A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 μm to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

The present invention has as its object the provision of a coated steel member and coated steel sheet excellent in hydrogen embrittlement resistance in a corrosive environment and methods for manufacturing the same. The coated steel member of the present invention is provided on its surface with an Al—Fe-based coating containing Cu and one or more of Mo, Ni, Mn, and Cr in a total by mass % of 0.12% or more by heating, cooling, and manufacturing a coated steel sheet having a layer containing Cu on its surface under predetermined conditions.

The present application discloses a manufacturing method for a gate electrode and a thin film transistor, and a display panel, including: depositing an aluminum film on a substratum by physical vapor deposition; depositing a molybdenum film over the aluminum film by atomic layer deposition; and etching the aluminum film and the molybdenum film to form the gate electrode of a predetermined pattern.

There are provided a press-fit terminal which has an excellent whisker resistance and a low inserting force, is unlikely to cause shaving of plating when the press-fit terminal is inserted into a substrate, and has a high heat resistance, and an electronic component using the same. A press-fit terminal comprises: a female terminal connection part provided at one side of an attached part to be attached to a housing; and a substrate connection part provided at the other side and attached to a substrate by press-fitting the substrate connection part into a through-hole formed in the substrate. At least the substrate connection part has the surface structure described below, and the press-fit terminal has an excellent whisker resistance. The surface structure comprises: an A layer formed as an outermost surface layer and formed of Sn, In, or an alloy thereof; a B layer formed below the A layer and constituted of one or two or more selected from the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and a C layer formed below the B layer and constituted of one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu. The A layer has a thickness of 0.002 to 0.2 μm. The B layer has a thickness of 0.001 to 0.3 μm. The C layer has a thickness of 0.05 μm or larger.

[Object] Provided are an electrode substrate film in which a circuit pattern formed of a metal thin line is less visible even under highly bright illumination, and a laminate film applied to the same.

[Solving Means] An electrode substrate film with a transparent substrate 52 and a metal laminate thin line includes a metal absorption layer 51 with a film thickness of 20 nm to 30 nm inclusive as a first layer, and a metal layer 50 as a second layer, counted from the transparent substrate side, the laminate thin line having a line width of 20 μm or less. Optical constants of the metal absorption layer in a visible wavelength range (400 to 780 nm) satisfy conditions that a refractive index is 2.0 to 2.2 and an extinction coefficient is 1.8 to 2.1 at a wavelength of 400 nm, the refractive index is 2.4 to 2.7 and the extinction coefficient is 1.9 to 2.3 at a wavelength of 500 nm, the refractive index is 2.8 to 3.2 and the extinction coefficient is 1.9 to 2.5 at a wavelength of 600 nm, the refractive index is 3.2 to 3.6 and the extinction coefficient is 1.7 to 2.5 at a wavelength of 700 nm, and the refractive index is 3.5 to 3.8 and the extinction coefficient is 1.5 to 2.4 at a wavelength of 780 nm. An average reflectance in the visible wavelength range attributed to reflection at an interface between the transparent substrate and the metal absorption layer is 20% or less, and a difference between a highest reflectance and a lowest reflectance in the visible wavelength range is 10% or less.

A coated steel sheet including a steel sheet and a coating layer provided on at least part of the surface of the steel sheet, in which the coating layer has a predetermined chemical composition in terms of % by mass, and the coating layer has a granular Mg.sub.2Sn phase-containing structure in an area fraction of from 5 to 65%, and a structure containing a solid solution of Zn and Al, and the granular Mg.sub.2Sn phase-containing structure is a structure constituted with a Zn phase and a granular Mg.sub.2Sn phase having a crystal grain size of less than 1 μm dispersed in the Zn phase.

An article may include a substrate, a diffusion barrier layer formed on the substrate, and a protective layer formed on the diffusion barrier coating. The diffusion barrier layer may include iridium.

The present invention relates to a method for manufacturing an internal antenna (intenna) and, in particular, to a method for manufacturing an intenna, which allows a resin molded product to be smoothly and securely plated with a metal by applying a primer paint on the surface of the resin molded product, and thereby improves the reliability of the metal plating formed on the resin molded product.

Zn alloy plated steel material having excellent weldability and processed-part corrosion resistance and a method for production of Zn alloy plated steel material are provided. In the Zn alloy plated steel material comprising base steel material and a Zn alloy plating layer, the Zn alloy plating layer includes, by wt %, Al: 0.1-5.0%, Mg: 0.1-5.0%, as well as a remainder of Zn and inevitable impurities. The Zn alloy plated steel material includes a lower interface layer and an upper interface layer between the base steel material and the Zn alloy plating layer, wherein the lower interface layer is formed on the base steel material and has a dense structure, and the upper interface layer is formed on the lower interface layer and has a network-type or island-type structure.

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.