Patent classifications
C23C18/31
METHOD FOR ALUMINUM ELECTROLESS DEPOSITION
A method for electroless deposition of aluminum or an aluminum alloy on a substrate surface. The method includes activating the surface of the substrate to be coated by applying a coating of a catalyst metal; preparing a mixture of urea ((NH.sub.2CONH.sub.2) and anhydrous aluminum chloride (AlCl.sub.3) wherein a molar ratio of AlCl.sub.3:(NH.sub.2CONH.sub.2 is greater than 1:1 to obtain a Lewis acid room temperature ionic liquid (RTIL) optionally containing an alloy metal salt; dissolving a hydride reducing agent in an aprotic anhydrous solvent to obtain a hydride solution; mixing the hydride solution and the AlCl.sub.3:(NH.sub.2CONH.sub.2 RTIL to obtain an electroless Al solution; exposing the activated surface of the substrate to the electroless Al solution; and removing the electroless Al solution from the substrate surface; wherein upon exposure of the activated substrate surface to the electroless Al solution, an Al or Al alloy coating is obtained on the activated substrate surface.
Method for reducing thin films on low temperature substrates
A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.
Method for reducing thin films on low temperature substrates
A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.
METHODS FOR ELECTROPOLISHING AND COATING ALUMINUM ON AIR AND/OR MOISTURE SENSITIVE SUBSTRATES
Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5-y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5-y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.
METHODS FOR ELECTROPOLISHING AND COATING ALUMINUM ON AIR AND/OR MOISTURE SENSITIVE SUBSTRATES
Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5-y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5-y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.
Method for embedding inserts, fasteners and features into metal core truss panels
Systems and method for fabricating a metal core truss panel with seamlessly embedded features in accordance with embodiments of the invention are illustrated. One embodiment includes a method for producing a metal core truss panel composite, the method including fabricating a sacrificial core truss panel including a plurality of interconnected truss members and at least one embedded feature, and plating the sacrificial core truss panel with a layer of metal forming a metal core truss panel including a plurality of interconnected metal truss members and at least one seamlessly embedded metal feature.
Method for embedding inserts, fasteners and features into metal core truss panels
Systems and method for fabricating a metal core truss panel with seamlessly embedded features in accordance with embodiments of the invention are illustrated. One embodiment includes a method for producing a metal core truss panel composite, the method including fabricating a sacrificial core truss panel including a plurality of interconnected truss members and at least one embedded feature, and plating the sacrificial core truss panel with a layer of metal forming a metal core truss panel including a plurality of interconnected metal truss members and at least one seamlessly embedded metal feature.
Method for metal layer formation
A method for forming a crystalline metal layer on a three-dimensional (3D) substrate is provided. The method includes applying crystal growth ink to a surface of the 3D substrate, wherein the crystal growth ink includes a metal ionic precursor and a structuring liquid; and exposing the 3D substrate to plasma irradiation from plasma in a vacuum chamber to cause the growing of a crystalline metal layer on the 3D substrate, wherein the exposure is based on a set of predefined exposure parameters.
Method for metal layer formation
A method for forming a crystalline metal layer on a three-dimensional (3D) substrate is provided. The method includes applying crystal growth ink to a surface of the 3D substrate, wherein the crystal growth ink includes a metal ionic precursor and a structuring liquid; and exposing the 3D substrate to plasma irradiation from plasma in a vacuum chamber to cause the growing of a crystalline metal layer on the 3D substrate, wherein the exposure is based on a set of predefined exposure parameters.
Method for modifying polypropylene resin molded body, modified polypropylene resin molded body and method for producing same
Provided is a method for modifying a polypropylene resin molded body with a side chain crystalline block copolymer having a long alkane chain in a side chain, having a good interaction force with the polypropylene resin molded body, and having a function capable of modifying surface characteristics. Also provided is a modified polypropylene resin molded body. The method for modifying a polypropylene resin molded body includes a step of contacting a copolymer solution including a side chain crystalline block copolymer with a polypropylene resin molded body at a temperature of the copolymer solution of 40 to 120° C. The modified polypropylene resin molded body includes a base material of the polypropylene resin molded body and a site that includes the side chain crystalline block copolymer in at least part of the base material.