A remanufacturing method for a metal part having a damage. The damage groove is divided into a number of levels, and the groove bottom is treated by absorption layer-free laser shock peening to remove surface impurities and to refine surface-layer crystal grains. Then a cladding layer is formed by laser cladding. The process is repeated until the groove is completely filled by the cladding layer to higher than the surface of the metal part and the cladding layer higher than the surface is cut by a mechanical processing and polished, and the upper surface of the laser cladding layer is subjected to large-area overlapped laser shock peening.

Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.

Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.

Novel nanoparticle-coated multilayer shell microstructures are disclosed herein. Some variations of the invention provide a material comprising a plurality of hollow microstructures characterized by an average shortest diameter from about 5 microns to about 1 millimeter, wherein each of the microstructures comprises multiple shells, including at least an inner shell and an outmost shell, with a combined thickness that is less than one-tenth of the average shortest diameter. The inner shell and the outmost shell have different composition. The outmost shell comprises nanoparticles sized between about 10 nanometers to about 500 nanometers, and the nanoparticles each contain an oxide and/or are surrounded by an oxide layer having a layer thickness of at least 1 nanometer. Several microstructure configurations are illustrated in the drawings.

A system for controlling overlapping in single-layer laser cladding of a shaft-like workpiece includes an acceleration time calculation module, a feed shaft displacement calculation module and a module for adjusting an initial zero position of a laser head in a feed direction. Using the system, the motions of the spindle and the feed shaft are planned based on an S-curve acceleration and deceleration method. The motion planning is dynamically adjusted considering the overlapping rate and the clamping allowance of the workpiece to be cladded in a feed direction.

The present invention relates to a method for laser cladding and forming of a metal or alloy under partial atmosphere protection. Including: transporting a metal or alloy powder beam by an inert carrier gas to move on a machined surface with a focused laser beam; and forming at least one layer of inert protective gas at the outer periphery of the metal or alloy powder beam. The inert protective gas includes first inert protective gas, and the first inert protective gas is at the outer periphery of the focused laser beam. The problems of limited size, high cost and difficulty in moving a cladding and forming system and the like during part forming are solved by forming the inert protective gas at the outer periphery of the focused laser beam. Compared with the prior art, the convenient, fast and economical method is provided for on-site part forming and repair.

Process for formation of composite coatings and composite coatings formed thereby. A process for formation of a metal-matrix composite coating on a surface of a substrate is provided. The substrate is an aluminum alloy. The metal-matrix composite coating is formed on the substrate through laser deposition using filler materials comprising aluminum, silicon and graphite. The particles forming the metal-matrix composite coating are formed in-situ from the filler materials. A metal-matrix composite coating obtained by the laser deposition process with in-situ formation of particles is also provided.

Process for formation of composite coatings and composite coatings formed thereby. A process for formation of a metal-matrix composite coating on a surface of a substrate is provided. The substrate is an aluminum alloy. The metal-matrix composite coating is formed on the substrate through laser deposition using filler materials comprising aluminum, silicon and graphite. The particles forming the metal-matrix composite coating are formed in-situ from the filler materials. A metal-matrix composite coating obtained by the laser deposition process with in-situ formation of particles is also provided.

Thermal barrier materials are provided that possess low heat capacity and low thermal conductivity, while at the same time, high structural integrity and robustness. In some embodiments, the disclosed coating comprises metal-containing spheres that are sintered or glued together and/or embedded in a matrix. The coating has at least 60% void volume fraction and closed porosity. The coating thickness is from 50 microns to 500 microns, and the metal spheres have an average diameter that is from about 5% to about 30% of the coating thickness. In some embodiments, the metal spheres have an average diameter that is 4-10 times smaller than the coating thickness. Thermal barrier materials with these coatings can be beneficial in engine applications, for example.

A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy contains Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.