Method for producing metallic surface discharge electrodes on nonmetallic substrates comprising the following steps: a) producing a metallic seed layer on a substrate; b) electrically contacting the seed layer with a metal wire network and an electrolyte containing metal ions; c) electrodepositing a metal film from the electrolyte at least on the seed layer, with the metal wire network being embedded into the metal film, wherein d) metal wire filaments that are movable relative to one another are arranged to form an electrically percolating metal wire network, e) the arrangement of the metal wire filaments is cast into a gel and the gel is dried thereafter to the gel matrix, and f) the dried gel matrix with the metal wire network embedded therein is applied to the substrate and is wetted with a solvent of the gel matrix. Furthermore, the invention relates to a semifinished product for carrying out the method.

The present invention provides an iron-aluminum-based plated steel sheet, and a manufacturing method therefor, the iron-aluminum-based plated steel sheet comprising a base steel sheet and a plated layer formed on the surface of the base steel sheet, wherein the alloy plated layer comprises: a diffusion layer comprising an Fe—Al-based intermetallic compound having a cubic structure; and an alloyed layer formed on the diffusion layer and composed of an alloy phase differing from that of the cubic structure, the thickness of the diffusion layer is 3-20 μm, and the thickness of the diffusion layer is greater than 50% of the total thickness of the plated layer.

A brake disk, the main body of which has been produced from gray cast iron, is coated on its annular brake surfaces with a metallic coating by way of laser deposition welding. In the coating, which includes a welding material with an austenitic structure or at least structural components, a state of internal compressive stress is set by plastic deformation which affects the external outer layer thereof and in one form is performed by a rolling tool.

A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.

A copper-coated steel wire includes a core wire made of a steel, and a coating layer made of copper or a copper alloy and covering an outer peripheral surface of the core wire. In a cross section perpendicular to a longitudinal direction of the core wire, the core wire includes a plurality of oxide regions composed of an oxide of an element contained in the steel constituting the core wire, the oxide regions including the outer peripheral surface of the core wire and being disposed apart from each other in a circumferential direction of the core wire.

A laminate including a metallic base material, a first nickel-containing plating film layer formed on the metallic base material, a gold plating film layer formed on the first nickel-containing plating film layer, a second nickel-containing plating film layer formed on the gold plating film layer, and a nickel fluoride film layer formed on the second nickel-containing plating film layer. Also disclosed is a method for producing the laminate as well as a constituent member of a semiconductor production device including the laminate.

Provided in one embodiment of the present disclosure is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 MPa on the basis of the absolute value thereof, wherein the copper layer comprises copper and carbon (C), the amount of carbon (C) in the copper layer is 2-20 ppm, the copper layer has a plane (111), a plane (200), a plane (220) and a plane (311) including crystalline particles, the ratio of the diffraction intensity of the plane (220) to the sum of the diffraction intensities of the plane (111), the plane (200), the plane (220) and the plane (311) is 10-40%, and the crystalline particles of the plane (220) have an average particle size of 70-120 nm at room temperature.

Disclosed is a steel sheet for hot press forming, which includes: a base steel sheet; and a plating layer disposed on the base steel sheet and including a diffusion layer and a surface layer that are sequentially laminated, wherein the diffusion layer includes an Fe—Al alloy layer and an Fe—Al intermetallic compound layer that are sequentially disposed on the base steel sheet and each include silicon, and an area fraction of the Fe—Al intermetallic compound layer with respect to the diffusion layer is 84.5% to 98.0%.

Provided is a multilayer zinc alloy plated steel material comprising a base steel material and multiple plating layers formed on the base steel material, wherein each of the multiple plating layers includes one of a Zn plating layer, a Mg plating layer, and a Zn—Mg alloy plating layer, and the ratio of the weight of Mg contained in the multiple plating layers to the total weight of the multiple plating layers is from 0.13 to 0.24.