Patent classifications
C23C16/448
HEATING ZONE SEPARATION FOR REACTANT EVAPORATION SYSTEM
Systems and methods related to temperature zone control systems can include a reactant source cabinet that is configured to be at least partially evacuated, a vessel base that is configured to hold solid source chemical reactant therein, and a lid that is coupled to a distal portion of the vessel base. The lid may include one or more lid valves. The system may further include a plurality of gas panel valves that are configured to deliver gas from a gas source to the vessel. The system may include a heating element that is configured to heat the one or more lid valves. The system may include a heat shield, a first portion of which is disposed between the one or more lid valves and the vessel base. A second portion of the heat shield may be disposed between the first heating element and the plurality of gas panel valves.
SUBSTRATE TREATMENT APPARATUS
The present disclosure relates to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate, which deposits a thin-film on a substrate.
The apparatus for processing a substrate in accordance with an exemplary embodiment includes a plurality of source gas supply units configured to respectively supply a plurality of source gases among which at least one contains (3-Dimethylaminopropyl)Dimethylindium (DADI), a gas mixing unit connected to each of the plurality of source gas supply units and having an inner space in which each of the plurality of source gases moves at a passing speed less than a supply speed of each of the plurality of source gases, and a chamber connected with the gas mixing unit and having a reaction space to which the source gases mixed in the inner space are supplied.
SUBSTRATE TREATMENT APPARATUS
The present disclosure relates to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate, which deposits a thin-film on a substrate.
The apparatus for processing a substrate in accordance with an exemplary embodiment includes a plurality of source gas supply units configured to respectively supply a plurality of source gases among which at least one contains (3-Dimethylaminopropyl)Dimethylindium (DADI), a gas mixing unit connected to each of the plurality of source gas supply units and having an inner space in which each of the plurality of source gases moves at a passing speed less than a supply speed of each of the plurality of source gases, and a chamber connected with the gas mixing unit and having a reaction space to which the source gases mixed in the inner space are supplied.
VAPORIZATION SUPPLY METHOD AND VAPORIZATION SUPPLY DEVICE
A vaporization supply device includes a vaporizer for heating and vaporizing a liquid raw material L, a flow rate controller for controlling a flow rate of the gas supplied from the vaporizer to a gas supply destination, and a controller for heating the inside of the vaporizer to obtain a necessary gas flow rate, and performing a feedback control so that a pressure becomes equal to or higher than a predetermined value. The controller is configured so as to stop the feedback control at the time point when the flow rate control by the flow rate controller starts, then heat the liquid raw material by an amount of heat provided to the vaporizer more than the heat that has already been provided immediately before the feedback control ends, and change to the feedback control after a predetermined time has elapsed from the time point when the flow rate control by the flow rate controller starts.
COMPOSITE COATING AND FABRICATION METHOD THEREOF
The present disclosure provides a composite coating and a method for fabricating the composite coating. The composite coating comprises a polymer layer, a metal interlayer and an amorphous metal coating. The polymer layer is formed on a substrate and acts as a diffusion barrier layer, which is thick and dense enough to prevent the corrosive substances from penetrating into the substrate. The metal interlayer is formed between the polymer layer and the amorphous metal coating for improving the adhesion of the amorphous metal coating to the substrate.
Process of Manufacture a Nuclear Component with Metal Substrate by Dlimocvd and Method against Oxidation/Hydriding of Nuclear Component
Process for manufacturing a nuclear component comprising i) a support containing a substrate based on a metal (1), the substrate (1) being coated or not coated with an interposed layer (3) positioned between the substrate (1) and at least one protective layer (2) and ii) the protective layer (2) composed of a protective material comprising chromium; the process comprising a step a) of vaporizing a mother solution followed by a step b) of depositing the protective layer (2) onto the support via a process of chemical vapor deposition of an organometallic compound by direct liquid injection (DLI-MOCVD).
Nuclear component comprising i) a support containing a substrate based on a metal, the substrate (1) being coated or not coated with an interposed layer (3) positioned between the substrate (1) and at least one protective layer (2) and ii) the protective layer (2) composed of a protective material comprising chromium. The composite nuclear component manufactured by the process of the invention has improved resistance to oxidation, hydriding and/or migration of undesired material.
The invention also relates to the use of the nuclear component for combating oxidation and/or hydriding.
Apparatus and Method of Manufacturing Oxide Film and Display Apparatus Including the Oxide Film
Disclosed are an apparatus and method of manufacturing an oxide film having a uniform composition and thickness. The apparatus includes a lower chamber including a reaction space, a susceptor to support a substrate, a chamber lid including gas injection ports, a gas distribution module between the chamber lid and the susceptor and connected to the gas injection ports, a first source container module comprising a first source gas having a first vapor pressure, a first carrier gas supply module supplying a first carrier gas to the first source container module, a second source container module comprising a second source gas having a second vapor pressure, a force gas supply module supplying a force gas, and a reactant gas supply module supplying a reactant gas.
DEVICE AND METHOD FOR EVAPORATING AN ORGANIC POWDER
In a method for evaporating a non-gaseous starting material, the starting material is introduced into an evaporation chamber; an evaporation element heats the starting material to create a vapor; a conveying gas flow transports the vapor through a conveying channel and past a sensor, which measures the concentration or partial pressure of the vapor in the gas flow flowing through the conveying channel; and the mass flow of the vapor through the conveying channel is controlled by varying the conveying gas flow with respect to a setpoint value. To keep the vapor flow largely constant over time, a compensating gas flow is fed into the conveying channel at a mixing point disposed between the evaporator and the sensor. A second mass flow controller controls the mass flow of the compensating gas flow such that, when the conveying gas flow varies, the gas flow flowing past the sensor remains constant.
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
Provided is processing of a substrate including: forming film on substrate by performing cycle, multiple times, including non-simultaneously performing: (a) supplying precursor gas and inert gas to the substrate; and (b) supplying reaction gas to the substrate. In (a), at least one of the precursor and inert gas stored in first tank is supplied to the substrate, and at least one of the precursor and inert gas stored in second tank is supplied to the substrate. A concentration of the precursor gas in the first tank differs from that in the second tank. Further, in (a), the at least one of the precursor and inert gas is supplied from the first tank to the substrate, and the at least one of the precursor and inert gas is supplied from the second tank to the substrate to suppress multiple adsorption of molecules constituting the precursor gas on the substrate's surface.
DUAL AMPOULE SEPARATOR PLATE AND METHOD
A system and method for reducing thermal transfer in a dual ampoule system. The dual ampoule system includes a first ampoule, a second ampoule, and a planar heat shield. The planar heat shield is positioned between the first ampoule and the second ampoule, where the planar heat shield is configured to resist thermal transfer between the first ampoule and the second ampoule.