A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.

An optical mount includes a support substrate defining an aperture configured to receive an optical element. A support assembly is positioned proximate a perimeter of the aperture. The support assembly includes a resilient member configured reflects in response to relative motion between the optical element and the support substrate. A support plate is positioned on the resilient member and is in contact with the optical element.

An optical mount includes a support substrate defining an aperture configured to receive an optical element. A support assembly is positioned proximate a perimeter of the aperture. The support assembly includes a resilient member configured reflects in response to relative motion between the optical element and the support substrate. A support plate is positioned on the resilient member and is in contact with the optical element.

An apparatus and method for metallizing parts in an efficient manner. The apparatus includes a plurality of plates stacked vertically and spaced from one another, wherein each plate has an outer perimeter. There is a plurality of part supports arranged about the outer perimeter of each plate. A support frame is secured to the plurality of plates such that it may rotate about the outer perimeter of the plates while maintaining substantially the same distance from the outer perimeter of each plate. There is one or more rotation drive systems attached to the support frame and positioned such that one or more compliant drive fingers are in close proximity to the outer perimeter of each plate. The stacked plates may be moved between a metallizer and parts loading and unloading stations in a convenient manner.

An apparatus and method for metallizing parts in an efficient manner. The apparatus includes a plurality of plates stacked vertically and spaced from one another, wherein each plate has an outer perimeter. There is a plurality of part supports arranged about the outer perimeter of each plate. A support frame is secured to the plurality of plates such that it may rotate about the outer perimeter of the plates while maintaining substantially the same distance from the outer perimeter of each plate. There is one or more rotation drive systems attached to the support frame and positioned such that one or more compliant drive fingers are in close proximity to the outer perimeter of each plate. The stacked plates may be moved between a metallizer and parts loading and unloading stations in a convenient manner.

The invention relates to a device and a method for producing layers with very good uniformity in coating systems with horizontally rotating substrate guiding. Alternatively, certain layer thickness gradients can be set. The particle loading is also significantly reduced. The service life is much higher compared to other methods. Parasitic coatings are reduced. The coating rate is also increased.

A deposition apparatus for depositing a material on a wafer, the apparatus including a lower shower head; an upper shower head disposed on the lower shower head, the upper shower head facing the lower shower head; and a support structure between the upper shower head and the lower shower head, the wafer being supportable by the support structure, wherein the upper shower head includes upper holes for providing an upper gas onto the wafer, the lower shower head includes lower holes for providing a lower gas onto the wafer, the support structure includes a ring body surrounding the wafer; a plurality of ring support shafts between the ring body and the lower shower head; and a plurality of wafer supports extending inwardly from a lower region of the ring body to support the wafer, and the plurality of wafer supports are spaced apart from one another.

A deposition apparatus for depositing a material on a wafer, the apparatus including a lower shower head; an upper shower head disposed on the lower shower head, the upper shower head facing the lower shower head; and a support structure between the upper shower head and the lower shower head, the wafer being supportable by the support structure, wherein the upper shower head includes upper holes for providing an upper gas onto the wafer, the lower shower head includes lower holes for providing a lower gas onto the wafer, the support structure includes a ring body surrounding the wafer; a plurality of ring support shafts between the ring body and the lower shower head; and a plurality of wafer supports extending inwardly from a lower region of the ring body to support the wafer, and the plurality of wafer supports are spaced apart from one another.

An apparatus and method for molecular beam epitaxy are described herein. The apparatus comprises an enclosure defining a vacuum chamber. A substrate holder is mounted within the vacuum chamber. At least one molecular beam source is in fluid communication with the vacuum chamber. A cooling shroud having at least one surface is mounted within the vacuum chamber spaced from the substrate holder. A cryocooler having at least a portion extending into the vacuum chamber is operatively coupled to the cooling shroud for extracting heat therefrom, and cooling the at least one surface of the cooling shroud to cryogenic temperatures.

In accordance with various embodiments, a coating arrangement may comprise: an electron beam gun for providing an electron beam; a beam trap for trapping the electron beam; a control device for driving the electron beam gun and/or the beam trap, wherein the control device is configured to switch over the driving between a plurality of configurations, of which: in a first configuration, the electron beam is directed onto the beam trap; and in a second configuration, the electron beam is directed past the beam trap.