Methods of enhancing the corrosion resistance of an oxidizable material exposed to a supercritical fluid is disclosed One method includes placing a surface layer on an oxidizable material, and choosing a buffered supercritical fluid containing a reducing agent with the composition of the buffered supercritical fluid containing the reducing agent chosen to avoid the corrosion of the surface layer or reduce the rate of corrosion of the surface layer and avoid the corrosion of the oxidizable material or reduce the rate of corrosion of the oxidizable material at a temperature above the supercritical temperature and supercritical pressure of the supercritical fluid.

Methods of enhancing the corrosion resistance of an oxidizable material exposed to a supercritical fluid is disclosed One method includes placing a surface layer on an oxidizable material, and choosing a buffered supercritical fluid containing a reducing agent with the composition of the buffered supercritical fluid containing the reducing agent chosen to avoid the corrosion of the surface layer or reduce the rate of corrosion of the surface layer and avoid the corrosion of the oxidizable material or reduce the rate of corrosion of the oxidizable material at a temperature above the supercritical temperature and supercritical pressure of the supercritical fluid.

An object of the present invention is to provide an electromagnetic wave penetrative metal film having high mass productivity and an extremely low attenuation rate in the electromagnetic wave penetrated through, a manufacturing method of the electromagnetic wave penetrative metal film, and a radome for a vehicle-mounted radar devices using the electromagnetic wave penetrative metal file. To achieve the object, the present invention provides an electromagnetic wave penetrative metal film composed of more than 10000 of fine metal film pieces per unit area (1 mm.sup.2) provided on a surface of a substrate through an electroless plating step, wherein fine metal film pieces adjacent to each other are electrically isolated, a manufacturing method of the electromagnetic wave penetrative metal film, and a radome for a vehicle-mounted radar devices using the electromagnetic wave penetrative metal film.

An object of the present invention is to provide an electromagnetic wave penetrative metal film having high mass productivity and an extremely low attenuation rate in the electromagnetic wave penetrated through, a manufacturing method of the electromagnetic wave penetrative metal film, and a radome for a vehicle-mounted radar devices using the electromagnetic wave penetrative metal file. To achieve the object, the present invention provides an electromagnetic wave penetrative metal film composed of more than 10000 of fine metal film pieces per unit area (1 mm.sup.2) provided on a surface of a substrate through an electroless plating step, wherein fine metal film pieces adjacent to each other are electrically isolated, a manufacturing method of the electromagnetic wave penetrative metal film, and a radome for a vehicle-mounted radar devices using the electromagnetic wave penetrative metal film.

The present invention relates to method of preparing a monocrystalline diamond abrasive grain comprising the steps of: sufficiently dispersing a micron-scale monocrystalline diamond and at least a micron-scale metal powder in a sol containing at least a nano-scale metal powder, and controlling the suitable ratio of the two kinds of metal powder with different order of magnitude of particle size, accordingly the micron-scale metal powder can be stuffed into voids among the monocrystalline diamond grains, and only a suitable amount of nano-scale metal powder is required to let the micron-scale metal powder and nano-scale metal powder coat together on the surface of the micron-scale diamond to form an integral and uniform coating layer including at least two kinds of metal grains, thus the resulting monocrystalline diamond abrasive grains have a unique rough-surface morphology, a plurality of contact points and contact surfaces resenting in the grinding process and good self-sharpening.

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallization of display applications.

The present invention relates to the lead-zirconate-titanate (PZT) amorphous alloy plating solution which may be used to form a PZT amorphous alloy film having excellent mechanical and physical properties and a method for plating a PZT amorphous alloy using the same. The PZT amorphous alloy plating solution may include a Pb precursor, a Zr precursor, and a Ti precursor. 1050 parts by weight of the Zr precursor and 530 parts by weight of the Ti precursor may be included based on 100 parts by weight of the Pb precursor. Accordingly, electrical conductivity can be improved because the PZT amorphous alloy plating solution has a structure which has low crystallinity or which is amorphous. Furthermore, excellent electrical characteristics can be achieved because the PZT amorphous alloy plating solution has excellent conductivity or chemical stability.

The present invention relates to the lead-zirconate-titanate (PZT) amorphous alloy plating solution which may be used to form a PZT amorphous alloy film having excellent mechanical and physical properties and a method for plating a PZT amorphous alloy using the same. The PZT amorphous alloy plating solution may include a Pb precursor, a Zr precursor, and a Ti precursor. 1050 parts by weight of the Zr precursor and 530 parts by weight of the Ti precursor may be included based on 100 parts by weight of the Pb precursor. Accordingly, electrical conductivity can be improved because the PZT amorphous alloy plating solution has a structure which has low crystallinity or which is amorphous. Furthermore, excellent electrical characteristics can be achieved because the PZT amorphous alloy plating solution has excellent conductivity or chemical stability.

An arc-ablation resistant switch contact and a preparation method thereof is disclosed. The switch contact is a complex having a plurality of layers of layered structure, wherein a first layer is a hydrophobic rubber layer, a second layer is an adhesive layer, a third layer is a sheet metal layer, a fourth layer is an adhesive layer, and a fifth layer is a metal plated layer; wherein, the fifth layer of metal plated layer is formed by dipping a complex of the first layer, the second layer, the third layer and the fourth layer in a chemical plating bath containing refractory metal elements, and depositing on surfaces of the second layer, the third layer and the fourth layer in the complex by a chemical deposition method.

An arc-ablation resistant switch contact and a preparation method thereof is disclosed. The switch contact is a complex having a plurality of layers of layered structure, wherein a first layer is a hydrophobic rubber layer, a second layer is an adhesive layer, a third layer is a sheet metal layer, a fourth layer is an adhesive layer, and a fifth layer is a metal plated layer; wherein, the fifth layer of metal plated layer is formed by dipping a complex of the first layer, the second layer, the third layer and the fourth layer in a chemical plating bath containing refractory metal elements, and depositing on surfaces of the second layer, the third layer and the fourth layer in the complex by a chemical deposition method.