A plated steel sheet includes: a steel sheet; and a plating layer that is formed on at least a part of a surface of the steel sheet, in which a chemical composition of the plating layer includes, by mass %, Al: more than 5.00% and 35.00% or less, Mg: 3.00% to 15.00%, Si: 0% to 2.00%, Ca: 0% to 2.00%, and a remainder of Zn and impurities, in which in a cross section of the plating layer in a thickness direction, the area ratio of a lamellar structure in which an (Al—Zn) phase and a MgZn.sub.2 phase are arranged in layers is 10% to 90%, a lamellar spacing of the lamellar structure is 2.5 μm or less, and the area ratio of an (Al—Zn) dendrite is 35% or less.

A plated steel sheet having excellent chemical convertibility includes: a steel; and a plating layer that is provided on a surface of the steel, in which the plating layer includes, by mass %, Al: 5.00% to 35.00%, Mg: 2.50% to 13.00%, Fe: 5.00% to 35.00%, Si: 0% to 2.00%, Ca: 0.03% to 2.00%, and a remainder consisting of Zn and impurities, and in a surface of the plating layer, the area fraction of a Fe—Al phase is 0% to 30%, the area fraction of a rod-like lamellar structure of Zn and MgZn.sub.2 is 5% to 90%, the area fraction of a massive MgZn.sub.2 phase is 10% to 70%, and the area fraction of a remainder is 10% or less.

Provided is a steel sheet for a hot press formed member having excellent resistance to hydrogen delayed fracture, and a method for manufacturing the same. A steel sheet for a hot press formed member comprises: a base steel sheet; an aluminum alloy plating layer on a surface of the base steel sheet; and an oxide layer which is formed on a surface of the plating layer and has a thickness of 0.05 μm or more.

A method for producing a wiring board according to the present disclosure includes: (A) forming a first insulating material layer on a supporting substrate; (B) forming a first opening part in the first insulating material layer; (C) forming a seed layer on the first insulating material layer; (D) providing a resist pattern on a surface of the seed layer; (E) forming a wiring part including a pad and wiring; (F) removing the resist pattern; (G) removing the seed layer; (H) applying a first surface treatment to the surface of the pad; (I) forming a second insulating material layer; (J) forming a second opening part in the second insulating material layer; (K) applying a second surface treatment to the surface of the pad; and (L) heating the second insulating material layer to a temperature equal to or higher than the glass transition temperature of the second insulating material layer.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

A circuit board has a dielectric core, a foil top surface, and a thin foil bottom surface with a foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surface during laser drilling. A sequence of steps including a laser drilling step, removing the foil backing step, electroless plating step, patterned resist step, electroplating step, resist strip step, tin plate step, and copper etch step are performed, which provide dot vias of fine linewidth and resolution.

A plated steel sheet having excellent chemical convertibility includes: a steel; and a plating layer that is provided on a surface of the steel, in which the plating layer includes, by mass %, Al: 5.00% to 35.00%, Mg: 2.50% to 13.00%, Fe: 5.00% to 35.00%, Si: 0% to 2.00%, Ca: 0.03% to 2.00%, and a remainder consisting of Zn and impurities, and in a surface of the plating layer, the area fraction of a Fe—Al phase is 0% to 30%, the area fraction of a rod-like lamellar structure of Zn and MgZn.sub.2 is 5% to 90%, the area fraction of a massive MgZn.sub.2 phase is 10% to 70%, and the area fraction of a remainder is 10% or less.

A plated steel includes: a steel; and a plating layer that is provided on a surface of the steel, in which the plating layer includes, by mass %, Al: 5.00% to 35.00%, Mg: 2.50% to 13.00%. Fe: 5.00% to 40.00%, Si: 0% to 2.00%, Ca: 0% to 2.00%, and a remainder of Zn and impurities, and in a cross section of the plating layer, the area fraction of a Zn solid-solution Fe.sub.2Al.sub.5 phase in which 5% or more of Zn is solid-soluted is 10% to 60% and the area fraction of a MgZn.sub.2 phase is 10% to 90%.

A manufacturing method of a textured and coated electrode wire, comprising: selecting a copper-zinc alloy as a core material, preparing, by means of electroplating/hot-dipping, a metal zinc coating on a surface of the wire material, then performing pre-treatment on the coated electrode wire by means of discontinuous diffusion annealing to obtain a coated electrode wire material having a multi-layer structure of Zn/β-brass & γ-brass/α-brass, and then using multiple cold drawing treatments and a stress-relief annealing treatment to modify the electrode wire and obtain a textured and coated electrode wire material. Compared to conventional copper alloy electrode wires and zinc-coated electrode wires, the material has advantages of a fast cutting speed, low cutting cost, low environmental pollution, etc., wherein the cutting speed increases by 12% or more when compared with copper alloy electrode wire, the wire breakage rate during cutting processes decreases by 30%, and the replacement time interval of an ion-exchange resin filter for cooling water increases by 10%.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).