C23C14/5806

Measuring an electrochemical response from a three-electrode array

An apparatus for in-vivo measuring H.sub.2O.sub.2 oxidation within a living tissue. The apparatus includes an electrochemical probe and an electrochemical stimulator-analyzer. The electrochemical probe includes a sensing part and a handle. The sensing part includes a working electrode, a counter electrode, and a reference electrode. The working electrode includes a first biocompatible conductive needle coated with a layer of vertically aligned multi-walled carbon nanotubes. The counter electrode includes a second biocompatible conductive needle. The reference electrode includes a third biocompatible conductive needle. The electrochemical stimulator-analyzer is configured to generate a set of electrical currents in a portion of the living tissue.

Nanofiber actuator and method for making the same

A nanofiber actuator comprises a composite structure and a vanadium dioxide layer. The composite structure comprises a carbon nanotube wire and an aluminum oxide layer. The aluminum oxide layer is coated on a surface of the carbon nanotube wire, and the aluminum oxide layer and the carbon nanotube wire are located coaxially with each other. The vanadium dioxide layer is coated on a surface of the composite structure, and the vanadium dioxide layer and the composite structure are located non-coaxially with each other.

NEAR-INFRARED SHIELDING FILM AND METHOD FOR PRODUCING NEAR-INFRARED SHIELDING FILM
20230348292 · 2023-11-02 ·

A near-infrared shielding film including a continuous film of a cesium tungsten composite oxide represented by a general formula Cs.sub.xW.sub.yO.sub.z where 4.8≤x≤14.6, 20.0≤y≤26.7, 62.2≤z≤71.4, and x+y+z=100, is provided. The continuous film includes one or more crystals selected from an orthorhombic crystal, a rhombohedral crystal, and a hexagonal crystal.

ELECTRONIC VAPORIZATION DEVICE, VAPORIZER, VAPORIZATION CORE, AND PREPARATION METHOD THEREFOR
20230337743 · 2023-10-26 ·

A vaporization core includes: a porous substrate having a vaporization surface; a heating layer disposed on the vaporization surface of the porous substrate; and a protective layer disposed on a surface of the heating layer far away from the porous substrate. The protective layer includes metal aluminum and alumina, and the alumina at least partially covers a surface of the metal aluminum to form an alumina layer.

Sapphire coated substrate with a flexible, anti-scratch and multi-layer coating

A method for forming a substrate with a multi-layered, flexible, and anti-scratch metal oxides protective coating being deposited onto the substrate is provided in the present invention, wherein the top most layer of the coating comprises Al.sub.2O.sub.3 or a mixture thereof such that the top most layer acts as an anti-scratching layer. The multi-layered, flexible and anti-scratch metal oxides protective coating also retains the flexibility of the underlying substrate.

Photoplasma etching apparatus having improved plasma-resistant and manufacturing method therefor using a thermal diffusion phenomenon of a rare-earth metal thin film
11827975 · 2023-11-28 · ·

The present invention provides a photoplasma etching device and a method of manufacturing the same, and more particularly to a member for a plasma etching device, which is improved in plasma resistance through deposition of a rare-earth metal thin film and surface heat treatment and the optical transmittance of which is maintained, thus being useful as a member for analyzing the end point of an etching process, and a method of manufacturing the same.

TRANSPARENT ELECTROCONDUCTIVE FILM
20230127104 · 2023-04-27 · ·

A transparent electroconductive film (X) includes a transparent resin substrate (10) and a transparent electroconductive layer (20) in this order in a thickness direction (T). The transparent electroconductive layer (20) has, in an in-plane direction orthogonal to the thickness direction (T), a first direction in which a compressive residual stress is maximum, and a second direction orthogonal to the first direction. In the transparent electroconductive layer (20), a ratio of a second compressive residual stress in the second direction to a first compressive residual stress in the first direction is 0.82 or more.

Ion beam sputtering with ion assisted deposition for coatings on chamber components

An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 μm, wherein the plasma resistant rare earth oxide is selected from a group consisting of YF.sub.3, Er.sub.4Al.sub.2O.sub.9, ErAlO.sub.3, and a ceramic compound comprising Y.sub.4Al.sub.2O.sub.9 and a solid-solution of Y.sub.2O.sub.3—ZrO.sub.2.

Ion beam sputtering with ion assisted deposition for coatings on chamber components

An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 μm, wherein the plasma resistant rare earth oxide film is selected from a group consisting of an Er—Y composition, an Er—Al—Y composition, an Er—Y—Zr composition, and an Er—Al composition.

Methods and apparatus for intermixing layer for enhanced metal reflow

Methods and apparatus for filling features on a substrate are provided herein. In some embodiments, a method of filling features on a substrate includes: depositing a first metallic material on the substrate and within a feature disposed in the substrate in a first process chamber via a chemical vapor deposition (CVD) process at a first temperature; depositing a second metallic material on the first metallic material in a second process chamber at a second temperature and at a first bias power to form a seed layer of the second metallic material; etching the seed layer in the second process chamber at a second bias power greater than the first bias power to form an intermix layer within the feature comprising the first metallic material and the second metallic material; and heating the substrate to a third temperature greater than the second temperature, causing a reflow of the second metallic material.