A belt for an elevator system includes a plurality of tension members arranged along a belt width, a jacket material at least partially encapsulating the plurality of tension members defining a traction surface, a back surface opposite the traction surface together with the traction surface defining a belt thickness, and two end surfaces extending between the traction surface and the back surface defining the belt width. A metallic coating layer applied from a liquid solution is positioned over at least one end surface of the two end surfaces.

A belt for an elevator system includes a plurality of tension members arranged along a belt width, a jacket material at least partially encapsulating the plurality of tension members defining a traction surface, a back surface opposite the traction surface together with the traction surface defining a belt thickness, and two end surfaces extending between the traction surface and the back surface defining the belt width. A metallic coating layer applied from a liquid solution is positioned over at least one end surface of the two end surfaces.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

A new primer for electroless plating for use in a pretreatment process of electroless plating, is environmentally friendly, can be treated in fewer process steps, and can facilitate formation of fine-pitch wiring with a width of a few μm by photolithography. A photosensitive primer for forming a metal plating film on a base material through an electroless plating process has (a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 1,000 to 5,000,000, (b) metal fine particles, (c) a polymerizable compound having three or more (meth)acryloyl groups in a molecule, and (d) a photopolymerization initiator.

A new primer for electroless plating for use in a pretreatment process of electroless plating, is environmentally friendly, can be treated in fewer process steps, and can facilitate formation of fine-pitch wiring with a width of a few μm by photolithography. A photosensitive primer for forming a metal plating film on a base material through an electroless plating process has (a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 1,000 to 5,000,000, (b) metal fine particles, (c) a polymerizable compound having three or more (meth)acryloyl groups in a molecule, and (d) a photopolymerization initiator.

Method for metallising a porous structure made of carbon material, the method comprising the following steps: supplying a porous structure made of carbon material, immersing the porous structure in a solution comprising an ionic liquid, formed by a cation and an anion, and a metal precursor, placing the porous structure in a vacuum, immersed in the solution, in such a way as to cause the solution to penetrate into the porosity of the porous structure, adding a hydrogenated reducing agent, in such a way as to metallise the porous structure to within the porosity of the porous structure.

Method for metallising a porous structure made of carbon material, the method comprising the following steps: supplying a porous structure made of carbon material, immersing the porous structure in a solution comprising an ionic liquid, formed by a cation and an anion, and a metal precursor, placing the porous structure in a vacuum, immersed in the solution, in such a way as to cause the solution to penetrate into the porosity of the porous structure, adding a hydrogenated reducing agent, in such a way as to metallise the porous structure to within the porosity of the porous structure.

A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.

A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.