C23C18/52

USE OF AN AQUEOUS ALKALINE COMPOSITION FOR THE ELECTROLESS DEPOSITION OF A METAL OR METAL ALLOY ON A METAL SURFACE OF A SUBSTRATE

An aqueous alkaline deposition composition for the electroless deposition or metal or metal alloy on a metal surface, the composition comprising: (a) functionalized urea derivatives and/or salts thereof selected from the group comprising compounds having formula I and/or salts thereof:

##STR00001## wherein X is selected as oxygen; R.sup.1 and R.sup.2 are independently selected as nitrogen-comprising heteroaromatic compounds; wherein R.sup.1 and R.sup.2 can be identical or different; m is an integer from 1 to 6; and n is an integer from 1 to 6; wherein m and n can be identical or different; (b) one source of metal ions to be deposited onto the metal surface of the substrate wherein the deposited metal or metal alloy is different from the metal or metal alloy of the metal surface; and (c) optionally one source of alloying metal ions; and a method for the electroless deposition.

USE OF AN AQUEOUS ALKALINE COMPOSITION FOR THE ELECTROLESS DEPOSITION OF A METAL OR METAL ALLOY ON A METAL SURFACE OF A SUBSTRATE

An aqueous alkaline deposition composition for the electroless deposition or metal or metal alloy on a metal surface, the composition comprising: (a) functionalized urea derivatives and/or salts thereof selected from the group comprising compounds having formula I and/or salts thereof:

##STR00001## wherein X is selected as oxygen; R.sup.1 and R.sup.2 are independently selected as nitrogen-comprising heteroaromatic compounds; wherein R.sup.1 and R.sup.2 can be identical or different; m is an integer from 1 to 6; and n is an integer from 1 to 6; wherein m and n can be identical or different; (b) one source of metal ions to be deposited onto the metal surface of the substrate wherein the deposited metal or metal alloy is different from the metal or metal alloy of the metal surface; and (c) optionally one source of alloying metal ions; and a method for the electroless deposition.

Method of manufacturing metal composite powder by wire explosion in liquid and multi carbon layer coated metal composite powder

Disclosed are a method of producing a metal composite powder by wire explosion in a liquid and a metal composite powder that is coated with a multi carbon layer. The production method includes a process of forming a first carbon layer on a surface of a metal wire consisting of a first metal, a process of forming a metal layer consisting of a second metal, which is different from the first metal, on a surface of the first carbon layer, and a process of forming a metal composite powder coated with a multi carbon layer by wire exploding the metal wire containing the first carbon layer and the metal layer formed on a surface thereof in a solution.

Method of manufacturing metal composite powder by wire explosion in liquid and multi carbon layer coated metal composite powder

Disclosed are a method of producing a metal composite powder by wire explosion in a liquid and a metal composite powder that is coated with a multi carbon layer. The production method includes a process of forming a first carbon layer on a surface of a metal wire consisting of a first metal, a process of forming a metal layer consisting of a second metal, which is different from the first metal, on a surface of the first carbon layer, and a process of forming a metal composite powder coated with a multi carbon layer by wire exploding the metal wire containing the first carbon layer and the metal layer formed on a surface thereof in a solution.

Method of electroless plating using a solution with at least two borane containing reducing agents

A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

Method for producing a corrosion resistant steel and corrosion resistant steel provided thereby

A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.

METHOD FOR MANUFACTURING LAMINATE CONTAINING PATTERNED LAYERS TO BE PLATED, METHOD FOR MANUFACTURING METAL LAYER-CONTAINING LAMINATE, TOUCH PANEL SENSOR, TOUCH PANEL, LAMINATE CONTAINING PATTERNED LAYERS TO BE PLATED, AND METAL LAYER-CONTAINING LAMINATE
20170160837 · 2017-06-08 · ·

A method for manufacturing a laminate containing patterned layers to be plated includes a step of preparing a laminate having a substrate having two main surfaces, and layers for forming a layer to be plated, respectively disposed on two main surfaces of the substrate and containing a polymerization initiator, a step of irradiating a layer for forming a layer to be plated in the laminate with light in a patternwise fashion under a predetermined requirement, and a step of removing non-light irradiated regions in the layers for forming a layer to be plated, thereby forming patterned layers to be plated on two main surfaces of the substrate. Also set forth are a touch panel sensor, a touch panel, a laminate containing patterned layers to be plated, and a metal layer-containing laminate.

Plating stack

The problem of the present invention is to provide a plating stack (a stack of plating films) for applying on surface of conductor circuits or the like, the plating stack can maintain high bond strength when solder is bonded on that and can be produced stably. In the method for producing a plating stack of the present invention, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of palladium is deposited on the plating layer A, and then a plating layer C mainly composed of nickel is deposited on the plating layer B by a redox reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum or silver.

Primer for electroless plating comprising hyperbranched polymer and metal fine particles
09650534 · 2017-05-16 · ·

There is provided a novel, environmentally friendly primer for use in the pretreatment steps in electroless plating, which can be easily used in fewer steps with a lower cost. A primer for forming a metallic plating film on a substrate by electroless plating, the primer including: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; and a metal fine particle.

DE-BOUNCING KEYPAD AND PREPARATION METHOD THEREOF

The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.