Patent classifications
C23C22/74
Stainless steel member and production method thereof
The purpose of the present invention is to provide a stainless steel member and a production method thereof, said stainless steel member having a passivation layer formed on a surface of a base material formed from stainless steel, wherein the film thickness of the passivation layer is 2-20 nm, and the concentration of chromium atoms in the outermost surface of the passivation layer is 0.1-2.3 by atomic percentage. Also provided are a device or container, the liquid-contact part of which in contact with a semiconductor treatment liquid is formed from the stainless steel member, a semiconductor treatment liquid production method for producing the semiconductor treatment liquid by using the device, and a semiconductor treatment liquid storage method for storing the semiconductor treatment liquid in the container.
Grain-oriented electrical steel sheet and method of manufacturing grain-oriented electrical steel sheet
A grain-oriented electrical steel sheet according to an aspect of the present invention includes: a steel sheet 1; an intermediate layer 4 containing Si and O, arranged on the steel sheet; and an insulation coating 3 arranged on the intermediate layer 4, in which the intermediate layer 4 contains a metal phosphide 5, a thickness of the intermediate layer 4 is 4 nm or more, and an abundance of the metal phosphide 5 present is 1% to 30% by cross-sectional area fraction in a cross section of the intermediate layer 4.
STAINLESS STEEL MEMBER AND PRODUCTION METHOD THEREOF
The purpose of the present invention is to provide a stainless steel member and a production method thereof, said stainless steel member having a passivation layer formed on a surface of a base material formed from stainless steel, wherein the film thickness of the passivation layer is 2-20 nm, and the concentration of chromium atoms in the outermost surface of the passivation layer is 0.1-2.3 by atomic percentage. Also provided are a device or container, the liquid-contact part of which in contact with a semiconductor treatment liquid is formed from the stainless steel member, a semiconductor treatment liquid production method for producing the semiconductor treatment liquid by using the device, and a semiconductor treatment liquid storage method for storing the semiconductor treatment liquid in the container.
COATING LIQUID FOR FORMING INSULATION COATING FOR GRAIN-ORIENTED ELECTRICAL STEEL SHEET, METHOD OF MANUFACTURING GRAIN-ORIENTED ELECTRICAL STEEL SHEET, AND GRAIN-ORIENTED ELECTRICAL STEEL SHEET
In the present invention, there is provided a coating liquid for forming an insulation coating for a grain-oriented electrical steel sheet, including: a solvent; and one or two more layered clay mineral powders having a specific surface area of 20 m.sup.2/g or more. In addition, in the present invention, there is provided a grain-oriented electrical steel sheet including: a base metal; and an insulation coating provided on a surface of the base metal, in which the insulation coating contains SiO.sub.2, and one or two of Al.sub.2O.sub.3 and MgO, and has a porosity of 10% or less.
ZINC-BASED PLATED STEEL SHEET HAVING POST-TREATED COATING FORMED THEREON AND POST-TREATMENT METHOD THEREFOR
Provided is a zinc-based plated steel sheet having a post-treated coating filmed thereon including: a steel sheet; a zinc plated layer formed on the steel sheet; and a post-treated coating formed on the plated layer, wherein the atomic ratio (O/M) of oxygen (O) to metals (M) contained in the post-treated coating is greater than 2 and less than 20, and a method for post-treating a zinc-based plated steel sheet. According to this, the zinc-based plated steel sheet having the post-treated coating formed thereon has the effects excellent in lubricity, weldability, adhesiveness, film-removing property and paintability. As the method of post-treating a zinc-based plated steel sheet of the present invention employs a simple coating method irrespective of the kind of plating layer, the process is simple and economical and the process operation cost is low.
ORIENTED ELECTRICAL STEEL SHEET AND METHOD FOR PRODUCING SAME
Provided are: an oriented electrical steel sheet having a high tension applied to a steel sheet and excellent adhesion to a film; and a method for producing the same. This oriented electrical steel sheet includes: a steel sheet; a film A containing a crystalline material disposed on the steel sheet; and a film B containing a vitreous material disposed on the film A, wherein an element profile, which is obtained by using a high-frequency glow discharge light-emission surface analysis method, in the direction from the film B to the steel sheet satisfies formulae (1) and (2). 0.35(t.sub.A/t.sub.Fe/2)0.75 . . . (1), 0.25(t.sub.A/2/t.sub.Fe/2)1.00 . . . (2), where t.sub.A represents the peak time of an alkali metal element profile, t.sub.A/2 represents the half time of an alkali metal.
COATING SOLUTION FOR FORMING INSULATING FILM FOR GRAIN-ORIENTED ELECTRICAL STEEL SHEET, AND METHOD FOR PRODUCING GRAIN-ORIENTED ELECTRICAL STEEL SHEET
A coating solution for forming an insulating film for a grain-oriented electrical steel sheet which contains one or more types of hydrous silicate powders having an average particle size of 2 m or less, and one or more types of phosphoric acids and phosphates satisfying a relation of n.sub.iM.sub.i/P.sub.i0.5, and satisfies (Formula 1). 1.5(n.sub.iM.sub.i+n.sub.jM.sub.j)/P.sub.i15 . . . (Formula 1) (P represents the number of moles of phosphorus, M represents the number of moles of metal ions derived from the phosphate, n represents the valence of the metal ions derived from the phosphate, i represents the number of types of phosphates, M represents the number of moles of metal elements in the hydrous silicate, n represents the valence of the metal elements in the hydrous silicate, and j represents the number of types of hydrous silicates).
GRAIN ORIENTED ELECTRICAL STEEL SHEET
A grain oriented electrical steel sheet includes: a base steel sheet; a glass film which is arranged in contact with the base steel sheet; and an insulation coating which is arranged in contact with the glass film and which includes a phosphate and a colloidal silica as main components. The base steel sheet includes the predetermined chemical composition. A BN whose average particle size is 50 to 300 nm is included at a predetermined number density in a region which is from an interface between the glass film and the insulation coating till 5 m toward the base steel sheet in a depth direction. A B emission intensity obtained inside the glass film is more than a B emission intensity obtained inside the base steel sheet, when a B emission intensity is measured from a surface of the insulation coating by a glow discharge emission spectroscopy.
COMPOSITION FOR COATING STAINLESS STEEL AND COOKING APPLIANCE INCLUDING THE SAME
A composition for coating stainless steel includes sodium silicate, lithium silicate, sodium tetraborate, and a solvent as the remainder so that a contaminant on the surface of stainless steel is easily removed and yellowing of the stainless steel can be prevented. A cooking appliance includes the stainless steel surface coated with the composition.
METHOD FOR ANTI-CORROSION TREATMENT OF METALLIC COPPER-CONTAINING MATERIALS
An anticorrosion treatment method for a copper-containing material comprises: carrying out a sealed and pressurized reaction on a copper-containing material and a stabilizer in presence of a polar solvent and any assistant, the stabilizer being a compound capable of providing formates, so that the formates are adsorbed on the surface of the copper-containing material. In the method, formates are modified on the surface of the copper-containing material, accordingly, the oxidation resistance capability and the stability of the copper-containing material can be significantly improved while the electrical conductivity of the copper-containing material is not reduced, and the corrosion resistance of the copper-containing material and especially, the salt and alkali corrosion resistance of the copper-containing material are significantly improved.