C23C18/143

Methods of electrochemical deposition

A method of electrochemical deposition of a metallic material onto a substrate is provided. The method includes providing an alkaline solution of hydroxide ions, immersing a metallic material precursor and the substrate into the alkaline solution to form an electrochemical bath, and electrochemically depositing a textured layer of the metallic material onto the substrate. A method of electrochemical deposition of a textured nanoparticle is provided. The method includes providing an alkaline solution of hydroxide ions, immersing the metallic material into the alkaline solution to form an electrochemical bath, and precipitating the textured nanoparticles from the electrochemical bath. A method of electrochemical deposition of a metallic material onto a nanoparticle is provided. The method includes providing an alkaline solution of hydroxide ions, immersing the metallic material and the nanoparticle into the alkaline solution to form an electrochemical bath, and depositing a textured layer of the metallic material onto the nanoparticle.

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A photocatalytic device includes a substrate and an array of conductive projections supported by the substrate and extending outward from the substrate. Each conductive projection of the array of conductive projections has a semiconductor composition configured for charge carrier generation in response to solar radiation. Each conductive projection of the array of conductive projections is decorated with a co-catalyst arrangement. The co-catalyst arrangement includes gold and an oxide material.

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A photocatalytic device includes a substrate and an array of conductive projections supported by the substrate and extending outward from the substrate. Each conductive projection of the array of conductive projections has a semiconductor composition configured for charge carrier generation in response to light radiation. Each conductive projection of the array of conductive projections is decorated with a catalyst arrangement, the catalyst arrangement including a parental Group IB metal and a secondary platinum group metal.