C23C18/18

Plating apparatus, plating method and storage medium

A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.

Plating apparatus, plating method and storage medium

A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.

Vacuum-integrated hardmask processes and apparatus

Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

Method of electrolessly plating nickel on tubulars
09752232 · 2017-09-05 ·

Tubulars are immersed in electroless nickel coating solution to coat the tubulars. Prior to the coating step the tubulars are blasted with a clean medium and washed and rinsed in alkaline solution. The tubulars are arranged in a bunk for washing, rinsing and coating. LLDPE stretch wrap applied to outer portions of the tubulars prevents coating of the outer portions. The tubulars are electrically separated from the bunk and the coating solution tank, and the tank is provided with anodic protection to prevent coating of the tank. The bunk is provided with a header assembly to provide solution flow through the tubulars via nozzles on the header assembly in addition to flow caused by the vortex effect created by velocity of fluid exiting the nozzles. The bunk is arranged in the solution tank so that the tubulars are at an angle to horizontal to efficiently remove hydrogen gas. Solution flow to the header assembly is filtered to remove particulates.

HORIZONTAL METHOD OF ELECTROLESS METAL PLATING OF SUBSTRATES WITH IONIC CATALYSTS
20170251557 · 2017-08-31 ·

Horizontal methods of electroless metal plating with ionic catalysts have improved plating performance by reducing undesired foaming. The reduced foaming prevents loss of ionic catalyst from the catalyst bath and prevents scum formation which inhibits catalyst performance. The horizontal methods also inhibit ionic catalyst precipitation and improve adhesion of the ionic catalyst to the substrate. The horizontal method can be used to plate through-holes and vias of various types of substrates.

Method of manufacturing rotary machine, method of plating rotary machine, and rotary machine

Provided is a method of manufacturing a rotary machine, which includes: a casing forming process of forming a casing of the rotary machine that has multiple opening parts and suctions and discharges a fluid; a surface activating process of supplying a pretreatment liquid into the casing, then discharging the pretreatment liquid from the casing through the opening parts, and activating an inner surface of the casing after the casing forming process; a plating process of performing supply and discharge of a plating liquid into and from the easing through the opening parts to circulate the plating liquid and plating the inner surface of the casing after the surface activating process; and an assembling process of providing a rotating body that is rotatable relative to the casing so as to he covered from an outer circumference side by the casing plated in the plating process.

Method of manufacturing rotary machine, method of plating rotary machine, and rotary machine

Provided is a method of manufacturing a rotary machine, which includes: a casing forming process of forming a casing of the rotary machine that has multiple opening parts and suctions and discharges a fluid; a surface activating process of supplying a pretreatment liquid into the casing, then discharging the pretreatment liquid from the casing through the opening parts, and activating an inner surface of the casing after the casing forming process; a plating process of performing supply and discharge of a plating liquid into and from the easing through the opening parts to circulate the plating liquid and plating the inner surface of the casing after the surface activating process; and an assembling process of providing a rotating body that is rotatable relative to the casing so as to he covered from an outer circumference side by the casing plated in the plating process.

AQUEOUS ALKALINE PRE-TREATMENT SOLUTION FOR USE PRIOR TO DEPOSITION OF A PALLADIUM ACTIVATION LAYER, METHOD AND USE THEREOF

The invention relates to an aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer on a substrate in manufacturing an article with an integrated circuit and a method and use thereof, wherein the solution comprises: at least one hydroxycarboxylic acid or salt thereof according to the general formula (I)


[RCH.sub.2—(RCH).sub.n—COO.sup.−].sub.m M.sup.m+  (I)

wherein n is integer from 2 to 4 and m is 1 or 2, R is independently H or OH with proviso that at least one R is OH, and wherein M.sup.m+ with m: 1 is hydrogen, ammonium or alkali metal; or M.sup.m+ with m: 2 is earth alkali metal, at least one polyoxyethylene sorbitan fatty acid ester, at least one sulphonated fatty acid or a salt thereof.

MECHANICAL COMPONENT FOR INTERNAL COMBUSTION ENGINE, MANUFACTURING METHOD OF MECHANICAL COMPONENT FOR INTERNAL COMBUSTION ENGINE, AND MECHANICAL COMPONENT

A mechanical component for an internal combustion engine includes a mechanical component body made of one of aluminum and aluminum alloy and used for the internal combustion engine, a nickel plating layer formed to cover a surface of a predetermined portion of the mechanical component body, and a reforming layer formed between the surface of the predetermined portion of the mechanical component body and the nickel plating layer.

MULTI-FUNCTIONALIZED CARBON NANOTUBES
20170267532 · 2017-09-21 ·

The present invention relates to a method of manufacturing coated carbon nanotubes, the method comprising the steps of: functionalizing the carbon nanotubes in a solvent comprising a silane polymer; coating the carbon nanotubes with a SiO.sub.2 layer; depositing metal catalyst particles on the SiO.sub.2 layer of the carbon nanotubes; and performing electroless plating to form an Ag coating on the SiO.sub.2 layer of the carbon nanotubes. The invention also relates Ag-coated CNTs, and to the use of Ag-coated CNTs as interconnects in a flexible electronic film.