A composite structural component is disclosed. The composite structural component can include a lattice structure, a casing disposed about at least a portion of the lattice structure, and a skin adhered to a surface of the casing. The lattice structure and the casing can be formed of a polymeric material and the skin can be formed of a metallic material. A method of manufacturing a composite structural component is disclosed. The method can include creating a casing of a polymeric material and creating a lattice structure of a polymeric material disposed about at least a portion of the casing. The method can include sealing the porosity of the casing and lattice structure. The method can include adhering a skin of a metallic material to at least a portion of the casing. At least one of creating a lattice structure and creating a casing comprises utilizing an additive manufacturing process.

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

Non-gas emitting electrodes having a very high surface area, high electric capacitance, and low electric resistance are integrated with silver and/or silver chloride for use in electrodialysis/electrodeionization cells, or in any other system requiring the generation of electric fields through electrolyte solutions, and are capable of generating an electric field for extensive periods of time without generation of gases, and without the occurrence of water splitting electrode reactions. Each electrode is highly porous and highly conductive, such as a carbon aerogel electrode, and thus has a very large internal surface area, which is infused with silver and/or silver chloride. This combination supercapacitor and pseudocapacitor electrode can sustain electrode reactions for longer periods of time, and at much higher current densities, as compared to conventional (solid) silver/silver chloride electrodes.

Non-gas emitting electrodes having a very high surface area, high electric capacitance, and low electric resistance are integrated with silver and/or silver chloride for use in electrodialysis/electrodeionization cells, or in any other system requiring the generation of electric fields through electrolyte solutions, and are capable of generating an electric field for extensive periods of time without generation of gases, and without the occurrence of water splitting electrode reactions. Each electrode is highly porous and highly conductive, such as a carbon aerogel electrode, and thus has a very large internal surface area, which is infused with silver and/or silver chloride. This combination supercapacitor and pseudocapacitor electrode can sustain electrode reactions for longer periods of time, and at much higher current densities, as compared to conventional (solid) silver/silver chloride electrodes.

A method for surface treatment of a metal substrate, suitable for use as electrode support in electrochemical processes by: (a) immersion of the metal substrate and of at least one counter electrode in an electrolyte selected from hydrochloric acid, nitric acid, boric acid or sulfuric acid at a weight concentration of between 10-40%; (b) application of an anodic current density to the metal substrate of between 0.1 and 30 A/dm.sup.2 for a time of between 0.5 and 120 minutes. An electrode for gas evolution in electrochemical processes obtained from a correspondingly treated substrate.

One aspect relates to a method for the manufacture of a medical electrode, including: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic precious metal complex compound that is dissolved in the solvent; (iii) heating the composition and thereby forming a precious metal layer on the substrate, wherein the solubility of the organic precious metal complex compound in propylene glycol mono-propyl ether at 25° C. and 1013 hPa is at least 1 mass percent, or at least 2, 3, 4, 5 or 10 mass percent, in relation to the total mass of the composition.

One aspect relates to a method for the manufacture of a medical electrode, including: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic precious metal complex compound that is dissolved in the solvent; (iii) heating the composition and thereby forming a precious metal layer on the substrate, wherein the solubility of the organic precious metal complex compound in propylene glycol mono-propyl ether at 25° C. and 1013 hPa is at least 1 mass percent, or at least 2, 3, 4, 5 or 10 mass percent, in relation to the total mass of the composition.

The invention relates to a method for coating a substrate with a noble metal layer, which comprises the following steps: (i) providing a substrate; (ii) applying a liquid noble metal ink to the substrate, wherein the noble metal ink contains less than 10 percent by weight of noble metal, based on the total weight of the noble metal ink; and (iii) heating the liquid noble metal ink, and thereby forming a noble metal layer on the substrate.

The invention relates to a method for coating a substrate with a noble metal layer, which comprises the following steps: (i) providing a substrate; (ii) applying a liquid noble metal ink to the substrate, wherein the noble metal ink contains less than 10 percent by weight of noble metal, based on the total weight of the noble metal ink; and (iii) heating the liquid noble metal ink, and thereby forming a noble metal layer on the substrate.