An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.

An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.

An electroless nickel-copper-phosphorous coating includes at least about 30% by weight Cu: about 5% to about 15% by weight P; and the balance Ni, with incidental impurities. The electroless nickel-copper-phosphorus coating exhibits antipathogenic properties and enhanced wear when deposited on a substrate.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

Disclosed herein is a structure for strengthening strength and a method of manufacturing the same, and more particularly to a structure for strengthening strength in which a coating layer made of material containing tungsten is formed on the surface of a base of a base metal or a bass of a metal base. According to the present invention, it is possible to substitute synthetic resins and metal products which are currently manufactured and used, exhibit excellent physical properties and mechanical properties as compared with those of synthetic resins and metal products. And also if necessary, the surface of the metal plating of the structure according to the present invention may be plated with various precious metals such as gold and silver to meet the demand of the customer.

A phosphate solution for a zinc or zinc-based alloy plated steel sheet, and a zinc or zinc-based alloy plated steel sheet using the same are provided. The phosphate solution for a zinc or zinc-based alloy plated steel sheet contains a molybdenum (Mo) ion, a calcium (Ca) ion and a phosphate ion. A zinc or zinc-based alloy plated steel sheet includes a base steel sheet, a zinc-based or zinc alloy-based plating layer formed on the base steel sheet, and a phosphate film formed on the zinc-based or zinc alloy-based plating layer. The phosphate film contains a molybdenum compound, Ca and a phosphate. A pitting phenomenon occurring at the time of treating a steel sheet with a phosphate is prevented, and excellent corrosion resistance is exhibited on a phosphate film.

A phosphate solution for a zinc or zinc-based alloy plated steel sheet, and a zinc or zinc-based alloy plated steel sheet using the same are provided. The phosphate solution for a zinc or zinc-based alloy plated steel sheet contains a molybdenum (Mo) ion, a calcium (Ca) ion and a phosphate ion. A zinc or zinc-based alloy plated steel sheet includes a base steel sheet, a zinc-based or zinc alloy-based plating layer formed on the base steel sheet, and a phosphate film formed on the zinc-based or zinc alloy-based plating layer. The phosphate film contains a molybdenum compound, Ca and a phosphate. A pitting phenomenon occurring at the time of treating a steel sheet with a phosphate is prevented, and excellent corrosion resistance is exhibited on a phosphate film.