Such a vapor-deposited barrier film is provided that has a vapor-deposited layer having uniform film quality, a high film density and high barrier performance in the initial stage. The vapor-deposited barrier film contains a substrate having on at least one surface thereof at least one layer of a vapor-deposited layer (a). The vapor-deposited layer (a) contains a metal oxide, has a thickness of from 10 to 500 nm, and has an average value of an elemental ratio of oxygen (O) and the metal (oxygen (O)/metal) of 1.20 or more and 1.90 or less and a difference between the maximum value and the minimum value of the (oxygen (O)/metal) of 0.35 or less on analysis of the vapor-deposited layer in the depth direction thereof by an X-ray photoelectron spectroscopy (ESCA) method.

The present inventions relates to an organic light emitting device capable of decreasing a leakage current, and more particularly, to an organic light emitting device manufacturing method and an organic light emitting device using the same, which can decrease a leakage current, by flattening a lower electrode in order to decrease a leakage current of the lower electrode deposited through a shadow mask.

Substrate provided with a plurality of layers, at least one of which includes metal oxides and is topped directly by a metal coating layer that contains at least 8% by weight nickel and at least 10% by weight chromium, the remainder being iron, additional elements and the impurities resulting from the fabrication process, wherein this metal coating layer is topped directly by an anticorrosion coating layer. A corresponding fabrication method is also provided.

In one aspect, the disclosure relates to cooling films comprising a substrate and one or more cooling materials deposited on the substrate. The disclosed cooling films can be used to prepare the disclosed cooling masterbatch materials. The disclosed cooling masterbatch materials can be used to prepare disclosed cooling yarns. The one or more cooling materials deposited on the substrate of a disclosed cooling film, dispersed in a disclosed cooling masterbatch material, or in disclosed cooling yarn are nano-sized particles. In still further aspects, the present disclosure pertains to a fabric comprising a disclosed cooling yarn. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

A process for obtaining a material includes a substrate coated on at least one portion of at least one of its faces with a coating including at least one discontinuous metallic thin layer based on silver, on gold, or on any alloy thereof, the or each discontinuous metallic thin layer being encapsulated between at least two dielectric thin layers, and the or each discontinuous metallic thin layer being in the form of periodic geometric patterns, the process including a deposition step then a step wherein the substrate thus coated is made to run opposite at least one laser device emitting a laser radiation focused on the coating in the form of at least one line, the power of the radiation being adapted in order to render the or each metallic thin layer discontinuous by dewetting.

A simplified switchable object and methods of making same are provided. The methods may include steps of applying a switchable material on a first surface of a first substrate, the switchable material having a thickness and a shape; applying a barrier material on the first substrate, circumferential to the switchable material; and applying a second substrate over top of, and in contact with, the switchable material and the barrier material, the first substrate, second substrate and barrier material defining a closed chamber encapsulating the switchable material. The methods may further include a step of applying a seal material.

A thin film depositing apparatus and a thin film deposition method using the apparatus. The thin film depositing apparatus includes a chamber configured to have a substrate mounted therein, an ejection unit configured to move in the chamber and to eject a deposition vapor to the substrate, and a source supply unit configured to supply a source of the deposition vapor to the ejection unit.