding a substrate thereon, the top plate being fixed to the base plate with the at least one spacer therebetween.