A deposition apparatus includes: discharge nozzles arranged at predetermined intervals in a processing compartment in a deposition chamber, wherein each of the discharge nozzles comprises a discharge port that discharges aerosolized particulates toward a corresponding surface treatment object; linear motor single-axis robots arranged at predetermined intervals in a direction perpendicular to a nozzle arrangement direction; and nozzle head units that each adjust a mutual distance between the discharge port and a surface of the corresponding surface treatment object based on a shape of the corresponding surface treatment object, the nozzle head units moving along the nozzle arrangement direction, and the nozzle head units being arranged in each of the linear motor single-axis robots.

A deposition apparatus includes: discharge nozzles arranged at predetermined intervals in a processing compartment in a deposition chamber, wherein each of the discharge nozzles comprises a discharge port that discharges aerosolized particulates toward a corresponding surface treatment object; linear motor single-axis robots arranged at predetermined intervals in a direction perpendicular to a nozzle arrangement direction; and nozzle head units that each adjust a mutual distance between the discharge port and a surface of the corresponding surface treatment object based on a shape of the corresponding surface treatment object, the nozzle head units moving along the nozzle arrangement direction, and the nozzle head units being arranged in each of the linear motor single-axis robots.

The present disclosure relates to a method for forming a parting line in a coating using an easily peelable coating material. The method includes: (i) attaching a masking tape to a part not to be coated on a boundary between a part to be coated and the part not to be coated along the boundary; (ii) performing a process to improve an adhesiveness with an easily peelable coating material on surfaces of a part in contact with the boundary of the part to be coated and/or a part in contact with the boundary of the masking tape; (iii) applying the easily peelable coating material over surfaces of the part to be coated and the part in contact with the boundary of the masking tape; and (iv) peeling off the masking tape.

Processes and apparatus are described for atmospheric pressure plasma jet deposition onto a substrate. The process comprises feeding a solution comprising a dissolved metal precursor into a plasma jet. The dissolved metal precursor comprises a precursor metal selected from Groups 2 to 16, with the proviso that the precursor metal does not comprise Mn. The plasma jet is directed towards a surface of the substrate such that material from the plasma jet becomes deposited onto the surface of the substrate. The process provides a means to manufacture conductive, semiconducting or insulating deposits on a substrate in a material-efficient manner without the need for high-temperature post-treatment steps.

This invention relates to an antimicrobial product containing silver-copper particles and its preparation method. The product includes a substrate and positively charged silver particles with a particle size of 15 μm to 50 μm, and a positively charged copper particle with a particle size of 10 μm to 50 μm, wherein the copper particle size ratio to the silver particle is 0.8 to 1.2. The silver particle, the copper particle and the substrate are combined by means of semi-fused sintering, wherein the ratio of the silver particle to the copper particle is 40:60 to 95:5. The sum of the substrate, the silver particles and the total particles of the copper particles is less than or equal to 10%.

An apparatus and method perform supersonic cold-spraying to deposit N and P-type thermoelectric semiconductor, and other polycrystalline materials on other materials of varying complex shapes. The process developed has been demonstrated for bismuth and antimony telluride formulations as well as Tetrahedrite type copper sulfosalt materials. Both thick and thin layer thermoelectric semiconductor material is deposited over small or large areas to flat and highly complex shaped surfaces and will therefore help create a far greater application set for thermoelectric generator (TEG) systems. This process when combined with other manufacturing processes allows the total additive manufacturing of complete thermoelectric generator based waste heat recovery systems. The processes also directly apply to both thermoelectric cooler (TEC) systems, thermopile devices, and other polycrystalline functional material applications.

An apparatus and method perform supersonic cold-spraying to deposit N and P-type thermoelectric semiconductor, and other polycrystalline materials on other materials of varying complex shapes. The process developed has been demonstrated for bismuth and antimony telluride formulations as well as Tetrahedrite type copper sulfosalt materials. Both thick and thin layer thermoelectric semiconductor material is deposited over small or large areas to flat and highly complex shaped surfaces and will therefore help create a far greater application set for thermoelectric generator (TEG) systems. This process when combined with other manufacturing processes allows the total additive manufacturing of complete thermoelectric generator based waste heat recovery systems. The processes also directly apply to both thermoelectric cooler (TEC) systems, thermopile devices, and other polycrystalline functional material applications.

Various embodiments include a cold gas spraying system for generating an adjustable particle jet. The system may include: a nozzle from which the particle jet emerges; a supply device for supplying a particle stream to the nozzle; and one or more actuators operable to reduce the particle stream and/or the particle jet during operation. At least one of the actuators comprises a valve arranged between the supply device and the nozzle.

Various embodiments include a cold gas spraying system for generating an adjustable particle jet. The system may include: a nozzle from which the particle jet emerges; a supply device for supplying a particle stream to the nozzle; and one or more actuators operable to reduce the particle stream and/or the particle jet during operation. At least one of the actuators comprises a valve arranged between the supply device and the nozzle.

Surface material of a mold molding surface and surface treatment method. A molding surface of material including metal and in which the molding surface reaches 50° C. or higher during molding is subjected to rapid thermal processing by injecting a substantially spherical shot with a hardness equal to or greater than the surface hardness of the mold and a size of #220 (JIS R6001-1973) or smaller at an injection pressure of 0.2 MPa or more and bombarding the surface with the shot, causing the temperature to rise locally and instantaneously at a bombarded portion to refine the surface structure of the surface and to form numerous smooth arc-shaped indentations on the entire surface of the surface. Then, powder including titanium having size of #100 or smaller is injected at an injection pressure of 0.2 MPa or more to form a coating of titanium oxide on the surface of the surface.