C23C14/5873

POST COATING SURFACE TREATMENT FOR METALLIC PART
20170350007 · 2017-12-07 ·

A method of surface treating a metallic part includes steps of coating the metallic part with a tribological thin film coating, and tumbling the metallic part after the coating step to remove surface micro-particles. The tumbling step may also remove delaminated areas of the tribological thin film coating. According to some embodiments, the metallic part may be tumbled with an alkaline solution.

Methods and apparatus for passivating a target

Methods and apparatus for passivating a target are provided herein. For example, a method includes a) supplying an oxidizing gas into an inner volume of the process chamber; b) igniting the oxidizing gas to form a plasma and oxidize at least one of a target or target material deposited on a process kit disposed in the inner volume of the process chamber; and c) performing a cycle purge comprising: c1) providing air into the process chamber to react with the at least one of the target or target material deposited on the process kit; c2) maintaining a predetermined pressure for a predetermined time within the process chamber to generate a toxic by-product caused by the air reacting with the at least one of the target or target material deposited on the process kit; and c3) exhausting the process chamber to remove the toxic by-product.

Molybdenum containing targets for touch screen device

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

METHODS OF MODIFYING SURFACES OF DIAMOND PARTICLES, AND RELEATED DIAMOND PARTICLES AND EARTH-BORING TOOLS
20170341940 · 2017-11-30 ·

A method of modifying surfaces of diamond particles comprises forming spinodal alloy coatings over discrete diamond particles, thermally treating the spinodal alloy coatings to form modified coatings each independently exhibiting a reactive metal phase and a substantially non-reactive metal phase, and etching surfaces of the discrete diamond particles with at least one reactive metal of the reactive metal phase of the modified coatings. Diamond particles and earth-boring tools are also described.

Laser-contrasted golf club head and manufacturing process

A golf club head having a laser-generated features to create contrast on the club face of the golf club head. The club face includes a central region, a toe region, and a heel region. The central region includes a first plurality of laser-generated features that provide a height-intersection coverage of the central region, a width-intersection coverage of the central region, and a surface-area coverage of the central region. The toe region includes a second plurality of laser-generated features that provide a height-intersection coverage of the toe region, a width-intersection coverage of the toe region, and a surface-area coverage of the toe region. The heel region includes a third plurality of laser-generated features that provide a height-intersection coverage of the heel region, a width-intersection coverage of the heel region, and a surface-area coverage of the heel region.

SUBSTRATE TREATMENT APPARATUS AND METHOD THEREOF

Provided are a substrate treatment apparatus and method for treating a substrate by simultaneously providing a stripper for peeling a coating film on the substrate to an entire surface of the substrate. The substrate treatment method includes discharging a first liquid onto a substrate by using a first nozzle, and forming a coating film collecting particles by using the first liquid; spraying a second liquid on the substrate by using a second nozzle, and peeling the coating film from the substrate by using the second liquid; and discharging a third liquid onto the substrate by using a third nozzle, and rinsing the coating film from the substrate by using the third liquid, wherein in the peeling of the coating film, the second liquid is simultaneously sprayed on an entire surface of the substrate.

METHOD AND APPARATUS FOR CLADDING A SURFACE OF AN ARTICLE
20170312855 · 2017-11-02 ·

This invention relates to a method, system and apparatus for cladding a surface of an articles subject to corrosive, erosive or abrasive wear, such as impact or grinding tools. The method includes providing a supply of stock material and feeding the stock material towards a portion of the surface of the article via a dedicated feed source. A dedicated heat source heats the fed stock material and the portion of the surface of the article such that the heated stock material and the portion of the surface at least partially melt. Upon removal of the heat, the molten feedstock and the surface portion form a bonded coating layer on at least a portion of the surface of the article, thereby protecting that part of the assembly against wear.

Solar selective coating having high thermal stability and a process for the preparation thereof

The present invention describes an improved multilayer solar selective coating useful for solar thermal power generation. Solar selective coating of present invention essentially consists of Ti/Chrome interlayer, two absorber layers (AlTiN and AlTiON) an anti-reflection layer (AlTiO). Coating deposition process uses Ti and Al as the source materials, which are abundantly available and easy to manufacture as sputtering targets for industrial applications. The present invention allows deposition of all the layers in a single sputtering chamber on flat and tubular substrates with high absorptance and low emittance, thus making the process simpler and cost effective. The process of the present invention can be up-scaled easily for deposition on longer tubes with good uniformity and reproducibility. The coating of the present invention also displays improved adhesion, UV stability, corrosion resistance and stability under extreme environments.

Method for manufacturing graphene composite electrode material

The present invention provides a method for manufacturing a graphene composite electrode material, including the following steps: (1) providing a glass substrate, the glass substrate having a melting point greater than 1100° C.; (2) washing the glass substrate and then forming a metal film on the glass substrate; (3) patterning the metal film to form a circuit pattern; and (4) forming a graphene film on the circuit pattern so as to form a graphene composite electrode material. The method for manufacturing a graphene composite electrode material according to the present invention uses a temperature resistant glass substrate and a metal catalyst to directly grow a graphene film on a circuit pattern thereby requiring no transfer, not affected by solvent applied in transfer, having relatively high quality of film formation, requiring no etching, allowing for direct formation of a graphene composite electrode material, having a simple process, providing an effect of protection of the metal circuit pattern due to stable chemical property of graphene, and thus effectively extending the service life of the graphene composite electrode material.

Copper plating method

A method of removing copper oxide from copper surfaces is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.