Patent classifications
C
CHEMISTRY; METALLURGY
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C23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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C23C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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18/00
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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C23C18/16
by reduction or substitution, e.g. electroless plating
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C23C18/48

Metallic coated substrates
12571105 · 2026-03-10 · ·

The invention relates to metallic substrates surface coated with a coating layer comprising a metal and an additive.

ELECTROLESS PLATING SOLUTION
20260071330 · 2026-03-12 ·

According to this invention, disclosed is an electroless plating solution containing a metal ion source having a parent phase that contains Sn and a Sn-Cu alloy, and an intermetallic compound crystal that contains Sn, Cu, Cr and Al, dispersed in the parent phase.

ELECTROLESS PLATING SOLUTION
20260071330 · 2026-03-12 ·

According to this invention, disclosed is an electroless plating solution containing a metal ion source having a parent phase that contains Sn and a Sn-Cu alloy, and an intermetallic compound crystal that contains Sn, Cu, Cr and Al, dispersed in the parent phase.