Described herein is a technology for the creation of smooth metal oxide films or coatings using organic cross-linking agents to enable low-temperature sintering. These metal oxide films can be used in conjunction with low-melting temperature substrates, such as plastics, metal, metal oxide, and glass, providing exquisite control over surface roughness.

Described herein is a technology for the creation of smooth metal oxide films or coatings using organic cross-linking agents to enable low-temperature sintering. These metal oxide films can be used in conjunction with low-melting temperature substrates, such as plastics, metal, metal oxide, and glass, providing exquisite control over surface roughness.

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

Methods are provided for selectively depositing a material on a first surface of a substrate relative to a second, different surface of the substrate. The selectively deposited material can be, for example, a metal, metal oxide, or dielectric material.

Methods are provided for selectively depositing a material on a first surface of a substrate relative to a second, different surface of the substrate. The selectively deposited material can be, for example, a metal, metal oxide, or dielectric material.

A method of forming nanowires, including the forming on a metal region of a layer having through openings, and the forming in the through openings of portions deposited in a chemical bath, forming all or part of the nanowires and extending from the metal region.

A method of forming nanowires, including the forming on a metal region of a layer having through openings, and the forming in the through openings of portions deposited in a chemical bath, forming all or part of the nanowires and extending from the metal region.

By measuring a position of a spray gun relative to a physical surface to coat, using data on technical characteristics of the spray gun, like a spray cone the spray gun may produce and data on a coating fluid used, characteristics of a coating layer thus physically deposited may be reconstructed. With data being recording during the spray job, this is faster and more accurate than measuring layer thickness at various locations, either pre-determined or randomly. By determining flow characteristics in a spray cone and position of the spray cone relative to the surface over time and using a model of the spray cone, deposition of the layer of coating may be determined and the final layer, cured or uncured, may be reconstructed, including thickness.

A method and system for forming a thin patterned metal film on a substrate are presented. The method includes applying an ink composition on a pre-treated surface of the substrate, wherein the ink composition includes at least metal cations; and exposing at least the applied ink composition on the substrate to a low-energy plasma, wherein the low-energy plasma is operated according to a first set of exposure parameters.

A method and system for forming a thin patterned metal film on a substrate are presented. The method includes applying an ink composition on a pre-treated surface of the substrate, wherein the ink composition includes at least metal cations; and exposing at least the applied ink composition on the substrate to a low-energy plasma, wherein the low-energy plasma is operated according to a first set of exposure parameters.