A mask includes a shielding portion and a plurality of hollow regions. The shielding portion includes: a plurality of shielding strips, a plurality of raised portions and a plurality of grooves. Side surfaces of some of the plurality of shielding strips are sequentially connected to form one of the plurality of hollow regions. Each raised portion is disposed on a side surface of a corresponding one of the plurality of shielding strips close to a corresponding hollow region, and each raised portion is connected with the side surface of the shielding strip. Each groove is at least partially formed in a first surface of a corresponding one of the plurality of raised portions, and the first surface is parallel to a plate surface of the mask.

The plasma device includes a vessel with the first and second molds facing to each other. A work is sealed in the closed first and second molds. The work includes an object to be processed with a part to be processed and a part not to be processed on an outer periphery of the part to be processed, and a masking member covering the part not to be processed. The first mold includes a facing plane portion disposed facing an outer periphery surface of the work, a first recessed portion disposed facing the part to be processed and generating plasma, and a second recessed portion disposed facing the part not to be processed between the facing plane portion and the first recessed portion and generating plasma. A depth of the second recessed portion is different from a depth of the first recessed portion.

A deposition apparatus includes a sheet, an edge portion of which is integrally combined with a sheet frame, an electrostatic chuck attached to a bottom surface of the sheet, the electrostatic chuck adhering a substrate by a force of static electricity, a metal mask located below the electrostatic chuck, an edge portion of the metal mask being combined with a mask frame, the metal mask having a predetermined patterned opening, and the substrate being mounted to the upper surface of the metal mask, a transfer member coupled to a side surface of the sheet frame, the transfer member flattening the sheet by pulling the sheet to side directions, and a magnetic plate located above the sheet, the magnetic plate closely attaching the substrate to the electrostatic chuck by pulling the metal mask using a magnetic force.

An evaporation mask includes: a mask body including a pattern region configured of a plurality of passage holes; and an adjusting frame configured to hold the mask body and having a mechanism capable of adjusting positions of the passage holes on the mask body. The adjusting frame has a frame-like base material, and a movable member that is provided along one or more sides of the base material to be bonded with an outer edge of the mask body, and at least a part of which is deformable on the base material. One or a plurality of slits are provided at a selective region of the movable member.

A mask material is deposited on a substrate or growth template. The substrate or growth template is compatible with crystalline growth of a crystalline optical material. Patterned portions of the mask material are removed to expose one or more regions of the substrate or growth template. The one or more regions have target shapes of one or more optical components. The crystalline optical material is selectively grown in the one or more regions to form the one or more optical components.

A device for depositing a layer on a substrate, while a mask is placed on the substrate, includes an adjustment device for adjusting the position of a mask carrier with respect to a support frame. The adjustment device has, on the support frame, an adjustment lever that is mounted to rotate about an axis of rotation of a pivot bearing and that has a first and second arm. The second arm acts on the mask carrier, and a control rod that can be vertically displaced by an actuator acts on the first arm. For a vertical adjustment device, the second arm and the first arm extend in a horizontal direction, in which the second arm acts on a push rod that is connected to the mask carrier. For a horizontal adjustment device, the second arm extends in a vertical direction and the first arm extends in a horizontal direction.

Passivation layers to inhibit vapor deposition can be used on reactor surfaces to minimize deposits while depositing on a substrate housed therein, or on particular substrate surfaces, such as metallic surfaces on semiconductor substrates to facilitate selective deposition on adjacent dielectric surfaces. Passivation agents that are smaller than typical self-assembled monolayer precursors can have hydrophobic or non-reactive ends and facilitate more dense passivation layers more quickly than self-assembled monolayers, particularly over complex three-dimensional structures.

A mask frame assembly includes: a mask frame; at least one mask sheet arranged on the mask frame; a plurality of first support sticks extending in a first direction; and a plurality of second support sticks extending in a second direction, wherein a mask frame transformation index is within a range from about −1000 to about +1000 based on mask frame transformation index=Σ (tensile force of first support sticks/tensile rate of first support sticks)−Σ (tensile force of second support sticks/tensile rate of second support sticks), where tensile force of respective first or second support stick is given by thickness (T)×width (W)×elastic coefficient (E)×tensile rate (δ/L.sub.0), δ is a transformed amount (L.sub.f−L.sub.0) corresponding to tension, L.sub.0 is an initial length of respective first or second support stick, and L.sub.f is a final length of respective first or second support stick.

The present invention provides an array substrate, an OLED display panel, and a mask. The array substrate includes a predetermined film-forming region and a non-film forming region. The non-film forming region is provided with a shadow region close to the predetermined film-forming region. An actual film forming region of a film layer to be formed on the array substrate includes the predetermined film-forming region and the shadow region. The array substrate is provided with a groove or a protrusion in the corresponding shadow region, so that the film layer is disconnected at the corresponding groove or the protrusion to form a discontinuous film.

A method includes: preparing a metal sheet and a glass substrate in which an absolute value of a difference in linear expansion coefficient between the glass substrate and the metal sheet is less than or equal to 1.3×10.sup.−6/° C. in a temperature range between 25° C. and 100° C. inclusive; joining the glass substrate to the metal sheet with a plastic layer in between; forming a mask plate from the metal sheet by forming mask holes in the metal sheet joined to the glass substrate; joining, to a mask frame, a surface of the mask plate that is opposite to a surface in contact with the plastic layer, the mask frame having a higher rigidity than the mask plate and having a shape that surrounds the entire mask holes; and removing the plastic layer and the glass substrate from the mask plate joined to the mask frame.