Patent classifications
C23C14/56
Roll-to-roll surface treatment device, and film deposition method and film deposition device using same
Disclosed herein is a roll-to-roll long base material surface processing device capable of performing surface processing on a long base material with little occurrence of wrinkling in the long base material at low costs. The surface processing device includes: two can rolls that cool a long resin film transferred in a roll-to-roll manner in a vacuum chamber with a cooling medium circulated therein by wrapping the long resin film around outer circumferences thereof; and surface processing units typified by magnetron sputtering cathodes provided so as to face the outer circumferences of the two can rolls, wherein a second can roll of the two can rolls other than a most upstream first can roll has a gas release mechanism that releases a gas from the outer circumference.
Roll-to-roll surface treatment device, and film deposition method and film deposition device using same
Disclosed herein is a roll-to-roll long base material surface processing device capable of performing surface processing on a long base material with little occurrence of wrinkling in the long base material at low costs. The surface processing device includes: two can rolls that cool a long resin film transferred in a roll-to-roll manner in a vacuum chamber with a cooling medium circulated therein by wrapping the long resin film around outer circumferences thereof; and surface processing units typified by magnetron sputtering cathodes provided so as to face the outer circumferences of the two can rolls, wherein a second can roll of the two can rolls other than a most upstream first can roll has a gas release mechanism that releases a gas from the outer circumference.
Methods for treating superconducting cavities
A system and method for treating a cavity comprises arranging a niobium structure in a coating chamber, the coating chamber being arranged inside a furnace, coating the niobium structure with tin thereby forming an Nb.sub.3Sn layer on the niobium structure, and doping the Nb.sub.3Sn layer with nitrogen, thereby forming a nitrogen doped Nb.sub.3Sn layer on the niobium structure.
CVD OR PVD REACTOR FOR COATING LARGE-AREA SUBSTRATES
A CVD or PVD coating device comprises a housing and a gas inlet organ secured to the housing via a retaining device, the gas inlet organ having a gas outlet surface with gas outlet openings. The retaining device is only secured at its horizontal edge to the housing so as to stabilize the retaining device with respect to deformations and temperature. The gas inlet organ is secured, at a plurality of suspension points, to the retaining device by means of a plurality of hanging elements distributed over the entire horizontal surface of the retaining device. The retaining device has mechanical stabilization elements formed by a retaining frame having vertical walls that are interconnected at vertical connection lines. An actively cooled heat shield is situated between the retaining device and the gas inlet organ.
FABRICATION OF LOW DEFECTIVITY ELECTROCHROMIC DEVICES
Prior electrochromic devices frequently suffer from high levels of defectivity. The defects may be manifest as pin holes or spots where the electrochromic transition is impaired. This is unacceptable for many applications such as electrochromic architectural glass. Improved electrochromic devices with low defectivity can be fabricated by depositing certain layered components of the electrochromic device in a single integrated deposition system. While these layers are being deposited and/or treated on a substrate, for example a glass window, the substrate never leaves a controlled ambient environment, for example a low pressure controlled atmosphere having very low levels of particles. These layers may be deposited using physical vapor deposition.
Method and apparatus for producing low-particle layers on substrates
The invention relates to methods and devices for producing one or more low-particle layers on substrates in a vacuum. The layers are deposited onto the substrate from a cylindrical source material, optionally together with a reactive gas component, by means of magnetron sputtering. The layer is deposited against the force of gravity in a sputter-up method. During the method or within the device, the structure or stochiometric atomic composition of the layers can optionally be modified using a plasma source. Multiple sputtering sources with different source materials can be provided in the device such that multiple layers of different compositions can be applied on the substrate at a high speed in one process.
Process kit of physical vapor deposition chamber and fabricating method thereof
A physical vapor deposition (PVD) chamber, a process kit of a PVD chamber and a method of fabricating a process kit of a PVD chamber are provided. In various embodiments, the PVD chamber includes a sputtering target, a power supply, a process kit, and a substrate support. The sputtering target has a sputtering surface that is in contact with a process region. The power supply is electrically connected to the sputtering target. The process kit has an inner surface at least partially enclosing the process region, and a liner layer disposed on the inner surface. The substrate support has a substrate receiving surface, wherein the liner layer disposed on the inner surface of the process kit has a surface roughness (Rz), and the surface roughness (Rz) is substantially in a range of 50-200 μm.
Gold evaporative sources with reduced contaminants and methods for making the same
A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol.
INTEGRATION OF LASER PROCESSING WITH DEPOSITION OF ELECTROCHEMICAL DEVICE LAYERS
A method of fabricating an electrochemical device in an apparatus may comprise: providing an electrochemical device substrate; depositing a device layer over the substrate; applying electromagnetic radiation to the device layer in situ to effect one or more of surface restructuring, recrystallization and densification of the device layer; repeating the depositing and the applying until a desired device layer thickness is achieved. Furthermore, the applying may be during the depositing. A thin film battery may comprise: a substrate; a current collector on the substrate; a cathode layer on the current collector; an electrolyte layer on the cathode layer; and a lithium anode layer on the electrolyte layer; wherein the LLZO electrolyte layer has a crystalline phase, no shorts due to cracks in the LLZO electrolyte layer, and no highly resistive interlayer at the interface between the electrolyte layer and the cathode layer.
Mask assembly for testing a deposition process, deposition apparatus including the mask assembly, and testing method for a deposition process using the mask assembly
A deposition apparatus includes deposition sources, a deposition chamber, a mask assembly, and a transfer unit. The mask assembly includes a support member, a shutter member, and a drive member. The support member has a first opening configured to allow the deposition materials to pass through while supporting the base substrate on which the passed-through deposition materials are deposited. The shutter member is accommodated in the support member and has a second opening smaller than the first opening. The drive member is configured to change a position of the second opening with respect to the base substrate in accordance with the movement of the mask assembly.