Method and apparatus for coating selected regions of a surface of a substrate with a film are disclosed. A cyclically moveable transfer member has an imaging surface which is coated with individual particles formed of, or coated with a thermoplastic polymer, and substantially all particles that are not in direct contact with the imaging surface are removed so as to leave a uniform monolayer particle coating on the imaging surface. Selected regions of the imaging surface are exposed to radiation to render the particles tacky within the regions, and the coated imaging surface and the substrate are pressed against one another to cause transfer of only the particles rendered tacky in the coating, such that the transferred particles form a film on the substrate. The monolayer on the imaging surface of the transfer member is replenished with fresh thermoplastic particles and the cycle repeats.

A method for removing and preventing defects on surfaces of a component of a substrate processing chamber includes loading the component into a vacuum chamber and, with the component loaded within the vacuum chamber, baking the component at a baking temperature during a first predetermined period to remove water and defects from the surfaces of the component, and purging the component within the vacuum chamber during at least one second predetermined period to remove the defects from the vacuum chamber.

A method for selectively depositing a metallic film on a substrate comprising a first dielectric surface and a second metallic surface is disclosed. The method may include, exposing the substrate to a passivating agent, performing a surface treatment on the second metallic surface, and selectively depositing the metallic film on the first dielectric surface relative to the second metallic surface. Semiconductor device structures including a metallic film selectively deposited by the methods of the disclosure are also disclosed.

An MOCVD system fabricates high quality superconductor tapes with variable thicknesses. The MOCVD system can include a gas flow chamber between two parallel channels in a housing. A substrate tape is heated and then passed through the MOCVD housing such that the gas flow is perpendicular to the tape's surface. Precursors are injected into the gas flow for deposition on the substrate tape. In this way, superconductor tapes can be fabricated with variable thicknesses, uniform precursor deposition, and high critical current densities.

A method for preparing a silicon monoxide composite material includes: a first stage: introducing a protective gas into a vapor deposition oven, and pre-heating a silicon monoxide raw material, such that a part of the silicon monoxide raw material is subjected to a disproportionation reaction; a second stage: continuously introducing the protective gas and introducing a carbon source gas, and subjecting the pre-heated silicon monoxide raw material to a chemical vapor deposition to form carbon nanotubes on a surface of silicon monoxide; and a third stage: after a predetermined time period, stopping introducing the carbon source gas, and stopping introducing the protective gas until the vapor deposition oven is cooled to room temperature, to prepare the silicon monoxide composite material. During the preparation process, no extra catalyst needs to be added, a product of the previous disproportionation reaction may act as a catalyst for the growth of the carbon nanotubes.

A vapor deposition process is provided for the growth of as-deposited hydrogen-free silicon carbide (SiC) and SiC films including oxygen (SiC:O) thin films. For producing the SiC thin films, the process includes providing a silahydrocarbon precursor, such as TSCH (1,3,5-trisilacyclohexane), in the vapor phase, with or without a diluent gas, to a reaction zone containing a heated substrate, such that adsorption and decomposition of the precursor occurs to form stoichiometric, hydrogen-free, silicon carbide (SiC) in a 1:1 atom ratio between silicon and carbon on the substrate surface without exposure to any other reactive chemical species or co-reactants. For the SiC:O films, an oxygen source is added to the reaction zone to dope the SiC films with oxygen. In the silahydrocarbon precursors, every carbon atom is bonded to two silicon atoms, with each silicon atom being additionally bonded to two or more hydrogen atoms.

A film deposition method and a film deposition apparatus are provided. The film deposition method includes: putting a substrate into a furnace tube, the furnace tube including a first section for placing the substrate, the first section having an inlet for reaction gas; heating, within a first preset time, a first heating module from a first initial temperature to a first preset temperature, the first heating module surrounding the first section and being configured to heat the first section; maintaining, within a second preset time, the first heating module continuously at the first preset temperature; and within a third preset time, introducing the reaction gas into the furnace tube from the inlet, and heating the first heating module from the first preset temperature to a second preset temperature so as to form a target film on a surface of the substrate placed in the first section.

A method of forming a RuSi film, the method includes adsorbing silicon in a recess that is formed in a substrate and includes an insulating film by supplying a silicon-containing gas to the substrate, forming a Ru film in the recess by supplying a Ru-containing precursor to the recess in which the silicon is adsorbed, and forming a RuSi film by supplying a silicon-containing gas to the recess in which the Ru film is formed.

Systems and methods for growth of silicon carbide over a layer comprising graphene and/or hexagonal boron nitride, and related articles, are generally described. In some embodiments, a SiC film is fabricated over a layer comprising graphene and/or hexagonal boron nitride, which in turn is disposed over a substrate. The layer and/or the substrate may be lattice-matched with the SiC film to reduce defect density in the SiC film. The fabricated SiC film may then be removed from the substrate via, for example, a stressor attached to the SiC film. In certain cases, the layer serves as a reusable platform for growing SiC films and also serves a release layer that allows fast, precise, and repeatable release at the layer surface.

The method includes forming an inner monolithic layer from crystals of beta phase stoichiometric silicon carbide on a carbon substrate in the form of a rod by chemical methylsilane vapor deposition in a sealed tubular hot-wall CVD reactor. The method further includes forming a central composite layer over the inner monolithic layer by twisting continuous beta phase stoichiometric silicon carbide fibers into tows, transporting the tows to a braiding machine, and forming a reinforcing thread framework. A pyrocarbon interface coating is built up by chemical methane vapor deposition in a sealed tubular hot-wall CVD reactor. Then, a matrix is formed by chemical methylsilane vapor deposition in the reactor. A protective outer monolithic layer is formed from crystals of beta phase stoichiometric silicon carbide over the central composite layer by chemical methylsilane vapor deposition in a CVD reactor. And then the carbon substrate is removed from the fabricated semi-finished product.