A physical vapor deposition (PVD) system is provided. The PVD system includes a PVD chamber defining a PVD volume within which a target material of a target is deposited onto a wafer. The PVD system includes the target in the PVD chamber. The target is configured to overlie the wafer. An edge of the target extends from a first surface of the target to a second surface of the target, opposite the first surface of the target. A first portion of the edge of the target has a first surface roughness. The first portion of the edge of the target extends at most about 6 millimeters from the first surface of the target to a second portion of the edge of the target. The second portion of the edge of the target has a second surface roughness less than the first surface roughness.

A roller for transporting a flexible substrate is described. The roller includes a main body having a plurality of gas supply slits provided in an outer surface of the main body. The plurality of gas supply slits extends in a direction of a central rotation axis of the roller. Further, the roller includes a sleeve provided circumferentially around and in contact with the main body. The sleeve has a plurality of gas outlets being provided above the plurality of gas supply slits. Further, the sleeve includes a metal layer embedded within isolating material.

A Method for continuously depositing, on a running substrate, coatings formed from at least one metal inside a vacuum deposition facility including a vacuum chamber; a substrate coated with at least one metal on both sides of the substrate having an average thickness, wherein the coating is deposited homogenously such that the maximum thickness of the coating can exceed the average thickness of 15% maximum. A vacuum deposition facility also is provided.

A substrate processing system includes a load-lock module including load-lock module stages, a process module including process module stages, a vacuum transfer module that connects the load-lock module to the process module, a first transfer device that transfers substrates from the load-lock module stages to the process module stages, the first transfer device being provided in the vacuum transfer module, a second transfer device that transfers the substrates to the load-lock module stages, and a processor. The processor is configured to perform teaching a position at which the first transfer device receives the substrates from the load-lock module, teaching a position at which the first transfer device delivers the substrates to the process module, measuring shift amounts between the process module stages and the substrates mounted thereon, and correcting positions at which the second transfer device delivers the substrates to the load-lock module stages based on the measured shift amounts.

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

An electromagnetic separation type coating device is provided, and belongs to the technical field of vacuum coating. The device comprises a main vacuum cavity, the front side and the rear side of the main vacuum cavity are each provided with a vacuum cavity door, middle positions of the front vacuum cavity door and the rear vacuum cavity door are each provided with a set of magnetron sputtering targets, and the two sets of magnetron sputtering targets are symmetrically arranged; two sets of ion sources are symmetrically arranged on the outer walls of the left side and the right side of the main vacuum cavity, and two sets of magnetic induction coils are symmetrically arranged at two sides of each set of ion sources, respectively; a vacuum pump set is connected to the top of the main vacuum cavity, a workpiece rest is installed at the bottom in the main vacuum cavity, and is used for installing a to-be-deposited sample piece; and an auxiliary anode is further installed in the main vacuum cavity. An electromagnetic separation type coating method is further provided. The electromagnetic separation type coating device and method provided by the present disclosure have the advantages of effectively improving the three-dimensional space plasma density, increasing ion energy, and obtaining a thin film with excellent performance.

An electromagnetic separation type coating device is provided, and belongs to the technical field of vacuum coating. The device comprises a main vacuum cavity, the front side and the rear side of the main vacuum cavity are each provided with a vacuum cavity door, middle positions of the front vacuum cavity door and the rear vacuum cavity door are each provided with a set of magnetron sputtering targets, and the two sets of magnetron sputtering targets are symmetrically arranged; two sets of ion sources are symmetrically arranged on the outer walls of the left side and the right side of the main vacuum cavity, and two sets of magnetic induction coils are symmetrically arranged at two sides of each set of ion sources, respectively; a vacuum pump set is connected to the top of the main vacuum cavity, a workpiece rest is installed at the bottom in the main vacuum cavity, and is used for installing a to-be-deposited sample piece; and an auxiliary anode is further installed in the main vacuum cavity. An electromagnetic separation type coating method is further provided. The electromagnetic separation type coating device and method provided by the present disclosure have the advantages of effectively improving the three-dimensional space plasma density, increasing ion energy, and obtaining a thin film with excellent performance.

The present invention discloses a vacuum coating device, comprising: a crucible; an induction heater provided on the periphery of the crucible; a flow distribution box connected to the top of said crucible via a steam pipe. Wherein said flow distribution box is provided inside with a horizontal pressure stabilizing plate, said flow distribution box is connected on the top with a nozzle, said steam pipe is provided with a pressure regulating valve, and said pressure stabilizing plate has a multi-hole structure. The lower surface of said pressure stabilizing plate is connected to a horizontal flow suppression plate, and a space is formed between the side of said flow suppression plate and the inner wall of said flow distribution box. A jet moderating zone is formed between the joint where said flow distribution box and said steam pipe are connected and the lower surface of said pressure stabilizing plate, and a jet accelerating zone is formed between the upper surface of said pressure stabilizing plate and the joint where said flow distribution box and said nozzle are connected. When the high-temperature steam reaches the low-temperature steel plate, a uniform coating can be formed on the steel plate surface.

The present invention discloses a vacuum coating device, comprising: a crucible; an induction heater provided on the periphery of the crucible; a flow distribution box connected to the top of said crucible via a steam pipe. Wherein said flow distribution box is provided inside with a horizontal pressure stabilizing plate, said flow distribution box is connected on the top with a nozzle, said steam pipe is provided with a pressure regulating valve, and said pressure stabilizing plate has a multi-hole structure. The lower surface of said pressure stabilizing plate is connected to a horizontal flow suppression plate, and a space is formed between the side of said flow suppression plate and the inner wall of said flow distribution box. A jet moderating zone is formed between the joint where said flow distribution box and said steam pipe are connected and the lower surface of said pressure stabilizing plate, and a jet accelerating zone is formed between the upper surface of said pressure stabilizing plate and the joint where said flow distribution box and said nozzle are connected. When the high-temperature steam reaches the low-temperature steel plate, a uniform coating can be formed on the steel plate surface.