Patent classifications
C23C16/28
CYCLICAL DEPOSITION OF GERMANIUM
In some aspects, methods for forming a germanium thin film using a cyclical deposition process are provided. In some embodiments, the germanium thin film is formed on a substrate in a reaction chamber, and the process includes one or more deposition cycles of alternately and sequentially contacting the substrate with a vapor phase germanium precursor and a nitrogen reactant. In some embodiments, the process is repeated until a germanium thin film of desired thickness has been formed.
METHODS FOR FORMING A SILICON GERMANIUM TIN LAYER AND RELATED SEMICONDUCTOR DEVICE STRUCTURES
A method for forming a forming a silicon germanium tin (SiGeSn) layer is disclosed. The method may include, providing a substrate within a reaction chamber, exposing the substrate to a pre-deposition precursor pulse, which comprises tin tetrachloride (SnCl.sub.4), exposing the substrate to a deposition precursor gas mixture comprising a hydrogenated silicon source, germane (GeH.sub.4), and tin tetrachloride (SnCl.sub.4), and depositing the silicon germanium tin (SiGeSn) layer over a surface of the substrate. Semiconductor device structures including a silicon germanium tin (SiGeSn) layer formed by the methods of the disclosure are also provided.
Thin-film deposition methods with fluid-assisted thermal management of evaporation sources
In various embodiments, evaporation sources are heated and/or cooled via a fluid-based thermal management system during deposition of thin films.
Thin-film deposition methods with fluid-assisted thermal management of evaporation sources
In various embodiments, evaporation sources are heated and/or cooled via a fluid-based thermal management system during deposition of thin films.
ATOMIC LAYER DEPOSITION OF GROUP FIFTEEN MATERIALS
In some aspects of the present disclosure, a method includes performing an atomic layer deposition (ALD) process to form an antimony-containing coating of a surface of a substrate. The ALD process includes providing a first reactant to the surface of the substrate. The first reactant adsorbs onto the surface to form an adsorption layer thereon. The ALD process further includes providing a second reactant to the surface of the substrate. The second reactant includes a reducing agent. The second reactant reacts with the adsorption layer to form a layer of the antimony-containing coating. The ALD process further includes repeating the providing of the first reactant and the providing of the second reactant one or more times to form the antimony-containing coating.
ATOMIC LAYER DEPOSITION OF GROUP FIFTEEN MATERIALS
In some aspects of the present disclosure, a method includes performing an atomic layer deposition (ALD) process to form an antimony-containing coating of a surface of a substrate. The ALD process includes providing a first reactant to the surface of the substrate. The first reactant adsorbs onto the surface to form an adsorption layer thereon. The ALD process further includes providing a second reactant to the surface of the substrate. The second reactant includes a reducing agent. The second reactant reacts with the adsorption layer to form a layer of the antimony-containing coating. The ALD process further includes repeating the providing of the first reactant and the providing of the second reactant one or more times to form the antimony-containing coating.
BORON FILM REMOVING METHOD, AND PATTERN FORMING METHOD AND APPARATUS USING BORON FILM
In a method for removing a boron film formed on a substrate by CVD, heat treatment is performed on a part or all boron film in an oxidizing atmosphere and oxidizing a heat-treated portion. Then, an oxidized portion of the boron film is removed by water or aqueous solution containing electrolyte ions.
BORON FILM REMOVING METHOD, AND PATTERN FORMING METHOD AND APPARATUS USING BORON FILM
In a method for removing a boron film formed on a substrate by CVD, heat treatment is performed on a part or all boron film in an oxidizing atmosphere and oxidizing a heat-treated portion. Then, an oxidized portion of the boron film is removed by water or aqueous solution containing electrolyte ions.
METAL OXY-FLOURIDE FILMS FOR CHAMBER COMPONENTS
An article comprises a body having a coating. The coating comprises a YOF coating or other yttrium-based oxy-fluoride coating generated either by performing a fluorination process on a yttrium-based oxide coating or an oxidation process on a yttrium-based fluorine coating.
METAL OXY-FLOURIDE FILMS FOR CHAMBER COMPONENTS
An article comprises a body having a coating. The coating comprises a YOF coating or other yttrium-based oxy-fluoride coating generated either by performing a fluorination process on a yttrium-based oxide coating or an oxidation process on a yttrium-based fluorine coating.